会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 54. 发明授权
    • Resistor and structure for mounting same
    • 电阻和结构用于安装相同
    • US09437352B2
    • 2016-09-06
    • US14383961
    • 2013-03-25
    • KOA CORPORATION
    • Kenji KamekoKoichi Hirasawa
    • H01C1/14H01C1/142H01C1/144H01C17/28
    • H01C1/14H01C1/142H01C1/144H01C17/283
    • Provided is a resistor for current detection, wherein connection failure etc. due to electro-migration is prevented from being generated in state that the resistor is mounted on a mounting board. The resistor has a resistance body (11) and electrodes (12). The electrode (12) includes first electrode portion (12a) connected to the resistance body (11) and second electrode portion (12b) formed on the first electrode portion (12a). The second electrode portion (12b) consists of material having higher resistivity than the first electrode portion (12a) and solder, which is used for mounting the resistor on the mounting board.
    • 提供了一种用于电流检测的电阻器,其中防止在电阻器安装在安装板上的状态下由于电迁移而导致的连接故障等。 电阻器具有电阻体(11)和电极(12)。 电极(12)包括连接到电阻体(11)的第一电极部分(12a)和形成在第一电极部分(12a)上的第二电极部分(12b)。 第二电极部分(12b)由电阻率高于第一电极部分(12a)的电阻和用于将电阻器安装在安装板上的焊料构成。
    • 55. 发明申请
    • Chip-Resistor Manufacturing Method
    • 芯片电阻制造方法
    • US20160163433A1
    • 2016-06-09
    • US14905459
    • 2014-07-09
    • KOA CORPORATION
    • Yuya TAKEUETodaro UEGANEKentaro MATSUMOTO
    • H01C17/28H01C17/22H01C17/06
    • H01C17/28H01C17/006H01C17/06H01C17/22H01C17/242
    • The invention is to provide a chip-resistor manufacturing method in which chipping can be restrained from occurring in an intersection portion between each primary segmentation groove and each secondary segmentation groove. Primary segmentation grooves 21 each having an uneven depth are formed in one surface of a large substrate 20. Pairs of surface electrodes 3 extending across the primary segmentation grooves 21, resistive elements 5 each striding between the surface electrodes 3 paired with each other, etc. are formed in the one surface of the large substrate 20. Then, primary segmentation is performed on the large substrate 20 along the primary segmentation grooves 21 so as to open the surface side where the surface electrodes 3, the resistive elements 5, etc. are formed. Thus, a plurality of strip-like substrates 30 are obtained from the large substrate 20. During the primary segmentation, each primary segmentation groove 21 begins to break from electrode formation regions which are small in groove depth but strong, and then breaks in intersection portions which are large in groove depth but brittle. Accordingly, it is possible to perform primary segmentation on the primary segmentation groove 21 without applying a large load to the intersection portions which are low in strength. Thus, it is possible to prevent chipping from occurring in the intersection portions.
    • 本发明是提供一种芯片电阻器制造方法,其中可以抑制在每个主分割槽和每个二次分割槽之间的交叉部分发生碎裂。 每个具有不均匀深度的主分割槽21形成在大基板20的一个表面中。一对表面电极3延伸穿过主分割凹槽21,电阻元件5各自跨越彼此配对的表面电极3等。 形成在大基板20的一个表面上。然后,沿着主分割槽21对大基板20进行主分割,以便打开表面电极3,电阻元件5等的表面侧 形成。 因此,从大基板20获得多个条状基板30.在主分割期间,每个主分割凹槽21开始从凹槽深度小但较强的电极形成区域断裂,然后在交叉部分中断 其深度大,但脆。 因此,可以对主分割槽21进行主分割,而不对强度低的交点进行大的负载。 因此,可以防止在交叉部分发生切屑。
    • 58. 发明授权
    • Resistor and method for making same
    • 电阻及其制作方法
    • US09251936B2
    • 2016-02-02
    • US14228780
    • 2014-03-28
    • Vishay Dale Electronics, LLC
    • Clark L. SmithThomas L. BertschTodd L. WyattThomas L. VeikRodney Brune
    • H01C1/02H01C1/142H01C3/00H01C17/24H01C17/00H01C17/28
    • H01C17/003H01C1/142H01C3/00H01C17/24H01C17/288Y10T29/49082Y10T29/49098
    • A metal strip resistor is provided. The metal strip resistor includes a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate. There are first and second opposite terminations overlaying the metal strip. There is plating on each of the first and second opposite terminations. There is also an insulating material overlaying the metal strip between the first and second opposite terminations. A method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided. The method includes coating an insulative material to the metal strip, applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations, electroplating the conductive pattern, and adjusting resistance of the metal strip.
    • 提供金属条电阻。 金属带状电阻器包括形成电阻元件的金属条,并且在不使用单独基板的情况下为金属带状电阻器提供支撑。 存在覆盖金属条的第一和第二相对端子。 每个第一和第二相对端子上都有电镀。 还有在第一和第二相对端子之间覆盖金属​​带的绝缘材料。 提供一种用于形成金属带状电阻器的方法,其中金属带为不使用单独基板的金属带状电阻器提供支撑。 该方法包括将绝缘材料涂覆到金属条上,施加光刻工艺以形成覆盖电阻材料的导电图案,其中导电图案包括第一和第二相对端子,电镀导电图案,以及调整金属带的电阻。