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1. 发明授权

US10074465B2 Method of manufacturing electronic component, and electronic component 有权
公开(公告)号：US10074465B2
公开(公告)日：2018-09-11
申请号：US15611826
申请日：2017-06-02
申请人： Murata Manufacturing Co., Ltd.
发明人： Yuichi Hirata , Noboru Furukawa , Yasuo Sasaki , Kiyohiro Koto , Kojiro Tokieda , Yukiko Ueda
IPC分类号： H01C7/10 , H01C7/04 , H01C17/245 , H01C1/142 , H01C17/28
CPC分类号： H01C7/041 , H01C1/142 , H01C1/148 , H01C7/18 , H01C17/245 , H01C17/281
摘要： A method of manufacturing an electronic component includes manufacturing a ceramic element including one pair of end surfaces and four side surfaces, forming external electrodes at both end portions of the ceramic element, measuring an initial characteristic value, determining any side surface to be machined among the four side surfaces and then determining, based on stored data, an amount of machining to be performed on the side surface to be machined, and machining, by the determined machining amount, the side surface of the ceramic element, which is determined to be machined, to be flush or substantially flush with the external electrodes.

2. 发明授权

US10062512B2 Multilayer ceramic electronic component 有权
公开(公告)号：US10062512B2
公开(公告)日：2018-08-28
申请号：US15488562
申请日：2017-04-17
申请人： Murata Manufacturing Co., Ltd.
发明人： Yasuharu Yamashita
IPC分类号： H01G4/232 , H01G4/30 , H01F27/28 , H01C7/00 , H01F27/29 , H01G4/12 , H01F17/00
CPC分类号： H01G4/2325 , H01C1/148 , H01C7/008 , H01C7/18 , H01F17/0013 , H01F27/2804 , H01F27/292 , H01F2027/2809 , H01G4/1218 , H01G4/30
摘要： A multilayer ceramic electronic component has a dimension in a longitudinal direction of no less than about 0.12 mm and no more than about 0.27 mm, a dimension in a width direction of no less than about 0.06 mm and no more than about 0.14 mm, and a dimension in a lamination direction of no less than about 0.06 mm and no more than about 0.14 mm, for example. Each of a first outer electrode and a second outer electrode includes an underlying electrode layer disposed on a surface of a multilayer body, a nickel-plated layer covering the underlying electrode layer, and a tin-plated layer covering the nickel-plated layer. The nickel-plated layer in each of the first outer electrode and second outer electrode has surface roughness of no less than about 3 μm and no more than about 6 μm, for example.

3. 发明申请

US20170316853A1 Chip Resistor 审中-公开
公开(公告)号：US20170316853A1
公开(公告)日：2017-11-02
申请号：US15523019
申请日：2015-08-25
申请人： KOA Corporation
发明人： Kentaro MATSUMOTO
IPC分类号： H01C1/142 , H01C17/242 , H01C17/00 , H01C17/28 , H01C1/012
CPC分类号： H01C1/142 , H01C1/012 , H01C1/032 , H01C1/148 , H01C7/18 , H01C17/006 , H01C17/242 , H01C17/281
摘要： To provide a chip resistor in which a resistive element can be surely protected from an external environment and which is also excellent in corrosion resistance, a chip resistor 1 is configured to include an insulating substrate 2, a pair of front electrode 3 provided on opposite end portions of a front surface of the insulating substrate 2, a pair of back electrodes 7 provided on opposite end portions of a back surface of the insulating substrate 2, a resistive element 4 provided to extend onto the two front electrodes 3, a first insulating layer 5 covering the resistive element 4, a second insulating layer 6 made of a resin material to cover the first insulating layer 5, end surface electrodes 8 establishing electrical continuity between the front electrodes 3 and the back electrodes 7, plating layers 9 covering the end surface electrodes 8, etc. Rough surface portions 6a made rougher in surface roughness than any other portion of the second insulating layer 6 are formed at opposite end portions of the second insulating layer 6. End portions of the end surface electrodes 8 and the plating layers 9 are brought into tight contact with the rough surface portions 6a respectively.

4. 发明申请

US20170278626A1 COMPOSITE ELECTRONIC COMPONENT 审中-公开
公开(公告)号：US20170278626A1
公开(公告)日：2017-09-28
申请号：US15274550
申请日：2016-09-23
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Ho Yoon KIM
IPC分类号： H01F27/40 , H01G4/248 , H01C1/148 , H01F27/29 , H01C7/00 , H01G4/005 , H01F27/28
CPC分类号： H01F27/402 , H01C1/06 , H01C1/148 , H01C7/008 , H01C7/18 , H01F17/0013 , H01F27/29 , H01F27/292 , H01G2/14 , H01G4/248 , H01G4/30
摘要： A composite electronic component includes a body having first and second external electrodes disposed on outer surfaces thereof and including a dielectric body; first and second electrodes disposed in the dielectric body and electrically connected to the first and second external electrodes, respectively; a third electrode disposed on the body and electrically connected to the first external electrode; an electrostatic discharge (ESD) layer disposed on the third electrode; and a fourth electrode disposed on the ESD discharge layer and electrically connected to the second external electrode.

5. 发明申请

US20170092556A1 METHODS AND SYSTEMS TO IMPROVE PRINTED ELECTRICAL COMPONENTS AND FOR INTEGRATION IN CIRCUITS 审中-公开
公开(公告)号：US20170092556A1
公开(公告)日：2017-03-30
申请号：US15376729
申请日：2016-12-13
申请人： VQ RESEARCH, INC.
发明人： John L. Gustafson
IPC分类号： H01L23/055 , H01L23/00 , H01L23/498 , H01L21/48 , H05K1/02 , H01G4/30 , H05K3/12 , H05K3/22 , G06F17/50 , H01F27/28 , H01F27/24 , H01C7/18 , H01L23/15 , H01L23/60
CPC分类号： H01L23/055 , G06F17/5072 , G06F17/5081 , H01C7/18 , H01F27/24 , H01F27/2804 , H01G4/005 , H01G4/012 , H01G4/1227 , H01G4/232 , H01G4/30 , H01L21/4807 , H01L21/4846 , H01L23/15 , H01L23/49816 , H01L23/49838 , H01L23/60 , H01L24/16 , H01L2224/131 , H01L2224/16227 , H01L2224/73253 , H01L2924/15311 , H01L2924/15787 , H01L2924/16251 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/3025 , H05K1/0218 , H05K1/162 , H05K1/165 , H05K1/167 , H05K3/1283 , H05K3/227 , H01L2924/014 , H01L2924/00014
摘要： Methods and systems to improve printed electrical components and for integration in circuits are disclosed. Passive components, e.g., capacitors, resistors and inductors, can be printed directly into a solid ceramic block using additive manufacturing. A grounded conductive plane or a conductive cage may be placed between adjacent electrical components, or around each component, to minimize unwanted parasitic effects in the circuits, such as, e.g., parasitic capacitance or parasitic inductance. Resistors may be printed in non-traditional shapes, for example, S-shape, smooth S-shape, U-shape, V-shape, Z-shape, zigzag-shape, and any other acceptable alternative configurations. The flexibility in shapes and sizes of the printed resistors allows optimal space usage of the ceramic block. The present invention also discloses an electrical component comprising combined predetermined values of capacitance, resistance and inductance. The integration and adjustability of a multi-property device can provide significant advantages in electronics manufacturing.

6. 发明申请

US20170064834A1 COLLECTIVE SUBSTRATE FOR RESISTOR DEVICES 有权
标题翻译：用于电阻器件的集成基板
公开(公告)号：US20170064834A1
公开(公告)日：2017-03-02
申请号：US15239943
申请日：2016-08-18
申请人： Murata Manufacturing Co., Ltd.
发明人： Kazuo HATTORI , Isamu FUJIMOTO , Shinichiro KUROIWA
IPC分类号： H05K1/18 , H01G4/12 , H05K1/02 , H01C7/00 , H01C1/01 , H01G4/30 , H01G4/248
CPC分类号： H05K1/181 , H01C1/01 , H01C1/014 , H01C1/142 , H01C1/148 , H01C7/008 , H01C7/18 , H01G2/065 , H01G4/12 , H01G4/232 , H01G4/248 , H01G4/30 , H05K1/0296 , H05K2201/0909 , H05K2201/10015 , H05K2201/10022 , H05K2201/1003
摘要： A collective substrate for resistor devices includes a base, a first conductive pattern in a to-be-product region and a to-be-cut-away region of the base, and a resistive element in the to-be-product region of the base. The to-be-cut-away region includes a first region adjacent to the to-be-product region in a first direction, and a second region adjacent to the to-be-product region in a second direction. The first conductive pattern includes a first terminal portion connected to the resistive element and disposed in the to-be-product region, a first electrode portion disposed in the first region and larger in area than the first terminal portion, and a first interconnect portion extended from the first terminal portion toward the second region to be connected to the first electrode portion.
摘要翻译：用于电阻器件的集合衬底包括基底，待产品区域中的第一导电图案和基底的待切割区域，以及在待产品区域中的电阻元件基础。待切割区域包括与第一方向上的待产品区域相邻的第一区域和与第二方向上的待产品区域相邻的第二区域。第一导电图案包括连接到电阻元件并设置在产品区域中的第一端子部分，设置在第一区域中的第一电极部分和比第一端子部分大的区域，以及第一互连部分延伸从第一端子部分朝向与第一电极部分连接的第二区域。

7. 发明申请

US20170006741A1 ELECTRONIC COMPONENT AND USE THEREOF 审中-公开
标题翻译：电子元件及其应用
公开(公告)号：US20170006741A1
公开(公告)日：2017-01-05
申请号：US15100283
申请日：2014-11-25
申请人： EPCOS AG
发明人： Oliver DERNOVSEK , Thomas FEICHTINGER
IPC分类号： H05K9/00 , H01G4/224 , H01L33/60 , H01L41/053 , H01C1/06 , H01L25/16 , H01G2/22 , H01L23/552
CPC分类号： H05K9/0081 , H01C1/06 , H01C7/02 , H01C7/04 , H01C7/10 , H01C7/18 , H01G2/22 , H01G4/224 , H01G4/30 , H01L23/552 , H01L25/167 , H01L33/60 , H01L41/0533 , H01L2224/0401 , H01L2224/16225 , H01L2924/10252 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/15311 , H01L2924/15313
摘要： What is specified is an electronic component (100) comprising a functional body (1) provided with a reflection structure (2) wherein the reflection structure (2) is arranged and designed to reflect radiation that impinges on the electronic component (100) from outside away from the functional body (1) and wherein the electronic component (100) is radiation-passive.
摘要翻译：指定的是包括设置有反射结构（2）的功能体（1）的电子部件（100），其中反射结构（2）被布置和设计成从外部反射照射在电子部件（100）上的辐射远离功能体（1）并且其中电子部件（100）是辐射 - 被动的。

8. 发明申请

US20160351333A1 ELECTRONIC COMPONENT 有权
标题翻译：电子元件
公开(公告)号：US20160351333A1
公开(公告)日：2016-12-01
申请号：US15142530
申请日：2016-04-29
申请人： TDK CORPORATION
发明人： Norihisa ANDO , Sunao MASUDA , Masahiro MORI , Kayou KUSANO
IPC分类号： H01G4/30 , H01C7/02 , H01C7/00 , H01G4/12
CPC分类号： H01G4/40 , H01C7/02 , H01C7/021 , H01C7/18 , H01G2/14 , H01G4/232 , H01G4/258
摘要： A first metal terminal includes a first connection portion connected to an electrode portion of a second external electrode, and a first leg portion extending from the first connection portion. A second metal terminal includes a second connection portion connected to a conductor portion of a connection conductor, and a second leg portion extending from the second connection portion. A multilayer capacitor and an overcurrent protection device are disposed in such a manner that a side surface on which an electrode portion of a first external electrode is disposed and a side surface of a second element body oppose each other. The electrode portion of the first external electrode and a fourth external electrode are connected to each other, and the connection conductor and a third external electrode are connected to each other.
摘要翻译：第一金属端子包括连接到第二外部电极的电极部分的第一连接部分和从第一连接部分延伸的第一腿部部分。第二金属端子包括连接到连接导体的导体部分的第二连接部分和从第二连接部分延伸的第二支腿部分。多层电容器和过电流保护器件以这样的方式设置，使得设置第一外部电极的电极部分的侧表面和第二元件体的侧表面彼此相对。第一外部电极的电极部分和第四外部电极彼此连接，并且连接导体和第三外部电极彼此连接。

9. 发明授权

US09357634B2 Coefficient of thermal expansion compensating compliant component 有权
标题翻译：热膨胀系数适应元件
公开(公告)号：US09357634B2
公开(公告)日：2016-05-31
申请号：US13870414
申请日：2013-04-25
申请人： KEMET Electronics Corporation
发明人： John E. McConnell , Alan P. Webster , John Bultitude , Abhijit Gurav
IPC分类号： H05K7/04 , H01L23/49 , H05K1/02 , H05K3/30 , H01G4/38 , H01C1/014 , H01C1/14 , H01C7/18 , H01G2/06 , H01G4/232 , H05K1/18
CPC分类号： H05K1/0271 , H01C1/014 , H01C1/14 , H01C7/18 , H01G2/06 , H01G4/232 , H01G4/38 , H05K1/181 , H05K1/182 , H05K3/30 , H05K3/301 , H05K2201/049 , H05K2201/10015 , H05K2201/10454 , Y10T29/49121
摘要： An improved discrete electronic device and method of making the improved discrete electronic device is described. The discrete electronic device has an electronic passive component with a termination and a lead frame. A compensating compliant component is between the termination and the lead frame. The compensating compliant component has a composite core and a first conductor on the composite core. The first conductor is in electrical contact with the termination. A second conductor is also on the composite core wherein the second conductor is in electrical contact with the lead frame.
摘要翻译：描述了一种改进的离散电子设备和制造改进的分立电子设备的方法。分立的电子设备具有带终端和引线框架的电子无源部件。补偿兼容部件在终端和引线框架之间。补偿柔性部件具有复合芯和复合芯上的第一导体。第一个导线与端子电接触。第二导体也在复合芯上，其中第二导体与引线框架电接触。

10. 发明授权

US09343234B2 Monolithic ceramic electronic component 有权
标题翻译：单片陶瓷电子元件
公开(公告)号：US09343234B2
公开(公告)日：2016-05-17
申请号：US14228331
申请日：2014-03-28
申请人： Murata Manufacturing Co., Ltd.
发明人： Takehisa Sasabayashi , Akihiro Motoki , Makoto Ogawa
IPC分类号： H01G4/30 , H01C1/148 , H01C7/18 , H01F17/00 , H01G4/012 , H01G4/232 , H01L41/047 , H01F27/29 , H01C7/00
CPC分类号： H01G4/30 , H01C1/148 , H01C7/008 , H01C7/18 , H01F17/0013 , H01F27/292 , H01G4/012 , H01G4/232 , H01G4/2325 , H01L41/0471 , H01L41/0472
摘要： A monolithic ceramic electronic component includes an outer electrode including a first plating layer formed directly on a component body by electroless plating so as to cover an exposed portion distribution region including exposed portions of a plurality of inner electrodes and a second plating layer formed by electrolytic plating so as to cover the first plating layer. An amount of extension of the first plating E1 and an amount of extension of the second plating E2 satisfy the relationship E1/(E1+E2)≦20%, where E1 represents a distance from an edge of the exposed portion distribution region to an edge of the first plating layer, and E2 represents a distance from the edge of the first plating layer to an edge of the second plating layer.
摘要翻译：单片陶瓷电子部件包括外电极，其包括通过化学镀直接形成在部件主体上的第一镀层，以覆盖包括多个内电极的暴露部分的暴露部分布区域和由电解电镀形成的第二镀层以覆盖第一镀层。第一电镀E1的延伸量和第二电镀E2的延伸量满足关系E1 /（E1 + E2）＆nlE; 20％，其中E1表示从暴露部分布区域的边缘到第一镀层的边缘，E2表示从第一镀层的边缘到第二镀层的边缘的距离。

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