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    • 61. 发明授权
    • Double poly trenched channel accelerated tunneling electron (DPT-CATE)
cell, for memory applications
    • 双沟槽通道加速隧道电子(DPT-CATE)单元,用于存储器应用
    • US5506431A
    • 1996-04-09
    • US243507
    • 1994-05-16
    • Mammen Thomas
    • Mammen Thomas
    • H01L29/423H01L29/788H01L29/78G11C13/00
    • H01L29/7885H01L29/4232
    • A structure for low voltage, high density, non-volatile memory cell, with ability to write electrically using the CACT or Channel Accelerated Carrier Tunneling method for programming memories and erase electrically by tunneling, having separate regions for write and erase for high reliability, is described. These cells have the ability to write by transferring charge to the storage gate using the majority carriers in the channel of the MOS transistor, eliminating the need for generation of high fields needed for the hot electron EPROM write method used in the prior art flash memories. In addition the use of the carrier velocity to enhance the write process reduce the need for the high write -voltages on the gates as compared to the present EEPROM and EPROM write memories.
    • 一种用于低电压,高密度,非易失性存储单元的结构,具有使用CACT或通道加速载波隧道方式进行电气写入的能力,用于通过隧道编程存储器和电擦除,具有用于写入和擦除的独立区域以实现高可靠性, 描述。 这些单元具有通过使用MOS晶体管的通道中的多数载流子将电荷转移到存储栅来写入的能力,从而无需生成现有技术闪存中使用的热电子EPROM写入方法所需的高场。 此外,与当前的EEPROM和EPROM写入存储器相比,使用载波速度来增强写入过程减少了对门上的高写入电压的需要。
    • 62. 发明授权
    • Very high density wafer scale device architecture
    • 非常高密度的晶圆秤设备架构
    • US5252507A
    • 1993-10-12
    • US502898
    • 1990-03-30
    • James W. HivelyMammen ThomasRichard L. Bechtel
    • James W. HivelyMammen ThomasRichard L. Bechtel
    • G01R31/317G11C5/02G11C11/401G11C29/00G11C29/04H01L21/66H01L21/82H01L21/8242H01L27/02H01L27/10H01L27/108H01L21/70
    • H01L27/0207G11C29/006G11C5/025
    • This invention relates to the design and manufacture of a wafer-size integrated circuit. Lower layers of the wafer sized integrated circuit comprise electrically isolated repeating blocks such as logic elements or blocks of circuit elements. An upper conductive layer comprises data and address bus structures. A discretionary via layer located between the upper layer and the lower layers can be patterned to accomplish multiple purposes. Patterning of the via layer avoids connecting the bus structure to defective elements or blocks, establishes addresses of elements, and establishes the organization of the addressing structure and data structure (for a memory wafer the word length, number of banks of words, and number of words per bank). The via layer is patterned to connect the upper bus lines to selected regions in the lower metal levels after testing (testing uses conventional techniques) for good and bad elements.
    • 本发明涉及晶片尺寸集成电路的设计和制造。 晶片尺寸集成电路的较低层包括电隔离的重复块,例如电路元件的逻辑元件或块。 上导电层包括数据和地址总线结构。 位于上层和下层之间的自由通过层可以被图案化以实现多种目的。 通孔层的图案化避免了将总线结构连接到有缺陷的元件或块,建立元件的地址,并建立寻址结构和数据结构的组织(对于存储晶圆,字长,单词数量和数量 每个银行的单词)。 通孔图案被图案化以在测试之后将上部总线连接到较低金属级别中的选定区域(测试使用常规技术)以获得良好和坏的元件。
    • 65. 发明授权
    • Process for isolation using self-aligned diffusion process
    • 使用自对准扩散过程进行隔离的过程
    • US4696095A
    • 1987-09-29
    • US844908
    • 1986-03-27
    • Mammen Thomas
    • Mammen Thomas
    • H01L21/76H01L21/308H01L21/31H01L21/74H01L21/762
    • H01L21/74H01L21/308H01L21/76208H01L21/76216
    • A process is disclosed for improving the isolation between semi-oxide insulated devices, formed on mesa structures. In the fabrication of such devices, a silicon substrate is provided. Patterned regions of one type of conductivity are formed in a major surface of the substrate and an epitaxial layer of silicon is formed on the substrate over the major surface. A patterned mask layer is formed on the epitaxial layer and is etched to expose portions of the epitaxial layer. The exposed portions of the epitaxial layer are removed to form the mesa structures, which overlie the doped patterned regions. Regions of opposite conductivity, called channel stops, are then formed in the substrate between the patterned regions. After filling in the areas between the mesa structures with a field oxide, the devices (bipolar or MOS transistors) are formed on the mesa structures.The process of the invention utilizes as a mask structure a mask having a combination of properties (composition and thickness) related to the subequent processing. The mask permits use of an anisotropic etchant to define the mesa structures and to undercut the mask. An oxide layer is formed on the side walls of the mesa structures and on those portions of the substrate exposed during the mesa-defining step. Those portions of the oxide layer underlying openings in the mask structure are removed to expose portions of the substrate, which encompass regions between the doped patterned regions. The channel stop dopant is introduced into the regions between the patterned regions.
    • 公开了一种用于改善在台面结构上形成的半氧化物绝缘装置之间的隔离的方法。 在这样的器件的制造中,提供硅衬底。 在衬底的主表面上形成一种导电类型的图形区域,并且在主表面上的衬底上形成硅外延层。 在外延层上形成图案化的掩模层,并被蚀刻以暴露外延层的部分。 去除外延层的暴露部分以形成覆盖掺杂图案区域的台面结构。 然后在图案化区域之间的衬底中形成具有相反电导率的区域,称为通道停止点。 在用场氧化物填充台面结构之间的区域之后,在台面结构上形成器件(双极或MOS晶体管)。 本发明的方法利用具有与子级处理相关的性质(组成和厚度)的组合的掩模作为掩模结构。 掩模允许使用各向异性蚀刻剂来限定台面结构并且掩盖掩模。 在台面结构的侧壁和在台面界定步骤期间露出的基板的那些部分上形成氧化物层。 去除掩模结构中的开口下方的氧化物层的那些部分,以暴露包含掺杂图案区域之间的区域的衬底的部分。 通道阻挡掺杂剂被引入到图案化区域之间的区域中。