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71. 发明申请

US20220410345A1 POLISHING APPARATUS AND POLISHING MEMBER DRESSING METHOD 有权
公开(公告)号：US20220410345A1
公开(公告)日：2022-12-29
申请号：US17895968
申请日：2022-08-25
申请人： EBARA CORPORATION
发明人： Keita Yagi , Yasumasa Hiroo
IPC分类号： B24B53/017 , B24B37/20
摘要： A dresser is enabled to adjust a swing speed in scanning areas set on a polishing member along a swing direction. A surface height of the polishing member in monitoring areas set in advance on the polishing member along the swing direction of the dresser is measured. A dress model matrix defined from the monitoring areas, the scanning areas and a dress model is created. Height profile predicted value is calculated using the dress model and the swing speed in each scanning area or a staying time. Evaluation index is set based on a difference from a target value of a height profile of the polishing member and a step of setting the swing speed in each scanning area of the dresser based on the evaluation index. At least one of parameters to determine the target value or the evaluation index of the height profile is made to change automatically.

72. 发明申请

US20220410342A1 IMPROVED CONTROL SYSTEM FOR GRINDING APPARATUS 有权
公开(公告)号：US20220410342A1
公开(公告)日：2022-12-29
申请号：US17621245
申请日：2020-06-25
申请人： C.M.E. BLASTING & MINING EQUIPMENT LTD.
发明人： Bjorn SJOLANDER , Bo Thomas SJOLANDER
IPC分类号： B24B51/00 , B24B3/33 , B24B41/04
摘要： The present disclosure provides a Grinding apparatus for grinding working tips of hard metal inserts of rock drill bits, comprising: a grinding machine, means for holding a rock drill bit to be ground and a support system, the support system, the grinding machine equipped with a spindle assembly having an output drive shaft having a longitudinal axis, one of a plurality of grinding tools of different sizes and profiles detachably connected to the output drive shaft for grinding different sizes and profiles of working tips; and having a control system having a programmable operator control panel capable of directly or indirectly monitoring and adjusting one or more operational parameters, a programmable control card provided having a circuit board containing a central processor, an RFID reader provided within operator control panel together with a touch screen display wherein when the free end of a grinding cup equipped with an RFID tag in accordance with present invention is inserted into the RFID reader a proximity sensor detects the RFID tag and scans the data on the tag wherein the data includes a specific ID identifier for the particular grinding cup and the number of grinding cycles over which it has been used to date.

73. 发明申请

US20220410340A1 POLISHING HEAD ASSEMBLY HAVING RECESS AND CAP 有权
公开(公告)号：US20220410340A1
公开(公告)日：2022-12-29
申请号：US17806378
申请日：2022-06-10
申请人： GlobalWafers Co., Ltd.
发明人： Peter Daniel Albrecht , Chih Yuan Hsu , Jen Chieh Lin , Wei Chang Huang , Yau-Ching Yang
IPC分类号： B24B37/26
摘要： A polishing head assembly for polishing of semiconductor wafers includes a polishing head and a cap. The polishing head has a top portion and a recess along a bottom portion. The recess has a recessed surface. Holes extend from the top portion through the recessed surface. The cap is positioned within the recess and the cap has an annular wall and a floor extending across the annular wall. The annular wall has apertures corresponding to the holes. The floor is spaced from the recessed surface to form a chamber therebetween. The polishing head assembly also includes a band that circumscribes a portion of the annular wall. The holes and the corresponding apertures receive fasteners to removably secure the annular wall to the recessed surface.

74. 发明申请

US20220410339A1 POLISHING PAD WITH PROTRUDED POLISHING STRUCTURES, SYSTEM FOR MANUFACTURING THE SAME, AND METHOD FOR MANUFACTURING THE SAME 有权
公开(公告)号：US20220410339A1
公开(公告)日：2022-12-29
申请号：US17733951
申请日：2022-04-29
申请人： Smart Pad LLC
发明人： Sunghoon LEE
IPC分类号： B24B37/26 , B24B37/24 , B24D18/00
摘要： A method for fabricating a polishing pad including a plurality of polishing structures includes providing a mold having a top surface and a bottom surface, the mold including a plurality of recesses that correspond to polishing structures formed on the top surface thereof; dispensing a polymer mix on the mold and allowing the polymer mix to fill the plurality of recesses to be formed as the polishing structures; laminating a base film on the top surface of the mold; curing the polymer mix to allow the polymer mix to adhere to the base film and to form the polishing structures on the base film; and demolding the base film and the polishing structures from the mold to obtain a polishing pad sheet. Subsequently, the polishing pad sheet is cut into a plurality of polishing pads.

75. 发明申请

US20220410281A1 ABRASIVE ROTARY TOOL WITH EXPANDABLE COLLET 有权
公开(公告)号：US20220410281A1
公开(公告)日：2022-12-29
申请号：US17624296
申请日：2020-06-29
申请人： 3M INNOVATIVE PROPERTIES COMPANY
发明人： Bruce A. SVENTEK , Stephen C. LOPER
IPC分类号： B23B31/20 , B23B31/40 , B24B45/00
摘要： The disclosure is generally directed to abrasive rotary tools capable of expanding into a substrate. Exemplary abrasive rotary tools include an expandable collet configured to expand an abrasive surface of the abrasive rotary tool. The expandable collet may be positioned proximate to a multi-planar edge of a substrate, such as a hole, and expanded into the edge to more fully and/or evenly contact the edge of the substrate. In this way, an abrasive rotary tool may more quickly and/or consistently abrade the edge.

76. 发明申请

US20220402089A1 POWER TOOL 有权
公开(公告)号：US20220402089A1
公开(公告)日：2022-12-22
申请号：US17304462
申请日：2021-06-22
申请人： Jackson Travis Wolfe
发明人： Jackson Travis Wolfe
IPC分类号： B24B23/02 , B25F3/00 , B25F5/02
摘要： A power tool that is configured to provide finishing of a surface of an object wherein the power tool provides movement in a first direction and a second direction. The power tool of the present invention includes a housing wherein the housing has a coupling assembly secured to the front end thereof. The rear end of the housing includes a brush compartment formed therein. A sanding member is releasably secured to the coupling assembly and includes a planar body configured to have sanding paper secured thereto. A filing member is also provided and configured to be releasably secured to the coupling assembly. The filing member includes a rectangular body having formations on the outer surface thereof. A three-way switch provides control to move the sanding member and the filing member in the first and second direction. A battery power supply is disposed in the housing.

77. 发明申请

US20220402003A1 SUBSTRATE CLEANING DEVICE AND SUBSTRATE PROCESSING DEVICE 有权
公开(公告)号：US20220402003A1
公开(公告)日：2022-12-22
申请号：US17828001
申请日：2022-05-30
申请人： EBARA CORPORATION
发明人： YOHEI ETO , MITSURU MIYAZAKI , HISAJIRO NAKANO
IPC分类号： B08B13/00 , B08B1/02 , B08B3/02 , B24B37/34 , G01P3/36
摘要： The disclosure provides a substrate cleaning device and a substrate processing device capable of suppressing erroneous rotation detection of an optical sensor due to adhesion of droplets or mist. A substrate cleaning device includes a substrate cleaning part for cleaning a substrate, a drive roller for rotating the substrate, a driven roller rotated by the substrate, and a rotation detection part for detecting rotation of the driven roller. The rotation detection part includes a detected part provided on the driven roller, an optical sensor for detecting rotation of the detected part by irradiation with detection light, and a liquid filling part for filling an optical path forming space in which an optical path of the detection light is formed with a liquid having transmittance.

78. 发明授权

US11532487B2 Substrate processing apparatus 有权
公开(公告)号：US11532487B2
公开(公告)日：2022-12-20
申请号：US16872441
申请日：2020-05-12
申请人： Tokyo Electron Limited
发明人： Akihiro Kubo , Yasushi Takiguchi , Teruhiko Kodama , Yoshiki Okamoto , Hayato Hosaka
IPC分类号： H01L21/461 , H01L21/67 , B24B37/04 , H01L21/306
摘要： A substrate processing apparatus includes a polishing member having a polishing surface configured to perform a polishing of a main surface of a substrate; a first dressing member having a first dressing surface configured to perform a dressing of the polishing surface; a second dressing member having a second dressing surface configured to perform a dressing of the first dressing surface; a holding member configured to hold the polishing member and the second dressing member; and a driving unit configured to, by moving the holding member, switch a first state in which the first dressing surface and the polishing surface come into contact with each other to perform the dressing of the polishing surface and a second state in which the first dressing surface and the second dressing surface come into contact with each other to perform the dressing of the first dressing surface.

79. 发明授权

US11529712B2 CMP polishing head design for improving removal rate uniformity 有权
公开(公告)号：US11529712B2
公开(公告)日：2022-12-20
申请号：US16225792
申请日：2018-12-19
申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
发明人： Te-Chien Hou , Ching-Hong Jiang , Kuo-Yin Lin , Ming-Shiuan She , Shen-Nan Lee , Teng-Chun Tsai , Yung-Cheng Lu
IPC分类号： B24B37/32 , B24B37/20
摘要： An apparatus for performing chemical mechanical polish on a wafer includes a polishing head that includes a retaining ring. The polishing head is configured to hold the wafer in the retaining ring. The retaining ring includes a first ring having a first hardness, and a second ring encircled by the first ring, wherein the second ring has a second hardness smaller than the first hardness.

80. 发明申请

US20220395957A1 POLISHING TOOL 有权
公开(公告)号：US20220395957A1
公开(公告)日：2022-12-15
申请号：US17805156
申请日：2022-06-02
申请人： DISCO CORPORATION
发明人： Naruto Fuwa , Naoya Sukegawa
IPC分类号： B24B37/22
摘要： There is provided a polishing tool for polishing a wafer. The polishing tool includes a base and a polishing layer fixed to the base. The polishing layer includes an electrically conductive material dispersed therein to eliminate static electricity generated when the polishing layer comes into contact with the wafer. Preferably, the electrically conductive material is carbon fiber, and the carbon fiber is included at a content of 3 wt % or more but 15 wt % or less.

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