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1. 发明申请

US20230119979A1 PRODUCT REMOVAL APPARATUS, TREATMENT SYSTEM, AND PRODUCT REMOVAL METHOD 有权
公开(公告)号：US20230119979A1
公开(公告)日：2023-04-20
申请号：US17935595
申请日：2022-09-27
申请人： EBARA CORPORATION
发明人： Fumiya OKAZAKI
IPC分类号： H01J37/32 , G01B21/08 , G01K13/00
摘要： The present disclosure provides a product removal apparatus, a treatment system, and a product removal method that can sufficiently remove the products deposited inside a vacuum pump and also suppress corrosion of the base material of the vacuum pump. The product removal apparatus of the present disclosure includes: a sensor for measuring the temperature of the inside of a vacuum pump, the thickness of a film of a product in a flow path in the vacuum pump, or the vibration frequency of the vacuum pump; a gas supplier for supplying a gas containing hydrogen halide, fluorine, chlorine, chlorine trifluoride, or fluorine radicals to the vacuum pump; and a control device. The control device controls the gas supplier so that the supply of the gas to the vacuum pump is stopped depending on a rate of temperature increase calculated from the temperature measured by the sensor, the film thickness, or the vibration frequency.

2. 外观设计

USD981459S1 Retaining ring for substrate 有权
公开(公告)号：USD981459S1
公开(公告)日：2023-03-21
申请号：US35513172
申请日：2021-06-16
申请人： EBARA CORPORATION
设计人： Kenichi Akazawa , Osamu Nabeya

3. 发明授权

US11591709B2 Apparatus for plating 有权
公开(公告)号：US11591709B2
公开(公告)日：2023-02-28
申请号：US16903615
申请日：2020-06-17
申请人： EBARA CORPORATION
发明人： Naoto Takahashi
IPC分类号： C25D17/10 , C25D7/12 , C25D17/00
摘要： There is provided an apparatus for plating a substrate as an object to be plated. The apparatus comprises an anode and a thief tunnel arranged to be located between the substrate and the anode when the substrate is placed to be opposed to the anode. The thief tunnel comprises a body placed away from the substrate and provided with an opening; a plurality of auxiliary electrodes provided in or to the body; and an ion exchange membrane configured to protect the auxiliary electrodes from a plating solution. The plurality of auxiliary electrodes are arranged along a circumference of the opening. At least one of the auxiliary electrodes is configured such that a voltage to be applied to the at least one of the auxiliary electrodes is controlled independently of a voltage to be applied to one or more auxiliary electrodes other than the at least one of the auxiliary electrodes.

4. 发明授权

US11577357B2 Temperature adjusting device and polishing device 有权
公开(公告)号：US11577357B2
公开(公告)日：2023-02-14
申请号：US16692710
申请日：2019-11-22
申请人： EBARA CORPORATION
发明人： Yasuyuki Motoshima
IPC分类号： B24B49/00 , B24B37/015 , H01L21/304
摘要： An object of the present invention is to improve in-plane uniformity in polishing in a polishing device.
A temperature adjusting device for adjusting temperature of a rotating polishing pad comprises: a heat conductor that can contact with a top face of the polishing pad; an arm for holding the heat conductor above the polishing pad; column members formed to stand on a top face of the heat conductor, comprising an upstream-side column member and a downstream-side column member arranged at a position at an upstream/downstream side of rotation of the polishing pad; and overhung members extending, from the upstream-side column member and the downstream-side column member, in directions that are parallel to the top face of the heat conductor; wherein the overhung members can contact with a top face of the arm.

5. 发明授权

US11571719B2 Nozzle and a substrate cleaning device 有权
公开(公告)号：US11571719B2
公开(公告)日：2023-02-07
申请号：US17036531
申请日：2020-09-29
申请人： EBARA CORPORATION
发明人： Yoichi Nakagawa
IPC分类号： B08B3/02 , B05B7/02 , B05B7/16
摘要： A nozzle for generating fine bubbles, the nozzle including: a hollow housing; and a plurality of plates provided in the housing and partitioning the housing into a plurality of spaces, wherein an upper face or a side face of the housing is provided with an inflow port into which a gas-dissolved liquid flows and which communicates with an uppermost space of the spaces partitioned by the plate, each of the plates is provided with a plurality of through-holes, and a lower face of the housing is provided with a slit communicating with a lowermost space of the spaces partitioned by the plate.

6. 发明申请

US20230001539A1 LIQUID FEEDER AND POLISHING APPARATUS 有权
公开(公告)号：US20230001539A1
公开(公告)日：2023-01-05
申请号：US17809074
申请日：2022-06-27
申请人： EBARA CORPORATION
发明人： Kuniaki YAMAGUCHI , Masayuki TAMURA , Kenji SHINKAI , Soichi ISOBE , Yusuke MOCHIDA
IPC分类号： B24B53/00 , B24B53/017 , B24B57/02
摘要： A liquid feeder includes: a first arm having a first nozzle; a second arm having a second nozzle; a first rotation shaft supporting a proximal end part of the first arm; a second rotation shaft supporting a proximal end part of the second arm; a first rotation driver configured to rotate the first rotation shaft to turn the first arm from a fluid feed position to a retracted position; a second rotation driver configured to rotate the second rotation shaft to turn the second arm from a fluid feed position to a retracted position; and a controller. The first rotation shaft and the second rotation shaft are disposed coaxially with each other. The controller is capable of controlling the operation of the first rotation driver and the operation of the second rotation driver independently of each other.

7. 发明授权

US11542624B2 Plating apparatus 有权
公开(公告)号：US11542624B2
公开(公告)日：2023-01-03
申请号：US17471609
申请日：2021-09-10
申请人： EBARA CORPORATION
发明人： Kazuhito Tsuji
IPC分类号： C25D17/02 , C25D17/06 , C25D17/00
摘要： Provided is a technique that can suppress remaining of air bubbles on a lower surface of an electric field shielding plate. A plating apparatus 1000 include a plating tank 10, a substrate holder 30, and an electric field shielding plate 60 configured to be arranged in a portion between an anode 50 and a substrate Wf in an inside of the plating tank for shielding a part of an electric field formed between the anode and the substrate. In a top view of the electric field shielding plate, in the inside of the plating tank, an unshielded region 70 that is without shielded by the electric field shielding plate is disposed. An inclined surface is disposed in a lower surface 61a of the electric field shielding plate, the inclined surface is inclined with respect to a horizontal direction and is configured to release an air bubble existing on the lower surface thereof to the unshielded region.

8. 发明授权

US11542619B2 Plating method 有权
公开(公告)号：US11542619B2
公开(公告)日：2023-01-03
申请号：US17497252
申请日：2021-10-08
申请人： EBARA CORPORATION
发明人： Kazuhito Tsuji
IPC分类号： C25D5/34 , C25D7/12 , C25D21/12 , C25D17/00
摘要： An objective of the present invention is to prevent a prewetting liquid from remaining in an edge portion of a substrate. A plating method for subjecting a substrate to a plating treatment is provided, the substrate including a part to be plated that is exposed to a plating solution and an edge portion that is an outer region of the part to be plated. The plating method includes a first sealing step of bringing a first seal body into contact with the substrate to seal the edge portion of the substrate, a prewetting step of subjecting the sealed substrate to a prewetting treatment, a first seal removing step of removing the first seal body from the prewetted substrate, a substrate holding step of holding the substrate with a substrate holder including a second seal body, and a plating step of applying the plating solution to the substrate held by the substrate holder.

9. 发明申请

US20220410345A1 POLISHING APPARATUS AND POLISHING MEMBER DRESSING METHOD 有权
公开(公告)号：US20220410345A1
公开(公告)日：2022-12-29
申请号：US17895968
申请日：2022-08-25
申请人： EBARA CORPORATION
发明人： Keita Yagi , Yasumasa Hiroo
IPC分类号： B24B53/017 , B24B37/20
摘要： A dresser is enabled to adjust a swing speed in scanning areas set on a polishing member along a swing direction. A surface height of the polishing member in monitoring areas set in advance on the polishing member along the swing direction of the dresser is measured. A dress model matrix defined from the monitoring areas, the scanning areas and a dress model is created. Height profile predicted value is calculated using the dress model and the swing speed in each scanning area or a staying time. Evaluation index is set based on a difference from a target value of a height profile of the polishing member and a step of setting the swing speed in each scanning area of the dresser based on the evaluation index. At least one of parameters to determine the target value or the evaluation index of the height profile is made to change automatically.

10. 发明申请

US20220402003A1 SUBSTRATE CLEANING DEVICE AND SUBSTRATE PROCESSING DEVICE 有权
公开(公告)号：US20220402003A1
公开(公告)日：2022-12-22
申请号：US17828001
申请日：2022-05-30
申请人： EBARA CORPORATION
发明人： YOHEI ETO , MITSURU MIYAZAKI , HISAJIRO NAKANO
IPC分类号： B08B13/00 , B08B1/02 , B08B3/02 , B24B37/34 , G01P3/36
摘要： The disclosure provides a substrate cleaning device and a substrate processing device capable of suppressing erroneous rotation detection of an optical sensor due to adhesion of droplets or mist. A substrate cleaning device includes a substrate cleaning part for cleaning a substrate, a drive roller for rotating the substrate, a driven roller rotated by the substrate, and a rotation detection part for detecting rotation of the driven roller. The rotation detection part includes a detected part provided on the driven roller, an optical sensor for detecting rotation of the detected part by irradiation with detection light, and a liquid filling part for filling an optical path forming space in which an optical path of the detection light is formed with a liquid having transmittance.

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