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71. 发明授权

US6120884A Conductor paste and multilayer ceramic part using the same 失效
标题翻译：导体糊和多层陶瓷部分使用相同
公开(公告)号：US6120884A
公开(公告)日：2000-09-19
申请号：US43571
申请日：1998-05-12
申请人： Katsuhiko Igarashi , Hidenori Ohata , Takahide Kurahashi , Kazuaki Suzuki
发明人： Katsuhiko Igarashi , Hidenori Ohata , Takahide Kurahashi , Kazuaki Suzuki
IPC分类号： H01B1/16 , H01L23/13 , H01L23/498 , H05K1/09 , B32B17/00
CPC分类号： H01B1/16 , H01L23/13 , H01L23/49805 , H01L23/49883 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/092 , Y10T428/24917 , Y10T428/24926
摘要： An object is to provide a conductor paste of quality which uses a silver base internal conductor, suppresses the generation of voids and the concomitant occurrence of cracks even when co-fired with ceramic material by the conductor melting method, and has improved productivity, reduced cost, and improved electrical properties. The conductor paste is prepared by dispersing a silver base conductive material and a metal oxide in a vehicle. At least one of Ga oxide, La oxide, Pr oxide, Sm oxide, Eu oxide, Gd oxide, Dy oxide, Er oxide, Tm oxide, and Yb oxide is used as the metal oxide. The conductor paste is fired at a temperature between the melting point and lower than the boiling point of the conductive material.
摘要翻译： PCT No.PCT / JP97 / 02144 Sec。 371日期：1998年5月12日 102（e）日期1998年5月12日PCT提交1997年6月23日PCT公布。第WO98 / 05045号公报。日期1998年2月5日，目的在于提供使用银基内部导体的质量导体糊，即使在通过导体熔融法与陶瓷材料共烧的同时，也抑制空隙的产生和伴随的裂纹的发生，并具有提高生产率，降低成本和改善电性能。通过将银基导电材料和金属氧化物分散在载体中来制备导体糊料。使用Ga氧化物，La氧化物，Pr氧化物，Sm氧化物，Eu氧化物，Gd氧化物，Dy氧化物，Er氧化物，Tm氧化物和Yb氧化物中的至少一种作为金属氧化物。导体膏在熔点低于导电材料的沸点之间的温度下焙烧。

72. 发明授权

US6118212A Organic electroluminescent light emitting devices 失效
标题翻译：有机电致发光器件
公开(公告)号：US6118212A
公开(公告)日：2000-09-12
申请号：US79286
申请日：1998-05-15
申请人： Kenji Nakaya , Isamu Kobori , Masami Mori , Kazutoshi Ohisa , Michio Arai
发明人： Kenji Nakaya , Isamu Kobori , Masami Mori , Kazutoshi Ohisa , Michio Arai
IPC分类号： H05B33/26 , H01B1/16 , H01L51/50 , H01L51/52 , H05B33/12
CPC分类号： H01L51/5221 , Y10S428/917
摘要： An organic EL device of the invention comprises a hole injecting electrode, an electron injecting electrode and at least one organic layer interleaved between them. The electron injecting electrode is a film of an aluminum lithium alloy formed by a sputtering technique and comprising 0.4 to 14 at % of lithium. The electron injecting electrode further includes on a side of the electron injecting electrode that is not opposite to the organic layer a protective electrode comprising at least one of aluminum, aluminum and a transition metal except titanium, titanium, and titanium nitride.
摘要翻译：本发明的有机EL元件包括空穴注入电极，电子注入电极和在它们之间交错的至少一个有机层。电子注入电极是通过溅射技术形成的包含0.4〜14at％的锂的铝锂合金的膜。电子注入电极还包括在电子注入电极的与有机层相反的一侧，包括除了钛，钛和氮化钛之外的铝，铝和过渡金属中的至少一种的保护电极。

73. 发明授权

US6104044A Semiconductor compound electrode material containing calcium and a noble metal 失效
标题翻译：含有钙和贵金属的半导体复合电极材料
公开(公告)号：US6104044A
公开(公告)日：2000-08-15
申请号：US861820
申请日：1997-05-23
申请人： Yasushi Iyechika , Yoshinobu Ono , Tomoyuki Takada , Katsumi Inui
发明人： Yasushi Iyechika , Yoshinobu Ono , Tomoyuki Takada , Katsumi Inui
IPC分类号： H01L21/285 , H01B1/16 , H01L21/28 , H01L29/45 , H01L33/32 , H01L33/40 , H01S5/00 , H01S5/042 , H01S5/323 , H01L29/205 , H01L27/15 , H01S3/19
CPC分类号： H01L33/40 , H01L29/452 , H01L33/42 , H01S5/0425 , H01S5/32341
摘要： Disclosed is an electrode material for Group III-V compound semiconductor represented by the general formula In.sub.x Ga.sub.y Al.sub.z N (provided that x+y+z=1, 0.ltoreq.x.ltoreq.1, 0.ltoreq.y.ltoreq.1, and 0.ltoreq.z.ltoreq.1) doped with a p-type impurity which is capable of obtaining good ohmic contact, and an electrode using the same, thereby making it possible to reduce a driving voltage of a device using the compound semiconductor. The electrode material is a metal comprising at least Ca and a noble metal, wherein the total amount of the weight of Ca and the noble metal is not less than 50% by weight and not more than 100% by weight based on the weight of the whole electrode material.
摘要翻译：公开了由通式In x Ga y Al z N表示的用于III-V族化合物半导体的电极材料（假定x + y + z =1,0,0≤x≤1,0≤y≤1，和掺杂有能够获得良好的欧姆接触的p型杂质，以及使用其的电极，从而可以降低使用化合物半导体的器件的驱动电压。电极材料是至少包含Ca和贵金属的金属，其中Ca和贵金属的重量总量不小于50重量％且不大于100重量％，基于整个电极材料。

74. 发明授权

US6090436A Gold paste for a ceramic circuit board 失效
标题翻译：金膏为陶瓷电路板
公开(公告)号：US6090436A
公开(公告)日：2000-07-18
申请号：US888916
申请日：1997-07-07
申请人： Akihiko Miyoshi
发明人： Akihiko Miyoshi
IPC分类号： H01B1/16 , H01L23/498 , H05K1/09 , B05D5/12
CPC分类号： H05K1/092 , H01B1/16 , H01L23/49883 , H01L2224/16225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/19105 , Y10T428/24917 , Y10T428/24926 , Y10T428/252 , Y10T428/2804
摘要： An improved gold paste for use in the manufacture of ceramic circuit boards is disclosed, which has a composition comprising an inorganic component, an organic binder, a solvent. The inorganic component contains (a) 84-94 wt % powdery gold with a particle size of 0.3-0.7 .mu.m, (b) 0.3-2.0 wt % powdery V.sub.2 O.sub.5 with a particle size of 0.3-2.0 .mu.m, and (c) 0.3-2.0 wt % powdery CuO with a particle size of 0.3-2.0 .mu.m.
摘要翻译：公开了一种用于制造陶瓷电路板的改进的金膏，其具有包含无机成分，有机粘合剂和溶剂的组合物。无机成分含有（a）84-94重量％的粉末状金，粒径为0.3〜0.7μm，（b）0.3〜2.0重量％的粉末状V2O5，粒径为0.3〜2.0μm，（c） 0.3-2.0重量％的粒径为0.3-2.0μm的CuO粉末。

75. 发明授权

US06042933A Electric circuit device having circuit conductors using an electroconductive paste 有权
标题翻译：具有使用导电浆料的电路导体的电路装置
公开(公告)号：US06042933A
公开(公告)日：2000-03-28
申请号：US133853
申请日：1998-08-13
申请人： Keizo Hirai , Hiroshi Wada , Akihiro Sasaki , Hisashi Kaga , Junichi Kikuchi , Shozo Yamana , Hideji Kuwajima
发明人： Keizo Hirai , Hiroshi Wada , Akihiro Sasaki , Hisashi Kaga , Junichi Kikuchi , Shozo Yamana , Hideji Kuwajima
IPC分类号： B22F1/00 , B22F1/02 , H01B1/02 , H01B1/16 , H01B1/22 , H01L23/498 , H05K1/09 , B32B3/00 , B22F3/00
CPC分类号： B22F1/0055 , B22F1/0007 , B22F1/0059 , B22F1/025 , H01B1/02 , H01B1/16 , H01B1/22 , H01L23/49883 , H05K1/092 , H05K1/095 , B22F2009/041 , B22F2009/043 , B22F2998/00 , B22F2999/00 , H01L2924/0002 , Y10S428/901 , Y10T428/12014 , Y10T428/12028 , Y10T428/12181 , Y10T428/12493 , Y10T428/12715 , Y10T428/12868 , Y10T428/24917 , Y10T428/24926
摘要： Electroconductive composite metal powders comprising flat non-noble metal powders, each covered with a noble metal in an amount of 2 to 30% by weight in average based on the weight of the non-noble metal powders, on 50% or more in average of the whole surface area of the non-noble metal powders, interposing a layer of a mixture of the non-noble metal and noble metal between each non-noble metal powder and a noble metal covering layer, are suitable for providing an electroconductive paste after mixing with a binder, said paste showing excellent electroconductivity and prevention of migration.
摘要翻译：包含平坦非贵金属粉末的导电复合金属粉末，平均非贵金属粉末的平均非贵金属粉末的平均重量平均为2〜30重量％，平均为非贵金属粉末的重量的50重量％以上在非贵金属粉末和贵金属覆盖层之间插入非贵金属和贵金属的混合物层的非贵金属粉末的整个表面积适于在混合之后提供导电浆料使用粘合剂，所述糊状物显示出优异的导电性并防止迁移。

76. 发明授权

US5997774A Paste for forming internal electrode in a ceramic element 有权
标题翻译：用于在陶瓷元件中形成内部电极的浆料
公开(公告)号：US5997774A
公开(公告)日：1999-12-07
申请号：US249957
申请日：1999-02-12
申请人： Yasushi Shimizu , Minoru Yonezawa
发明人： Yasushi Shimizu , Minoru Yonezawa
IPC分类号： H01G4/12 , H01B1/16 , H01B1/20 , H01B1/22 , H01G4/005 , H01G4/008
CPC分类号： H01G4/0085
摘要： The present invention provides a paste for forming an internal electrode in a ceramic element. The paste causes no sudden heat generation from an organic vehicle contained therein during a degreasing step and allows Pd or Ag/Pd serving as an internal electrode to expand freely as a result of oxidation during a firing step, to thereby prevent structural defects of the ceramics such as delamination, when used for the formation of internal electrodes in a ceramic element such as a laminated ceramic capacitor. The paste contains a metal powder of Pd or Ag/Pd, Pd resinate, Cr resinate and an organic vehicle. Preferably, the Pd resinate contains sulfur in the molecule. Also preferably, the paste contains the Pd resinate in an amount of about 2.0-3.0 parts by weight as Pd, based on 100 parts by weight of Pd in the metal powder, and the Cr resinate in an amount of about 0.03-0.12 parts by weight as Cr.sub.2 O.sub.3, based on 100 parts by weight of the metal powder.
摘要翻译：本发明提供了一种用于在陶瓷元件中形成内部电极的糊料。糊剂在脱脂工序中不会引起其中含有的有机载体的突然发热，并且由于在烧成工序中的氧化，可以使作为内部电极的Pd或Ag / Pd自由扩展，从而防止陶瓷的结构缺陷例如在陶瓷元件如层叠陶瓷电容器中用于形成内部电极时的分层。该糊料含有Pd或Ag / Pd，Pd树脂酸盐，Cr树脂酸盐和有机载体的金属粉末。优选地，Pd树脂酸盐在分子中含有硫。还优选地，基于100重量份的金属粉末中的Pd，所述糊料包含Pd的量为约2.0-3.0重量份的Pd树脂酸盐，并且Cr树脂酸盐的量为约0.03-0.12重量份重量为Cr 2 O 3，基于100重量份的金属粉末。

77. 发明授权

US5948320A Electro-conductive composition and electronic equipment using same 失效
标题翻译：导电组合物和使用其的电子设备
公开(公告)号：US5948320A
公开(公告)日：1999-09-07
申请号：US116181
申请日：1998-07-15
申请人： Takashi Nikaidoh , Yasuichi Ono , Katsuyuki Suzuki
发明人： Takashi Nikaidoh , Yasuichi Ono , Katsuyuki Suzuki
IPC分类号： H05K3/34 , B23K35/02 , B23K35/26 , H01B1/16 , H01B1/22 , H05K3/24
CPC分类号： H05K3/247 , B23K35/0244 , B23K35/26 , H01B1/22 , H05K2201/0272
摘要： Provided are an electro-conductive composition improved on its wettability and handled with ease and an electronic equipment using the same. The electro-conductive composition comprises: 28 to 45 wt % first metallic particles easy to form an alloy with a solder; 25 to 60 wt % second metallic particles hard to diffuse into the solder; 3 to 7 wt % an oxide having a property to block penetration of the solder; and 7 to 30 wt % a resin.
摘要翻译：提供一种改善其润湿性并易于处理的导电组合物和使用其的电子设备。导电组合物包含：28〜45重量％的容易与焊料形成合金的第一金属粒子; 25至60重量％的难以扩散到焊料中的第二金属颗粒; 3〜7重量％的具有阻止焊料渗透性的氧化物; 和7〜30重量％的树脂。

78. 发明授权

US5922627A Low resistivity palladium-silver compositions 失效
标题翻译：低电阻率钯 - 银组合物
公开(公告)号：US5922627A
公开(公告)日：1999-07-13
申请号：US953586
申请日：1997-10-17
申请人： David J. Nabatian , Orville W. Brown , James E. Durant
发明人： David J. Nabatian , Orville W. Brown , James E. Durant
IPC分类号： H01B1/16 , H01C7/12 , H01C17/065 , H05K1/09 , C03C8/14 , C03C8/18
CPC分类号： H05K1/092 , C03C3/064 , C03C3/066 , C03C3/072 , C03C8/18 , H01B1/16 , H01C17/06506 , H01C17/0654 , H01C7/12
摘要： Glass frits containing lithium are used in thick film palladium-silver compositions which after firing result in conductors or resistors that exhibit very low resistivity and TCR.
摘要翻译：含有锂的玻璃料用于厚膜钯 - 银组合物，其在焙烧后导致显示非常低的电阻率和TCR的导体或电阻。

79. 发明授权

US5904987A Resistance material composition and single and multilayer ceramic substrates employing the same 失效
标题翻译：电阻材料组成和使用其的单层和多层陶瓷衬底
公开(公告)号：US5904987A
公开(公告)日：1999-05-18
申请号：US738280
申请日：1996-10-25
申请人： Hiroji Tani , Keisuke Nagata
发明人： Hiroji Tani , Keisuke Nagata
IPC分类号： H05K1/16 , C03C8/18 , C04B41/51 , C04B41/88 , H01B1/16 , H01C7/00 , H01C17/06 , B32B15/04 , B32B17/06 , B32B18/00 , H01C1/012
CPC分类号： C04B41/009 , C03C8/18 , C04B41/5133 , C04B41/88 , H01C7/006 , C04B2111/00844 , Y10S428/901 , Y10T428/24926
摘要： Disclosed is a resistance material composition comprising at least one resistance material of Ti, Mo and W, and an inorganic binder. The composition can be baked along with a multi-layered ceramic substrate (especially, a low-temperature-sintering, multi-layered ceramic substrate) to be integrated with Cu or the like electrodes, thereby forming built-in resistors with good characteristics within the substrate.
摘要翻译：公开了包含至少一种Ti，Mo和W的电阻材料和无机粘合剂的电阻材料组合物。可以将组合物与多层陶瓷基板（特别是低温烧结多层陶瓷基板）一起烘烤，以与Cu等电极一体化，从而在内部电阻器内形成具有良好特性的内置电阻器基质。

80. 发明授权

US5840218A Resistance material composition 失效
标题翻译：电阻材料组成
公开(公告)号：US5840218A
公开(公告)日：1998-11-24
申请号：US738320
申请日：1996-10-25
申请人： Hiroji Tani , Keisuke Nagata
发明人： Hiroji Tani , Keisuke Nagata
IPC分类号： H05K1/16 , C04B35/195 , C04B35/48 , H01B1/16 , H01C7/02 , H01C17/06 , H01L23/15 , H01B1/06 , A01C7/00 , B32B9/00
CPC分类号： H01L23/15 , C04B35/195 , C04B35/481 , H01C7/022 , H01L2924/0002 , H01L2924/09701 , Y10T428/24942
摘要： Disclosed is a resistance material composition consisting essentially of at least one nitride of an element of Group VA and Group VIA and optionally containing an inorganic binder. The composition can be baked along with a multi-layered ceramic substrate (especially, a low-temperature-sintering, multi-layered ceramic substrate) to be integrated with Cu or the like electrodes, thereby forming built-in resistors with good characteristics within the substrate. The nitrides are preferably NbN, TaN and Cr.sub.2 N.
摘要翻译：公开了一种电阻材料组合物，其基本上由至少一种VA族和VIA族元素的氮化物组成，并任选地含有无机粘合剂。可以将组合物与多层陶瓷基板（特别是低温烧结多层陶瓷基板）一起烘烤，以与Cu等电极一体化，从而在内部电阻器内形成具有良好特性的内置电阻器基质。氮化物优选为NbN，TaN和Cr2N。

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