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    • 83. 发明授权
    • Programming method of non-volatile memory device
    • 非易失性存储器件的编程方法
    • US08493792B2
    • 2013-07-23
    • US13309760
    • 2011-12-02
    • Seiichi AritomeSoo Jin Wi
    • Seiichi AritomeSoo Jin Wi
    • G11C16/06G11C11/56
    • G11C11/5628G11C16/12G11C16/3418G11C16/349
    • A programming method includes setting the voltages of bit lines, performing a program operation, performing a program verify operation by supplying a program verify voltage and determining whether all of the memory cells of the selected page have been programmed with a target threshold voltage or higher, counting the number of passed memory cells corresponding to a number of pass bits, if, a result of the program verify operation, the program operation failed to program all of the memory cells of the selected page to the target threshold voltage or higher, and making a determination that determines whether the number of pass bits is greater than the first number of pass permission bits, and raising a voltage of a bit line coupled to a failed memory cell, if, as a result of the determination, the number of pass bits is greater than the first number of pass permission bits.
    • 一种编程方法,包括设置位线的电压,执行编程操作,通过提供编程验证电压并确定所选择的页面的所有存储单元是否已经被编程为目标阈值电压或更高,执行编程验证操作, 对与多个通过位相对应的经过的存储单元的数量进行计数,如果程序验证操作的结果,程序操作不能将所选页的所有存储单元编程为目标阈值电压或更高,并且使 确定通过位的数量是否大于第一数量的通过许可位,并且提高耦合到故障存储器单元的位线的电压,如果作为确定的结果,通过位的数量 大于第一个通过许可位数。
    • 84. 发明授权
    • Devices and memory arrays including bit lines and bit line contacts
    • 器件和存储器阵列,包括位线和位线触点
    • US08446011B2
    • 2013-05-21
    • US13243510
    • 2011-09-23
    • Seiichi Aritome
    • Seiichi Aritome
    • H01L23/48H01L23/52H01L29/40
    • H01L27/11519H01L27/0207H01L27/115H01L27/11521H01L27/11524
    • Each of the first bit lines of a device has an upper surface and a lower surface, with the upper surface being more outwardly located over a semiconductor surface than the lower surface. A second bit line of the device has an upper surface and a lower surface, with the upper surface thereof being more outwardly located over the semiconductor surface than the lower surface. The upper surface of the second bit line is more outwardly located over the semiconductor surface than the upper surfaces of the first bit lines. The first bit lines are each adjacent to the second bit line and the second bit line is configured to be selectively coupled to a memory cell other than memory cells to which the first bit lines are configured to be selectively coupled. The second bit line does not overlap any of the first bit lines.
    • 装置的每个第一位线具有上表面和下表面,其中上表面比下表面更向外位于半导体表面之上。 器件的第二位线具有上表面和下表面,其上表面比下表面更向外位于半导体表面之上。 第二位线的上表面比第一位线的上表面更向外位于半导体表面之上。 第一位线各自与第二位线相邻,并且第二位线被配置为选择性地耦合到除了​​第一位线被配置为选择性耦合的存储器单元之外的存储器单元。 第二位线不与第一位线重叠。