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    • 85. 发明申请
    • Method for generating free radical capable polymers using carbonyl-containing compounds
    • 使用含羰基化合物生成具有自由基能力的聚合物的方法
    • US20080161501A1
    • 2008-07-03
    • US11618095
    • 2006-12-29
    • James E. Hall
    • James E. Hall
    • C08F8/00
    • C08C19/44C08F257/02C08F279/02C08L51/003C08L51/04C08L55/02C08L2666/02
    • Provided is a method comprising reacting the anionic living end of a polymer that is end capped with a steric hindering compound with a carbonyl-containing compound to produce a polymer with a homolytically cleaveable group. An engineered plastic may then be produced by adding the polymer containing a homolytically cleavable group to a solvent comprising at least one vinyl monomer; (b) optionally adding at least one additional inert solvent; (c) optionally adding additives selected from the group consisting of extender oils, modifiers, and antioxidants; and (d) initiating polymerization of the at least one vinyl monomer by the use of an initiator and/or heat, wherein a free radical is produced from the polymer containing a homolytically cleavable group.
    • 提供了一种方法,其包括使封端的聚合物的阴离子活性末端与空间阻碍化合物与含羰基化合物反应以制备具有均聚裂解基团的聚合物。 然后可以通过将含有均聚裂解基团的聚合物加入到包含至少一种乙烯基单体的溶剂中来制备工程塑料; (b)任选地加入至少一种另外的惰性溶剂; (c)任选地添加选自由增量油,改性剂和抗氧化剂组成的组的添加剂; 和(d)通过使用引发剂和/或加热引发至少一种乙烯基单体的聚合,其中由含有均聚裂解基团的聚合物产生自由基。
    • 89. 发明申请
    • Interface materials and methods of production and use thereof
    • 界面材料及其生产和使用方法
    • US20080044670A1
    • 2008-02-21
    • US11702351
    • 2007-02-05
    • My Nguyen
    • My Nguyen
    • B32B9/04C22C32/00
    • C08F279/00B23K1/0016B23K1/203B23K35/0244B23K35/025B23K35/26B23K35/262B23K35/3613B23K2101/42C08F279/02C08K3/08C08K9/02C08L51/04C22C1/0416C22C1/0483C22C26/00C22C32/0084H01L23/3737H01L2924/0002H01L2924/3011Y10T428/24116Y10T428/25Y10T428/256Y10T428/28Y10T428/31504Y10T428/31663Y10T428/31678C08L15/00C08L2666/02H01L2924/00
    • An interface material comprising a resin mixture and at least one solder material is herein described. The resin material may comprise any suitable resin material, but it is preferred that the resin material be silicone-based comprising one or more compounds such as vinyl silicone, vinyl Q resin, hydride functional siloxane and platinum-vinylsiloxane. The solder material may comprise any suitable solder material, such as indium, silver, copper, aluminum and alloys thereof, silver coated copper, and silver coated aluminum, but it is preferred that the solder material comprise indium or indium-based compounds and/or alloys. The interface material, or polymer solder, has the capability of enhancing heat dissipation in high power semiconductor devices and maintains stable thermal performance. The interface material may be formulated by mixing the components together to produce a paste which may be applied by dispensing methods to any particular surface and cured at room temperature or elevated temperature. It can be also formulated as a highly compliant, cured, tacky elastomeric film or sheet for other interface applications where it can be preapplied, for example on heat sinks, or in any other interface situations.
    • 本文描述了包含树脂混合物和至少一种焊料材料的界面材料。 树脂材料可以包括任何合适的树脂材料,但是优选树脂材料是含有一种或多种化合物的硅酮基,例如乙烯基硅酮,乙烯基Q树脂,氢化物官能的硅氧烷和铂 - 乙烯基硅氧烷。 焊料材料可以包括任何合适的焊料材料,例如铟,银,铜,铝及其合金,镀银铜和银涂覆的铝,但优选焊料材料包括铟或铟基化合物和/或 合金。 界面材料或聚合物焊料具有增强大功率半导体器件的散热能力并保持稳定的热性能。 界面材料可以通过将组分混合在一起而制成糊料,其可以通过分配方法施加到任何特定表面并在室温或高温下固化。 也可以将其配制成用于其它界面应用的高度柔顺,固化,粘合的弹性体膜或片材,其中可以预先应用,例如在散热器上或在任何其它界面情况下。