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    • 88. 发明授权
    • On-chip automatic procedures for memory testing
    • 片上自动程序进行内存测试
    • US5675546A
    • 1997-10-07
    • US659811
    • 1996-06-07
    • Yu-Ying Jackson Leung
    • Yu-Ying Jackson Leung
    • G01R31/28G01R31/30G11C29/02G11C29/06G11C29/16G11C29/50G11C7/00G11C29/00
    • G11C29/021G11C29/02G11C29/16G11C29/50G06F2201/88G11C16/04G11C2029/5004
    • The on-chip endurance test (Autocycle) and the parametric characterization test (Auto VccMax/Min) of this invention save test time and hardware by performance automatically on the memory chip upon transmittal of a single command (CONTROL CODE) to the chip from the tester. The automated test procedures of this invention run faster because the on-chip tester requires fewer externally issued commands (CONTROL CODEs) and requires fewer external status checks. The procedures of this invention permit the external tester to have a smaller number of input/output pins (CONTROL), decreasing the cost of the external test hardware. Specifically, the endurance test (Autocycle), automatically cycles the memory chip through any combination of programming, erasing, and/or compaction operations until either a failure has been detected or the required number of the test cycles has been completed. The parametric characterization test (AutoVccMax/Min) determines automatically the maximum supply voltage and/or the minimum supply voltage for data operation of the memory chip. The endurance test (Autocycle) uses a microsequencer (MC) and an on-chip built-in-logic-block-observation (BILBO) register to check information in a control-read-only memory (CROM). Output data from the control-read-only memory is latched in a BILBO register enhanced for use as a counter for large count. During the endurance test (Autocycle), the microsequencer (MC), using enhanced counter, monitors the number of on-chip controlled endurance test cycles. During the parametric characterization test (AutoVccMax/Min), an on-chip digital-analog converter (DAC) causes stepped changes in the supply voltage (Vcc) furnished to both the data cells (10) and the reference cells (10) of the memory.
    • 本发明的片上耐久性测试(Autocycle)和参数化特性测试(Auto VccMax / Min)在将单个命令(控制代码)传送到芯片上时,可以在存储器芯片上自动保存测试时间和硬件 测试仪 本发明的自动测试程序运行速度更快,因为片上测试仪需要更少的外部发出的命令(控制代码),并且需要更少的外部状态检查。 本发明的程序允许外部测试仪具有较少数量的输入/输出引脚(CONTROL),降低外部测试硬件的成本。 具体来说,耐久性测试(Autocycle)通过编程,擦除和/或压缩操作的任何组合自动循环存储器芯片,直到检测到故障或已经完成所需的测试周期数。 参数化特性测试(AutoVccMax / Min)自动确定存储器芯片的数据操作的最大电源电压和/或最小电源电压。 耐力测试(Autocycle)使用微定序器(MC)和片上内置逻辑块观测(BILBO)寄存器来检查控制只读存储器(CROM)中的信息。 来自控制只读存储器的输出数据被锁存在增强的BILBO寄存器中,用作大计数器的计数器。 在耐力测试(Autocycle)期间,使用增强型计数器的微定序器(MC)监控片上受控耐久性测试周期的数量。 在参数特征测试(AutoVccMax / Min)期间,片上数模转换器(DAC)引起提供给数据单元(10)和参考单元(10)的电源电压(Vcc)的阶梯式变化 记忆。
    • 89. 发明授权
    • Semiconductor memory device with stress circuit and method for supplying
a stress voltage thereof
    • 具有应力电路的半导体存储器件及其应力电压的提供方法
    • US5657282A
    • 1997-08-12
    • US400995
    • 1995-03-09
    • Kyu-Chan Lee
    • Kyu-Chan Lee
    • G11C11/413G11C11/401G11C11/407G11C29/00G11C29/02G11C29/06G11C29/50G11C29/56
    • G11C29/50G11C11/401
    • A semiconductor integrated circuit with a stress circuit and a stress voltage supplying method thereof ensures the reliability of the device. The semiconductor integrated circuit has a stress enable circuit for generating an enable signal during a test operation of the chip and for enabling the test operation, a stress voltage supplying circuit for supplying a first stress voltage and a second stress voltage in response to an output signal of the stress enable circuit during the test operation, and a sensing delay control circuit for receiving the first and second stress voltages and for delaying an operation of the sense amp control circuit during the test operation. During the test operation, the first and second stress voltages are supplied to word lines adjacent to each other in response to the output signal of the stress enable circuit, and a state of a selected memory cell by the word line is sensed in response to an output signal of the sensing delay control circuit.
    • 具有应力电路和应力电压提供方法的半导体集成电路确保了器件的可靠性。 半导体集成电路具有应力使能电路,用于在芯片的测试操作期间产生使能信号并使能测试操作;应力电压供应电路,用于响应输出信号提供第一应力电压和第二应力电压 以及用于接收第一和第二应力电压并用于在测试操作期间延迟读出放大器控制电路的操作的感测延迟控制电路。 在测试操作期间,第一和第二应力电压响应于应力使能电路的输出信号被提供给彼此相邻的字线,并且响应于一个字线检测所选择的存储单元的状态 感测延迟控制电路的输出信号。
    • 90. 发明授权
    • Semiconductor memory device allowing data rewriting electrically
    • 半导体存储器件允许电气数据重写
    • US5606528A
    • 1997-02-25
    • US553910
    • 1995-11-06
    • Yutaka Ikeda
    • Yutaka Ikeda
    • G11C11/401G11C11/409G11C29/00G11C29/04G11C29/06G11C29/34G11C8/00
    • G11C29/34
    • A memory array block MK of the same structure is arranged in all the memory array regions MA of a DRAM. An IO line control circuit connects the other end of a pair of local signal input/output lines to one end of a pair of global signal input/output lines in an opposite phase or a positive phase in response to one end of the corresponding pair of local signal input/output lines being connected to an even numbered bit line pair of the upper row of memory array region MA or an odd numbered bit line pair of the lower row of memory array region MA. Since the memory array blocks MK in all the memory array region MA have the same structure, a memory cell corresponding to a defective address detected in a BI test can easily be identified.
    • 具有相同结构的存储器阵列块MK被布置在DRAM的所有存储器阵列区域MA中。 IO线路控制电路将一对本地信号输入/输出线路的另一端连接到一对全局信号输入/输出线路的一端,以响应相应的一对 本地信号输入/输出线连接到存储器阵列区域MA的上一行或存储器阵列区域MA的下行的奇数位线对中的偶数位线对。 由于所有存储器阵列区域MA中的存储器阵列块MK具有相同的结构,因此可以容易地识别与在BI测试中检测到的缺陷地址相对应的存储单元。