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    • 82. 发明授权
    • Device for coating a substrate
    • 用于涂覆基材的装置
    • US08353255B2
    • 2013-01-15
    • US12658077
    • 2010-02-02
    • Ralph BeyerStefan LutterRainer Targus
    • Ralph BeyerStefan LutterRainer Targus
    • B05C11/02B05C13/00
    • H01L21/6715H01L21/68H01L21/68785
    • By means of the device for coating a substrate (2; 102) according to the present invention, a homogeneous coating of the substrate (2; 102) can be achieved. The device comprises a holding and rotating means for holding and rotating the substrate (2; 102) about an axis (A). A disk (3) is provided below the substrate (2; 102). Said disk (3) is arranged coaxially with respect to the substrate (2; 102), has at least the same diameter as the substrate (2; 102) and is able to rotate synchronously with the substrate (2; 102). By means of the disk (3), air swirls at the edge of and below the substrate (2; 102) are avoided during coating of the substrate (2; 102). Thus, it is possible to obtain a homogeneous coating. For being able to load and unload a substrate (2; 102) into and out of the device by means of a conventional gripper system (6), the distance between substrate (2; 102) and disk (3) is increased during loading and unloading.
    • 通过根据本发明的用于涂覆基底(2; 102)的装置,可以实现基底(2; 102)的均匀涂层。 该装置包括用于围绕轴线(A)保持和旋转基底(2; 102)的保持和旋转装置。 在所述基板(2; 102)的下方设置有盘(3)。 所述盘(3)相对于所述基底(2; 102)同轴布置,具有与所述基底(2; 102)至少相同的直径并且能够与所述基底(2; 102)同步旋转。 通过盘(3),在衬底(2; 102)的涂覆期间避免在衬底(2; 102)的边缘和下方的空气涡流。 因此,可以获得均匀的涂层。 为了能够通过传统的夹具系统(6)将衬底(2; 102)装载和卸载到装置中,衬底(2; 102)和盘(3)之间的距离在装载期间增加,并且 卸货
    • 85. 发明授权
    • Substrate processing apparatus and substrate processing method
    • 基板加工装置及基板处理方法
    • US08268384B2
    • 2012-09-18
    • US12887019
    • 2010-09-21
    • Nobuaki MatsuokaYoshio KimuraAkira Miyata
    • Nobuaki MatsuokaYoshio KimuraAkira Miyata
    • B05C13/02B05C11/00B05C11/02B05D3/12H01L21/20
    • H01L21/67173H01L21/67178H01L21/67184H01L21/67276H01L21/67754
    • A substrate transfer system to reduce total processing time by transferring a substrate at a first delivery stage to a process block where processing can be carried out earliest. The substrate processing apparatus includes a first transfer device delivering a wafer with respect to a substrate carrier, and a second transfer device delivering a wafer between a plurality of process blocks and the first transfer device via a first delivery stage, to transfer the wafer with respect to the process blocks. The process block where there is no wafer or where processing of the last wafer within the relevant process block will be completed earliest is determined based on processing information of the wafers from the process blocks, and the wafer of the first delivery stage is transferred by the second transfer device to the relevant process block. This ensures smooth transfer of the wafer to the process block.
    • 一种基板转印系统,用于通过在第一递送阶段将基底转移到可以最早进行处理的工艺块来减少总处理时间。 衬底处理设备包括相对于衬底载体传送晶片的第一传输装置和经由第一传送级在多个处理块和第一传送装置之间传送晶片的第二传送装置,以相对于 到过程块。 基于来自处理块的晶片的处理信息,确定最早期完成相关处理块内没有晶片或最后晶片的处理块的处理块,并且第一传送阶段的晶片由 第二传输设备到相关进程块。 这确保晶片平滑地转移到处理块。
    • 86. 发明授权
    • Method and equipment for making abrasive particles in even distribution, array pattern and preferred orientation
    • 使研磨颗粒均匀分布,阵列图案和优选取向的方法和设备
    • US08262758B2
    • 2012-09-11
    • US12115474
    • 2008-05-05
    • Weixing Gao
    • Weixing Gao
    • B24D3/14C09C1/68C09K3/14B05C11/02
    • B24D18/00B22F2998/00C09K3/1409C22C2202/02B22F1/02
    • An equipment for making abrasive particles in even distribution, array pattern and preferred orientation comprises an adsorbing releasing apparatus being composed of a plurality of acicular soft magnetic metallic sticks, an upper and a lower stators, and a plurality of windings. Each winding forms an electric circuit through a electrical source, a resistance, and a switch a plurality of blind holes being distributed on face of the blind hole feeding tropism board. Using electric current to form magnetic field for the acicular soft magnetic metallic sticks absorb or release abrasive particles plated with soft magnetic materials. The equipment is simple, convenient in operation, high in efficiency and reliability. The equipment makes abrasive particles in matrix with an ideal state in distributing density, uniformity, arrange, and tropism. Thereby, the function of the abrasive materials is fully exerted and the life of products is prolonged.
    • 用于制造均匀分布,阵列图案和优选取向的磨粒的设备包括由多个针状软磁金属棒,上下定子和多个绕组组成的吸附释放装置。 每个绕组通过电源,电阻和开关形成电路,多个盲孔分布在盲孔馈电向对面板的表面上。 针对软磁金属棒使用电流形成磁场吸收或释放镀有软磁材料的磨料颗粒。 设备简单,操作方便,效率高,可靠性高。 该设备使磨料颗粒在分布密度,均匀性,排列和向性方面具有理想状态的基质。 从而充分发挥研磨材料的功能,延长产品的使用寿命。
    • 88. 发明授权
    • Device and method for wet treating plate-like-articles
    • 用于湿处理板状制品的装置和方法
    • US08231939B2
    • 2012-07-31
    • US12519232
    • 2007-11-19
    • Michael BruggerAlexander Schwarzfurtner
    • Michael BruggerAlexander Schwarzfurtner
    • B05D3/12B05C11/02B05C5/00
    • H01L21/68735G03F7/162H01L21/67023H01L21/6704H01L21/67051H01L21/67063H01L21/67075H01L21/6708H01L21/6715
    • A method and device for wet treatment of plate-like articles includes, a chuck for holding a single plate-like article having an upwardly facing surface for receiving liquid running off a plate-like article when being treated with liquid, wherein the chuck is outwardly bordered by a circumferential annular lip. The chuck has an outer diameter greater than the greatest diameter of the plate-like article to be treated, and a rotatable part with an upwardly facing ring-shaped surface for receiving liquid running off the circumferential lip of the chuck. The rotatable part is rotatable with respect to the chuck, the ring-shaped surface is coaxially arranged with respect to the circumferential annular lip, the inner diameter of the ring-shaped surface is smaller than the outer diameter of the chuck, and the distance d between the lip and the upwardly facing ring-shaped surface is in a range from 0.1 mm to 5 mm.
    • 用于板状制品的湿处理的方法和装置包括:用于保持单个板状制品的卡盘,其具有向上表面,用于在用液体处理时接收从板状物品流出的液体,其中卡盘向外 由圆周环形唇形边界。 卡盘具有大于待处理的板状物品的最大直径的外径,以及具有朝上的环形表面的可旋转部分,用于接收从卡盘的周缘移出的液体。 可旋转部分相对于卡盘可旋转,环形表面相对于周向环形唇缘同轴布置,环形表面的内径小于卡盘的外径,距离d 在唇缘和向上的环形表面之间的距离在0.1mm至5mm的范围内。