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    • 5. 发明授权
    • Radioisotope power source package for microelectronics
    • 用于微电子的放射性同位素电源封装
    • US08634201B1
    • 2014-01-21
    • US12958371
    • 2010-12-01
    • Peter CabauyBret J. ElkindDenset SerraltaJesse Grant
    • Peter CabauyBret J. ElkindDenset SerraltaJesse Grant
    • H05K1/16
    • H01L23/50G21H1/00H01L2924/0002H05K1/181H05K1/186H05K3/4602H05K2201/10037H05K2201/10378Y02P70/611H01L2924/00
    • An assembly carrying a radioisotope power source for attaching to a printed circuit board. The assembly comprises an integrated circuit package carrying an integrated circuit, the integrated circuit package having first contacts on a lower surface thereof, the integrated circuit requiring connection to a power source, a power source package defining a cavity therein for carrying the radioisotope power source, the power source package having second contacts on an upper surface thereof contacting the first contacts and having third contacts on a lower surface thereof for contacting fourth contacts on the printed circuit board, the power source package having conductive vias extending from the second contacts on the upper surface of the power source package to the third contacts on the lower surface of the power source package, one or more of the vias having a fan-in segment, a fan-out segment and a substantially vertical segment therebetween, and electrical signals passing between the integrated circuit and the printed circuit board through the conductive vias and power passing from the radioisotope power source into the integrated circuit through one or more of the substantially vertical segments and the fan out segments.
    • 一种携带用于附着到印刷电路板的放射性同位素电源的组件。 该组件包括承载集成电路的集成电路封装,集成电路封装在其下表面上具有第一触点,该集成电路需要连接到电源,在其中限定其中用于承载放射性同位素电源的空腔的电源封装, 所述电源封装在其上表面上具有接触所述第一触点的第二触点,并且在其下表面上具有用于接触所述印刷电路板上的第四触点的第三触点,所述电源封装具有从所述第二触点上延伸的导电通孔 电源封装的表面到电源封装的下表面上的第三触点,一个或多个通孔具有扇形段,扇出段和其间的基本垂直的段,以及电信号之间的电信号 集成电路和印刷电路板通过导电通孔和电源通孔 g从放射性同位素电源通过一个或多个基本上垂直的部分和扇出部分进入集成电路。