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1. 发明申请

US20230134445A1 FILTER CARTRIDGE ASSEMBLY 有权
公开(公告)号：US20230134445A1
公开(公告)日：2023-05-04
申请号：US17977762
申请日：2022-10-31
申请人： ENTEGRIS, INC.
发明人： Jean Camille Lu Ersando , Barry Lee Gregerson
IPC分类号： B01D35/30 , B01D29/17
摘要： A filter assembly for filtering liquid includes a filter housing and a filter cartridge disposed in an enclosed space of the filter housing. The filter housing including a cap affixed to the bowl to form the enclosed space. The cap including a fluid inlet port, a fluid outlet port, and a gas venting port for the enclosed space. The filter cartridge includes radial projections disposed in slots of the bowl blocking rotation of the filter cartridge relative to the bowl. A method of making a filter assembly includes inserting a filter cartridge into a bowl, and affixing the cap to the bowl.

2. 发明申请

US20230130079A1 HIGH VAPOR PRESSURE DELIVERY SYSTEM 有权
公开(公告)号：US20230130079A1
公开(公告)日：2023-04-27
申请号：US17972242
申请日：2022-10-24
申请人： ENTEGRIS, INC.
发明人： Scott L. Battle , John N. Gregg , Donn K. Naito , Bryan Hendrix
IPC分类号： C23C16/448 , C23C16/52
摘要： A system includes a vaporizer vessel. The vaporizer vessel includes an outlet fluidly connected to the vaporizer vessel. A heater is configured to heat the vaporizer vessel. A valve is configured to regulate a pressure of a vaporized material at the outlet. In response to the pressure at the outlet being outside a set pressure range, the heater is configured to increase or decrease heat to the vaporizer vessel.

3. 发明申请

US20230112884A1 MODULAR TRAY FOR SOLID CHEMICAL VAPORIZING CHAMBER 有权
公开(公告)号：US20230112884A1
公开(公告)日：2023-04-13
申请号：US17961470
申请日：2022-10-06
申请人： ENTEGRIS, INC.
发明人： Scott L. Battle , Jacob Thomas , Benjamin H. Olson , John N. Gregg
IPC分类号： C23C16/448 , C23C16/455
摘要： A modular tray for an ampoule of a delivery system of solid precursor materials used in Atomic Layer Deposition (ALD) processes, Chemical Vapor Deposition (CVD) processes or both. The modular tray is configured with separate components which can enhance the ease of which the modular tray can be inserted into the ampoule, and the tray is configured to make improved contact with inner wall surfaces of the ampoule to provide improved heat transfer from the inner wall to the modular tray and ultimately to the solid precursor materials disposed on the modular tray.

4. 发明申请

US20230099075A1 PURGE PORT FILTER SUPPORT 有权
公开(公告)号：US20230099075A1
公开(公告)日：2023-03-30
申请号：US17953017
申请日：2022-09-26
申请人： ENTEGRIS, INC.
发明人： Shawn D. Eggum
IPC分类号： B01D46/00 , B01D46/10
摘要： A front opening unified pod includes a housing and a purge port in the housing. The purge port includes a filter membrane and a purge filter support. The purge filter support includes an outer ring structure and a support frame working. The support framework extends from the outer ring structure The outer ring structure includes a plurality of supports that provide a support surface for the filter membrane. One or more of the supports respectively increase in thickness from a thickness for the upper support surface. A purge filter support includes an outer ring structure, and one or more openings, a support framework that extends from the outer ring structure. The support framework includes a supports that provide a support surface configured to contact and support a filter membrane. One or more supports each increase in thickness from a first thickness of the upper support surface.

5. 发明申请

US20230098280A1 SYNTHESIS OF FLUOROALKYL TIN PRECURSORS 有权
公开(公告)号：US20230098280A1
公开(公告)日：2023-03-30
申请号：US17941931
申请日：2022-09-09
申请人： ENTEGRIS, INC.
发明人： David Kuiper
IPC分类号： C07F7/22 , C23C16/18
摘要： The invention provides certain fluorinated alkyl tin compounds which are believed to be useful in the vapor deposition of tin-containing films onto the surface of microelectronic device substrates. Also provided are processes for the preparation of the precursor compounds and processes for the use of such compounds in the deposition of tin-containing films onto microelectronic device substrates.

6. 发明申请

US20230088106A1 PROCESS CARRIER 有权
公开(公告)号：US20230088106A1
公开(公告)日：2023-03-23
申请号：US17948923
申请日：2022-09-20
申请人： ENTEGRIS, INC.
发明人： Lim Joo Chai , Michael C. Zabka
IPC分类号： B65D25/10 , B65D1/36
摘要： A process container includes flanges defining a plurality of slots. At least one of the flanges includes a tightener configured to contact a disc or wafer when the disc or wafer is inserted into one of the plurality of slots defined by said at least one of the plurality of flanges. The tightener projects outwards from said at least one of the plurality of flanges into said one of the plurality of slots. The tightener includes a tapered portion where a cross-sectional thickness of the at least one tightener increases along an insertion direction of the disc or wafer into said one of the plurality of slots. The tightener can include one continuous slope or curve. The tightener can include a chamfer. The tightener has a reduced contact area and a smooth transition as it extends from the flange, reducing rubbing and the corresponding particle shedding when discs or wafers are inserted into, removed from, or moving while stored within the process container.

7. 发明申请

US20230079446A1 COMPOSITE ADSORBENT-CONTAINING BODIES AND RELATED METHODS 有权
公开(公告)号：US20230079446A1
公开(公告)日：2023-03-16
申请号：US17945594
申请日：2022-09-15
申请人： ENTEGRIS, INC.
发明人： Rocky Dean Gipson , Ed A. Sturm , Subhash Guddati , Thines Kumar Perumal , Montray Leavy
IPC分类号： B01J20/28 , B01D53/04 , B01J20/22 , B01J20/20 , B01J20/26 , B01J20/18
摘要： Described are composite adsorption media that contain two or more different types of adsorbent material in binder, that may preferably be prepared by additive manufacturing techniques, as well as methods of preparing the structures by additive manufacturing methods.

8. 发明申请

US20230043590A1 BULK CONTAINER HAVING STEEL OVERPACK 有权
公开(公告)号：US20230043590A1
公开(公告)日：2023-02-09
申请号：US17790066
申请日：2020-12-23
申请人： ENTEGRIS, INC.
发明人： Raymond Wolf , Dale A. Maenke , Jacob Littfin , John M. Hennen
IPC分类号： B65D81/20 , B65D88/06 , B65D90/10 , B65D90/36 , B65D77/06
摘要： A fire-safe container includes a polymer polymeric IBC within a metal overpack. The metal overpack includes a manway surrounding a plurality of ports. Each port is on a projection form the polymeric IBC that extends into the manway through an aperture. A collar is disposed in each aperture between the projection of the polymeric IBC and the sides of the aperture such that the port is retained in the manway and preventing the port from contacting or collapsing through the aperture. The manway includes a burst disc to release pressure when there is pressure buildup. One of the ports can provide another burst disc to relieve pressure in the polymeric IBC. The polymeric IBC burst disc can release at a pressure that is greater than the pressure at which the manway burst disc releases.

9. 发明申请

US20230042148A1 METHODS FOR APPLYING A BLANKET POLYMER COATING TO A SUBSTRATE 有权
公开(公告)号：US20230042148A1
公开(公告)日：2023-02-09
申请号：US17867530
申请日：2022-07-18
申请人： ENTEGRIS, INC.
发明人： Yan Liu , Yuxuan Liu , Chandra Venkatraman , Carlo Waldfried
IPC分类号： B05D3/06 , H01L21/683 , B05D3/02 , B05D1/02
摘要： Described are techniques for applying a cured polymeric blanket coating onto a surface, specifically for applying a blanket-coated cured polymeric coating onto a surface of a substrate that is useful as an electrostatic chuck for processing semiconductor wafers.

10. 发明申请

US20230041086A1 VAPOR DEPOSITION PRECURSOR COMPOUNDS AND PROCESS OF USE 有权
公开(公告)号：US20230041086A1
公开(公告)日：2023-02-09
申请号：US17901569
申请日：2022-09-01
申请人： ENTEGRIS, INC.
发明人： Philip S.H. Chen , Eric Condo , Bryan C. Hendrix , Thomas H. Baum , David Kuiper
IPC分类号： C07F7/10 , C01B21/082 , C07F7/18 , C07F7/08 , C23C16/455 , H01L21/02 , C23C16/36 , C23C16/30
摘要： Provided is a plasma enhanced atomic layer deposition (PEALD) process for depositing etch-resistant SiOCN films. These films provide improved growth rate, improved step coverage and excellent etch resistance to wet etchants and post-deposition plasma treatments containing O2 and NH3 co-reactants. This PEALD process relies on one or more precursors reacting in tandem with the plasma exposure to deposit the etch-resistant thin-films of SiOCN. The films display excellent resistance to wet etching with dilute aqueous HF solutions, both after deposition and after post-deposition plasma treatment(s). Accordingly, these films are expected to display excellent stability towards post-deposition fabrication steps utilized during device manufacturing and build.

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