会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Method of making PIN-type photo detecting element with a controlled thickness of window semiconductor layer
    • 制造具有受控厚度的窗口半导体层的PIN型光电检测元件的方法
    • US08105866B2
    • 2012-01-31
    • US12711881
    • 2010-02-24
    • Yoshihiro YonedaRyuji Yamabi
    • Yoshihiro YonedaRyuji Yamabi
    • H01L21/00H01L31/102H01L21/027H01L21/20
    • H01L31/105H01L31/03046H01L31/1035H01L31/18
    • A semiconductor photo detecting element includes a PIN-type photo detecting element and window semiconductor layer. The PIN-type photo detecting element has a semiconductor substrate, a first semiconductor layer, a second semiconductor layer and a third semiconductor layer. The first semiconductor layer is provided on the semiconductor substrate, is lattice-matched to the semiconductor substrate, includes a first conductivity type dopant, and has first band gap energy. The second semiconductor layer is provided on the first semiconductor layer, has the first band gap energy, and has a concentration of the first conductivity type dopant lower than that of the first semiconductor layer or is substantially undoped. The third semiconductor layer is provided on the second semiconductor layer. The window semiconductor layer has second band gap energy larger than the first band gap energy at a light-incoming side with respect to the second semiconductor layer and has a thickness of 5 nm to 50 nm.
    • 半导体光电检测元件包括PIN型光检测元件和窗半导体层。 PIN型光检测元件具有半导体衬底,第一半导体层,第二半导体层和第三半导体层。 第一半导体层设置在半导体衬底上,与半导体衬底晶格匹配,包括第一导电型掺杂剂,并且具有第一带隙能量。 第二半导体层设置在第一半导体层上,具有第一带隙能量,并且第一导电类型掺杂物的浓度低于第一半导体层的浓度或基本上未掺杂。 第三半导体层设置在第二半导体层上。 窗口半导体层具有比相对于第二半导体层的光入射侧的第一带隙能量大的第二带隙能量,并且具有5nm至50nm的厚度。
    • 7. 发明授权
    • Semiconductor device and method of manufacturing the same
    • 半导体装置及其制造方法
    • US07560346B2
    • 2009-07-14
    • US11727962
    • 2007-03-29
    • Takeshi Igarashi
    • Takeshi Igarashi
    • H01L21/336H01L29/76
    • H01L27/0207H01L27/0605H01L27/088H01L29/41758H01L29/42316
    • A semiconductor device includes: a first FET that is formed with first unit FETs each having a first finger electrode and a second finger electrode provided on either side of a gate finger electrode, the first unit FETs being connected in parallel; and a second FET that is formed with second unit FETs each having a first finger electrode and a second finger electrode provided on either side of a gate finger electrode, the second unit FETs being connected in parallel. In this semiconductor device, the second finger electrode of each of the first unit FETs and the first finger electrode of each corresponding one of the second unit FETs form a common finger electrode, and the first finger electrodes of the first unit FETs, the second finger electrodes of the second unit FETs, and the common finger electrodes are arranged in the gate length direction of the first FET and the second FET.
    • 半导体器件包括:第一FET,其形成有第一单元FET,每个第一单元FET具有设置在栅极指电极的任一侧上的第一指状电极和第二指状电极,所述第一单元FET并联连接; 以及第二FET,其由具有设置在栅极指状电极的任一侧上的第一指状电极和第二指状电极的第二单位FET形成,所述第二单位FET并联连接。 在该半导体器件中,第一单位FET中的每一个的第二指状电极和每个对应的一个第二单位FET的第一指状电极形成公共指状电极,并且第一单位FET的第一指状电极,第二指状物 第二单元FET的电极和公共指状电极排列在第一FET和第二FET的栅极长度方向上。