专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US11230644B1 Coating film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin composite 有权
公开(公告)号：US11230644B1
公开(公告)日：2022-01-25
申请号：US17188460
申请日：2021-03-01
申请人： MEC COMPANY LTD.
发明人： Koki Morikawa , Masahiro Hayashizaki , Motohiro Nakano , Masataka Araki
IPC分类号： C09D1/00 , B32B37/12 , B32B15/08 , B32B15/20
摘要： Provided are a coating film-forming composition for forming a coating film on a metal surface that exhibits excellent adhesiveness between a metal and a resin, and a surface-treated metal member having a coating film formed by using the composition. The coating film-forming composition is a solution containing a silane coupling agent having an amino group, a metallic ion and a halide ion. The metallic ion is preferably a copper ion, and a copper ion concentration in the solution is preferably 0.1 to 60 mM. The amount of Si based on the amount of Cu in the solution is preferably 30 or less, in terms of molar ratio. The pH of the solution is preferably 2.8 to 6.2.

2. 发明申请

US20200325583A1 Method for Producing Film Formation Substrate, Film Formation Substrate, and Surface Treatment Agent 审中-公开
公开(公告)号：US20200325583A1
公开(公告)日：2020-10-15
申请号：US16753986
申请日：2018-10-11
申请人： MEC COMPANY., LTD.
发明人： Kenji Nisie , Yuki Oka , Tomoko Ichihashi , Takuto Fujii
IPC分类号： C23C22/52 , B05D1/26 , B05D7/14 , B05D3/12 , C09D11/30
摘要： An object is to provide, for example, a method for manufacturing a film-forming substrate that can sufficiently improve both bleeding of a resin composition and adhesion between the resin composition and a metal substrate surface. For example, provided is a method for manufacturing a film-forming substrate having a film of a resin composition formed on a metal substrate surface, the method including: an etching step of etching a metal substrate surface with a micro-etching agent; a surface treatment step of bringing the etched metal substrate surface into contact with a surface treatment agent to perform a surface treatment such that a contact angle of water on the surface is 50° or more and 150° or less; and a film forming step of forming a film of a resin composition on the surface-treated metal substrate surface by an inkjet method.

3. 发明授权

US09932678B2 Microetching solution for copper, replenishment solution therefor and method for production of wiring board 有权
公开(公告)号：US09932678B2
公开(公告)日：2018-04-03
申请号：US15224825
申请日：2016-08-01
申请人： MEC COMPANY LTD.
发明人： Masayo Kurii , Kiyoto Tai , Mami Nakamura
IPC分类号： C09G1/04 , C09K13/00 , C23F1/18 , H05K3/38 , H05K3/02 , C23F1/34 , H05K3/00
CPC分类号： C23F1/18 , C23F1/34 , H05K3/0085 , H05K3/022 , H05K3/383 , H05K2203/0307 , H05K2203/0789
摘要： Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.

4. 发明申请

US20120260821A1 COATING-FORMING LIQUID COMPOSITION AND COATING-FORMING METHOD THEREWITH 有权
标题翻译：涂料成型液体组合物及其成膜方法
公开(公告)号：US20120260821A1
公开(公告)日：2012-10-18
申请号：US13446962
申请日：2012-04-13
申请人： Yoichi SENGOKU , Masami TSUTAE , Kiyoto TAI , Keisuke JOKO , Tsuyoshi AMATANI
发明人： Yoichi SENGOKU , Masami TSUTAE , Kiyoto TAI , Keisuke JOKO , Tsuyoshi AMATANI
IPC分类号： C09J9/00
CPC分类号： C23C22/52 , C23C18/1689 , C23C22/68 , H05K3/0079 , H05K3/108 , H05K2203/124
摘要： Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25° C., and a salt thereof, has a pH of more than 4 and not more than 7 at 25° C., and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating.
摘要翻译：本发明提供：能够形成用于将铜键合到感光性树脂上的涂层的涂布形成液体组合物，其包含含有仅具有氮作为环杂原子的唑类的水溶液，具有酸解离常数的倒数的对数的酸在25℃下为3〜8，其盐在25℃下的pH为4以上7以下，可以稳定地形成用于提高铜与感光性树脂之间的粘合性的涂层，即使在连续或反复使用; 以及形成用于将铜结合到感光性树脂上的涂层的方法，其包括使铜的表面与涂覆液形成液体组合物接触以形成涂层。

5. 发明申请

US20100029969A1 COPPER COMPOUND AND METHOD FOR PRODUCING COPPER THIN FILM USING THE SAME 审中-公开
标题翻译：铜化合物和使用该铜复合薄膜的方法
公开(公告)号：US20100029969A1
公开(公告)日：2010-02-04
申请号：US12578182
申请日：2009-10-13
申请人： Minoru OTANI , Jun HISADA , Toyoki MAWATARI
发明人： Minoru OTANI , Jun HISADA , Toyoki MAWATARI
IPC分类号： C07F1/08
CPC分类号： C23C18/08
摘要： The present invention provides a copper compound having a decomposition temperature in a range of 100° C. to 300° C. and including one unit or a plurality of connected units represented by the following Formula (1): [R1COO]n[NH3]mCuX1p (1) where n is 1 to 3; m is 1 to 3; p is 0 to 1; n pieces of R1 respectively represent the following Formula (2), CH2X2, CH2X2(CHX2)q, NH2, or H, and may be the same or different from each other, or n is 2 and two pieces of [R1COO] represent together the following Formula (3); R2, R3, and R4 are respectively CH2X2, CH2X2(CHX2)q, NH2, or H; R5 is —(CHX2)r—; X2 is H, OH, or NH2; r is 0 to 4; q is 1 to 4; and X1 is NH4+, H2O, or solvent molecules According to the above configuration, there are provided a copper compound capable of forming a copper thin film required for producing an electronic device or the like safely, inexpensively, and easily, and a method for producing a copper thin film using the copper compound.
摘要翻译：本发明提供一种铜化合物，其分解温度在100℃至300℃的范围内，并且包括由下式（1）表示的一个单元或多个连接单元：[R 1 COO] n [NH 3] mCuX1p（1）其中n为1至3; m为1〜3; p为0〜1; n个R1分别表示下式（2），CH2X2，CH2X2（CHX2）q，NH2或H，可以相同或不同，或n为2，两个[R 1 COO]表示在一起以下公式（3）; R2，R3和R4分别是CH2X2，CH2X2（CHX2）q，NH2或H; R5是 - （CHX2）r-; X2是H，OH或NH2; r为0〜4; q为1〜4; X 1为NH 4 +，H 2 O或溶剂分子根据上述结构，提供了能够安全，廉价且容易地形成电子器件等制造所需的铜薄膜的铜化合物及其制造方法使用铜化合物的铜薄膜。

6. 发明申请

US20080261020A1 Adhesive layer for resin and a method of producing a laminate including the adhesive layer 审中-公开
标题翻译：用于树脂的粘合剂层和包括粘合剂层的层压体的制造方法
公开(公告)号：US20080261020A1
公开(公告)日：2008-10-23
申请号：US11904435
申请日：2007-09-27
申请人： Mutsuyuki Kawaguchi , Satoshi Saitou , Masashi Deguchi , Tsuyoshi Amatani
发明人： Mutsuyuki Kawaguchi , Satoshi Saitou , Masashi Deguchi , Tsuyoshi Amatani
IPC分类号： B32B15/08 , B32B3/26
CPC分类号： C08J5/12 , B32B15/08 , H05K3/384 , H05K3/389 , H05K2201/0116 , H05K2203/0307 , H05K2203/072 , Y10T428/24999
摘要： An adhesive layer for resin according to the present invention is formed of copper or a copper alloy for adhering a resin to a layer of copper or a copper alloy. The adhesive layer is formed of a metal layer of a coralloid structure made of an aggregation of a number of particles of copper or a copper alloy with gaps between the particles, and a plurality of micropores are present on the surface. The micropores have an average diameter in a range of 10 nm to 200 nm, and at least two micropores in average are present per 1 μm2 of the metal layer surface. Thereby, sufficient adhesion between the resin and the copper or copper alloy is provided. This serves to prevent ion migration caused by dendrites, which has been a problem in a conventional layer of tin or a tin alloy, and the adhesion to a resin having a high-glass transition temperature (Tg) is improved as well. The present invention also provides a method of producing a laminate including the adhesive layer.
摘要翻译：根据本发明的用于树脂的粘合剂层由用于将树脂粘附到铜或铜合金层的铜或铜合金形成。粘合剂层由金属层构成，该金属层由多个铜颗粒或铜合金的颗粒聚集而形成，其间具有间隙，并且表面上存在多个微孔。微孔的平均直径在10nm至200nm的范围内，并且每1mum2的金属层表面平均存在至少两个微孔。由此，提供了树脂与铜或铜合金之间的充分粘附。这用于防止在常规的锡或锡合金层中已经存在问题的枝晶引起的离子迁移，并且对具有高玻璃化转变温度（Tg）的树脂的粘附性也得到改善。本发明还提供一种制造包括粘合剂层的层压体的方法。

7. 发明授权

US07431861B2 Etchant, replenishment solution and method for producing copper wiring using the same 有权
标题翻译：蚀刻剂，补充溶液及使用其制造铜线的方法
公开(公告)号：US07431861B2
公开(公告)日：2008-10-07
申请号：US10896465
申请日：2004-07-22
申请人： Kenji Toda , Yukari Morinaga , Takahiro Teshima , Ai Kuroda
发明人： Kenji Toda , Yukari Morinaga , Takahiro Teshima , Ai Kuroda
IPC分类号： C03C15/00
CPC分类号： C23F1/18 , H05K3/067 , H05K2203/124
摘要： An etchant for copper and copper alloys, includes an aqueous solution containing: 14 to 155 g/liter of cupric ion source in terms of a concentration of copper ions; 7 to 180 g/liter of hydrochloric acid; and 0.1 to 50 g/liter of azole, the azole including nitrogen atoms only as heteroatoms residing in a ring. A method for producing a wiring by etching of copper or copper alloys, includes the step of: etching a portion of a copper layer on an electrical insulative member that is not covered with an etching resist using the above-described etchant so as to form the wiring. Thereby, a fine and dense wiring pattern with reduced undercut can be formed.
摘要翻译：铜和铜合金的蚀刻剂包括含有以铜离子浓度计的14至155g /升铜离子源的水溶液; 7〜180g / l盐酸; 和0.1至50g / l的唑，唑类仅包括驻留在环中的杂原子的氮原子。通过蚀刻铜或铜合金制造布线的方法包括以下步骤：使用上述蚀刻剂蚀刻未被抗蚀剂覆盖的电绝缘构件上的铜层的一部分，以形成接线。由此，可以形成具有减小的底切的精密且致密的布线图案。

8. 发明申请

US20080073614A1 Metal removing solution and metal removing method using the same 审中-公开
标题翻译：金属去除溶液及使用其的金属去除方法
公开(公告)号：US20080073614A1
公开(公告)日：2008-03-27
申请号：US11903837
申请日：2007-09-25
申请人： Daisaku Akiyama , Daisuke Katayama
发明人： Daisaku Akiyama , Daisuke Katayama
IPC分类号： C09K13/08
CPC分类号： H05K3/26 , C23F1/30 , C23F1/44 , H05K3/108 , H05K3/181 , H05K2201/0761
摘要： A metal removing solution of the present invention is a solution for removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, and the metal removing solution contains a chain thiocarbonyl compound. A removing method of the present invention for removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy is a method for selectively removing a metal other than copper or copper alloy, from a system that includes copper or copper alloy and at least one selected from palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, by using a metal removing solution containing a chain thiocarbonyl compound. Thus, the present invention provides the metal removing solution capable of removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, the solution having an excellent property of removing palladium, tin, silver, palladium alloy, silver alloy, tin alloy, and the like without attacking copper, and having an excellent handleability since the solution does not contain any toxic substance; and the removing method using the foregoing metal removing solution.
摘要翻译：本发明的金属去除溶液是用于除去钯，锡，银，钯合金，银合金和锡合金的溶液，金属去除溶液含有链硫代羰基化合物。本发明的除去钯，锡，银，钯合金，银合金，锡合金的除去方法是从包含铜或铜合金的系统中选择除去铜或铜合金以外的金属的方法，通过使用含有链硫代羰基化合物的金属去除溶液，选自钯，锡，银，钯合金，银合金和锡合金中的至少一种。因此，本发明提供能够除去钯，锡，银，钯合金，银合金和锡合金的金属去除溶液，该溶液具有优异的除去钯，锡，银，钯合金，银合金，锡合金等而不侵蚀铜，并且由于溶液不含任何有毒物质，因此具有优异的可操作性; 以及使用上述金属去除溶液的除去方法。

9. 发明申请

US20080011981A1 Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the same 审中-公开
标题翻译：蚀刻剂和补充溶液，以及使用其制造布线板的蚀刻方法和方法
公开(公告)号：US20080011981A1
公开(公告)日：2008-01-17
申请号：US11900959
申请日：2007-09-14
申请人： Masayo Kuriyama , Ryo Ogushi , Daisaku Akiyama , Kaoru Urushibata
发明人： Masayo Kuriyama , Ryo Ogushi , Daisaku Akiyama , Kaoru Urushibata
IPC分类号： C09K13/04 , C09K13/06
CPC分类号： H05K3/26 , C23F1/28 , C23F1/30 , H05K3/181 , H05K2201/0761 , H05K2203/0789 , H05K2203/124
摘要： An etchant of the present invention includes an aqueous solution containing hydrochloric acid, nitric acid, and a cupric ion source. An etching method of the present invention includes bringing the etchant into contact with at least one metal selected from nickel, chromium, nickel-chromium alloys, and palladium. Another etching method of the present invention includes bringing a first etchant that includes an aqueous solution containing at least the following components A to C (A. hydrochloric acid; B. at least one compound selected from the following (a) to (c): (a) compounds with 7 or less carbon atoms, containing a sulfur atom(s) and at least one group selected from an amino group, an imino group, a carboxyl group, a carbonyl group, and a hydroxyl group; (b) thiazole; and (c) thiazole compounds; and C. a surfactant) into contact with a surface of the metal, and then bringing a second solution that includes an aqueous solution containing hydrochloric acid, nitric acid, and a cupric ion source into contact with the surface of the metal. According to the etchant and the etching methods of the present invention, it is possible to etch at least one metal selected from nickel, chromium, nickel-chromium alloys, and palladium quickly and suppress excessive dissolution of copper.
摘要翻译：本发明的蚀刻剂包括含有盐酸，硝酸和铜离子源的水溶液。本发明的蚀刻方法包括使蚀刻剂与选自镍，铬，镍 - 铬合金和钯中的至少一种金属接触。本发明的另一种蚀刻方法包括使包含至少含有以下组分A至C的水溶液的第一蚀刻剂（A.盐酸; B.至少一种选自以下（a）至（c）的化合物：（a）具有7个以下碳原子的含有硫原子和至少1个选自氨基，亚氨基，羧基，羰基和羟基的基团的化合物;（b）噻唑 ;和（c）噻唑化合物;和C.a表面活性剂）与金属的表面接触，然后使包含含有盐酸，硝酸和铜离子源的水溶液的第二溶液与金属表面。根据本发明的蚀刻剂和蚀刻方法，可以快速地蚀刻选自镍，铬，镍 - 铬合金和钯中的至少一种金属并抑制铜的过度溶解。

10. 发明授权

US07297757B2 Resin surface treating agent and resin surface treatment 失效
标题翻译：树脂表面处理剂和树脂表面处理
公开(公告)号：US07297757B2
公开(公告)日：2007-11-20
申请号：US11153968
申请日：2005-06-16
申请人： Sachiko Nakamura , Yoshinari Miyata , Terukazu Ishida , Miho Misumi
发明人： Sachiko Nakamura , Yoshinari Miyata , Terukazu Ishida , Miho Misumi
IPC分类号： C08F6/00
CPC分类号： C08J7/06 , C08J7/12 , H05K3/381
摘要： The present invention relates to a resin surface treating agent containing as an effective component at least one cerium compound selected from tetravalent and trivalent cerium compounds. The surface treating method of the present invention is a method of bringing a surface of a resin into contact with a surface treating agent containing as an effective component at least one cerium compound selected from tetravalent and trivalent cerium compounds, and thereafter treating the surface with an acidic aqueous solution. This activates the resin surface and thereby increases a strength of adhesion of, for instance, a polyimide-based resin film with metal wires, as well as a strength of adhesion of a polyimide-based resin film with another resin. Thus, a resin surface treating agent that provides excellent productivity and reduces processing costs, as well as a surface treating method using the same, are provided.
摘要翻译：本发明涉及含有至少一种选自四价和三价铈化合物的铈化合物作为有效成分的树脂表面处理剂。本发明的表面处理方法是使树脂的表面与含有选自四价和三价铈化合物的至少一种铈化合物作为有效成分的表面处理剂接触，然后用酸性水溶液。这激活树脂表面，从而增加例如具有金属线的聚酰亚胺系树脂膜的粘附强度，以及聚酰亚胺系树脂膜与其他树脂的粘合强度。因此，提供了提供优异的生产率和降低加工成本的树脂表面处理剂以及使用其的表面处理方法。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式