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1. 发明申请

US20180264783A1 Metal Foil, Metal Foil Having Release Layer, Laminated Material, Printed Wiring Board, Semiconductor Package, Electronic Device, And Method For Producing Printed Wiring Board 审中-公开
公开(公告)号：US20180264783A1
公开(公告)日：2018-09-20
申请号：US15761274
申请日：2016-09-23
申请人： JX Nippon Mining & Metals Corporation
发明人： Terumasa Moriyama , Masafumi Ishii
IPC分类号： B32B15/08 , B32B15/20 , C25D1/04 , C25D1/22 , C25D7/06 , C25D5/16 , H05K3/38 , H05K3/46
CPC分类号： B32B15/08 , B32B15/04 , B32B15/20 , C23C18/1605 , C23C18/38 , C25D1/04 , C25D1/22 , C25D3/38 , C25D3/562 , C25D5/16 , C25D7/0614 , C25D9/08 , H05K3/108 , H05K3/381 , H05K3/384 , H05K3/426 , H05K3/46 , H05K3/4661 , H05K2201/0355 , H05K2203/1152
摘要： Such a metal foil is provided that a release layer is provided on a metal foil to enable physical release of a resin substrate, to which the metal foil is adhered, and thereby in the step of removing the metal foil from the resin substrate, the metal foil can be removed with good cost without damaging the surface profile of the metal foil transferred to the surface of the resin substrate, and also resins having different resin components can be adhered with good adhesion. A metal foil containing, on at least one surface of the metal foil, surface unevenness having a root mean square height Sq of from 0.25 to 1.6 μm.

2. 发明授权

US10076032B2 Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board 有权
公开(公告)号：US10076032B2
公开(公告)日：2018-09-11
申请号：US15127165
申请日：2015-03-19
申请人： SUMITOMO ELECTRIC INDUSTRIES, LTD. , SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.
发明人： Takashi Kasuga , Yoshio Oka , Shigeyoshi Nakayama , Jinjoo Park , Sumito Uehara , Kousuke Miura , Hiroshi Ueda
IPC分类号： H05K1/05 , H05K1/09 , H05K3/02 , H05K3/10 , H05K3/38
CPC分类号： H05K1/092 , H05K1/05 , H05K3/022 , H05K3/108 , H05K3/38 , H05K3/384 , H05K2201/0154 , H05K2201/0257 , H05K2203/0709 , H05K2203/072
摘要： A substrate for a printed circuit board includes a base film having an insulating property; a first conductive layer formed on at least one of surfaces of the base film by application of a conductive ink containing metal particles; and a second conductive layer formed, by plating, on a surface of the first conductive layer, the surface being on a side opposite to the base film, wherein a region near an interface between the base film and the first conductive layer contains a metal oxide species based on a metal of the metal particles and a metal hydroxide species based on the metal of the metal particles, the metal oxide species in the region near the interface between the base film and the first conductive layer has a mass per unit area of 0.1 μg/cm2 or more and 10 μg/cm2 or less, and a mass ratio of the metal oxide species to the metal hydroxide species is 0.1 or more.

3. 发明申请

US20180160529A1 Surface Treated Copper Foil, Copper Foil With Carrier, Laminate, Method for Manufacturing Printed Wiring Board, and Method for Manufacturing Electronic Device 审中-公开
公开(公告)号：US20180160529A1
公开(公告)日：2018-06-07
申请号：US15827056
申请日：2017-11-30
申请人： JX Nippon Mining & Metals Corporation
发明人： Hideta Arai , Ryo Fukuchi , Atsushi Miki
IPC分类号： H05K1/09 , H05K3/06
CPC分类号： H05K1/09 , H05K3/0035 , H05K3/007 , H05K3/06 , H05K3/384 , H05K3/4007 , H05K3/421 , H05K2201/0355
摘要： Disclosed is a surface treated copper foil, which is capable of favorably reducing the transmission loss even when used in a high frequency circuit substrate, and after laminating with a resin, heating at a predetermined temperature for a predetermined time (at 180° C. for 10 days), the peel strength of the surface treated copper foil and the resin is favorable.Also disclosed is a surface treated copper foil, comprising a copper foil, and a surface treatment layer on one or both sides of the copper foil, wherein the surface treatment layer has a primary particle layer, or has a primary particle layer and s secondary particle layer in this order from the side of the copper foil; the surface treatment layer contains Zn, a deposition amount of Zn in the surface treatment layer is 150 μg/dm2 or more; the surface treatment layer does not contain Ni, or in the case where the surface treatment layer contains Ni, a deposition amount of Ni in the surface treatment layer is 800 μg/dm2 or less; the surface treatment layer does not contain Co, or in the case where the surface treatment layer contains Co, a deposition amount of Co in the surface treatment layer is 3000 μg/dm2 or less; and a ten point average roughness Rz of an outermost surface of the surface treatment layer is 1.5 μm or less.

4. 发明申请

US20160183380A1 SURFACE-TREATED COPPER FOIL, COPPER FOIL WITH CARRIER, SUBSTRATE, RESIN SUBSTRATE, PRINTED WIRING BOARD, COPPER CLAD LAMINATE AND METHOD FOR PRODUCING PRINTED WIRING BOARD 有权
标题翻译：表面处理铜箔，带载体的铜箔，基板，树脂基板，印刷电路板，铜箔层压板及生产印刷电路板的方法
公开(公告)号：US20160183380A1
公开(公告)日：2016-06-23
申请号：US14907478
申请日：2014-07-23
申请人： JX NIPPON MINING & METALS CORPORATION
发明人： MASAFUMI ISHII , MISATO HONDA , NOBUAKI MIYAMOTO
IPC分类号： H05K3/02 , H05K3/38 , B32B15/08 , H05K3/20
CPC分类号： H05K3/025 , B32B3/26 , B32B15/08 , B32B15/20 , B32B2457/08 , C23C18/1653 , C23C18/405 , C25D1/04 , C25D3/38 , C25D3/562 , C25D3/58 , C25D5/022 , C25D5/10 , C25D5/18 , C25D5/34 , C25D5/48 , C25D7/0614 , C25D7/0671 , H05K1/09 , H05K3/205 , H05K3/384 , H05K3/388 , H05K3/389 , H05K3/427 , H05K2201/0355 , H05K2203/0307 , H05K2203/072 , H05K2203/0726 , H05K2203/1152
摘要： The present invention provides a surface-treated copper foil capable of imparting the profile shape of the substrate surface after removal of the copper foil, the profile shape maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The present invention also provides a resin substrate provided with a profile shape of the surface maintaining fine wiring formability and achieving satisfactory adhesion of electroless copper plating coating. The surface-treated copper foil of the present invention is a surface-treated copper foil having a surface-treated layer formed on a copper foil, and the surface roughness Sz of the surface of the surface-treated layer is 2 to 6 μm.
摘要翻译：本发明提供一种表面处理铜箔，其能够在除去铜箔之后赋予基板表面的轮廓形状，该轮廓形状保持精细的布线成形性并且实现令人满意的无电镀铜镀层的粘合。本发明还提供一种树脂基板，其具有保持精细布线成形性的表面的轮廓形状，并且实现令人满意的无电镀铜镀层的粘附。本发明的表面处理铜箔是在铜箔上形成表面处理层的表面处理铜箔，表面处理层的表面的表面粗糙度Sz为2〜6μm。

5. 发明申请

US20160174364A1 HIGH-SPEED INTERCONNECTS FOR PRINTED CIRCUIT BOARDS 审中-公开
标题翻译：印刷电路板高速互连
公开(公告)号：US20160174364A1
公开(公告)日：2016-06-16
申请号：US14970479
申请日：2015-12-15
申请人： Amphenol Corporation
发明人： Arthur E. Harkness, JR. , Eva M. Kenny-McDermott , Paul W. Farineau , Raymond A. Lavallee , Michael Fancher
IPC分类号： H05K1/02 , H05K1/09 , H05K3/38 , H05K3/46 , H05K3/00 , H05K3/22 , H05K1/03 , H05K1/11
CPC分类号： H05K3/4632 , H05K1/0242 , H05K1/0326 , H05K1/034 , H05K1/0346 , H05K1/0366 , H05K1/0373 , H05K1/09 , H05K1/111 , H05K1/115 , H05K1/116 , H05K3/0073 , H05K3/202 , H05K3/22 , H05K3/38 , H05K3/382 , H05K3/383 , H05K3/384 , H05K3/385 , H05K3/388 , H05K3/389 , H05K3/4658 , H05K3/4685 , H05K2201/0145 , H05K2201/015 , H05K2201/0154 , H05K2201/0158 , H05K2201/0209 , H05K2201/0212 , H05K2203/1194
摘要： High-speed interconnects for printed circuit boards and methods for forming the high-speed interconnects are described. A high-speed interconnect may comprise a region of a conductive film having a reduced surface roughness and one or more regions that have been treated for improved bonding with an adjacent insulating layer. Regions of reduced roughness may be used to carry high data rate signals within PCBs. Regions treated for bonding may include a roughened surface, adhesion-promoting chemical treatment, and/or material deposited to improve wettability of the surface and/or adhesion to a cured insulator.
摘要翻译：描述了用于印刷电路板的高速互连以及用于形成高速互连的方法。高速互连可以包括具有减小的表面粗糙度的导电膜的区域和已经被处理以改善与相邻绝缘层的接合的一个或多个区域。粗糙度降低的区域可用于在PCB内携带高数据速率信号。用于粘合处理的区域可以包括粗糙表面，促进粘附的化学处理和/或沉积以提高表面的润湿性和/或对固化的绝缘体的粘附的材料。

6. 发明申请

US20150237741A1 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：印刷电路板及其制造方法
公开(公告)号：US20150237741A1
公开(公告)日：2015-08-20
申请号：US14333734
申请日：2014-07-17
申请人： Samsung Electro-Mechanics Co., Ltd. , Korea Advanced Institute of Science and Technology
发明人： Yong Jin PARK , Sung Gap Im , Young Gwan Ko , Jae Bum You , Shin Young Kim
IPC分类号： H05K3/38 , H05K3/10 , H05K1/09
CPC分类号： B32B15/08 , B32B7/12 , B32B15/20 , B32B2307/206 , B32B2457/08 , C09J133/14 , H05K3/384 , H05K3/386 , H05K3/387 , H05K2201/0145 , H05K2201/0154
摘要： There are provided a printed circuit board and a manufacturing method thereof. The printed circuit board (PCB) includes an adhesive film disposed between an insulating layer and a circuit pattern, wherein the adhesive film includes poly(glycidyl methacrylate). The printed circuit board may include the adhesive film between the circuit pattern and the insulating layer, and thus, adhesive strength may be increased, while having a low roughness value, a fine circuit pattern may be formed, and reliability thereof may be enhanced.
摘要翻译：提供了印刷电路板及其制造方法。印刷电路板（PCB）包括设置在绝缘层和电路图案之间的粘合膜，其中粘合膜包括聚（甲基丙烯酸缩水甘油酯）。印刷电路板可以包括电路图案和绝缘层之间的粘合膜，因此，可以增加粘合强度，同时具有低粗糙度值，可以形成精细电路图案，并且可以提高其可靠性。

7. 发明申请

US20150129291A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD 审中-公开
标题翻译：印刷电路板和制造印刷电路板的方法
公开(公告)号：US20150129291A1
公开(公告)日：2015-05-14
申请号：US14540028
申请日：2014-11-12
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Sung Won JEONG , Yong Yoon Cho , Jung Hyun Park , Ki Hwan Kim , Da Hee Kim , Gi Ho Han
IPC分类号： H05K1/02 , C23F1/02 , H05K3/38 , H05K1/09 , H05K3/00
CPC分类号： H05K3/184 , H05K3/244 , H05K3/384 , H05K2203/095
摘要： Disclosed herein is a printed circuit board, including: a substrate; a seed layer formed on the substrate; and a circuit pattern formed on the seed layer and formed so that a diameter of an upper portion thereof and a width of a lower portion thereof are equal to each other or a diameter of the lower portion is larger than that of the upper portion. Therefore, the printed circuit board according to a preferred embodiment of the present invention forms the circuit pattern having the lower portion having the diameter larger than that of the upper portion, such that the electrical signal loss may be decreased and separation of the circuit pattern may be prevented, thereby improving whole reliability of the board.
摘要翻译：本文公开了一种印刷电路板，包括：基板; 形成在所述基板上的种子层; 以及形成在种子层上并且形成为使得其上部的直径和其下部的宽度彼此相等或下部的直径大于上部的直径的电路图案。因此，根据本发明的优选实施例的印刷电路板形成具有比上部的直径更大的直径的下部的电路图案，使得电信号损失可能减小，并且电路图案的分离从而提高板的整体可靠性。

8. 发明申请

US20140339094A1 PRODUCTION METHOD AND DEVICE OF SURFACE ROUGHENED COPPER PLATE, AND SURFACE ROUGHENED COPPER PLATE 审中-公开
标题翻译：表面粗糙化铜板和表面粗化铜板的生产方法和装置
公开(公告)号：US20140339094A1
公开(公告)日：2014-11-20
申请号：US14337264
申请日：2014-07-22
申请人： Furukawa Electric Co., Ltd.
发明人： Hajime WATANABE , Sadao ISHIHAMA , Kiyoteru YAMAMOTO , Takahiro IMAI , Toshihiro OYOSHI
IPC分类号： C25D5/02 , H05K3/00 , C25D7/00
CPC分类号： C25D5/02 , C25D3/38 , C25D5/10 , C25D5/18 , C25D5/34 , C25D5/48 , C25D7/00 , C25D17/00 , C25F3/02 , H05K1/056 , H05K3/0085 , H05K3/384 , H05K2201/0355 , H05K2203/0307 , H05K2203/0723 , H05K2203/1572 , Y10S205/92 , Y10T428/12361
摘要： PROBLEMS TO BE SOLVED: To provide a process for roughening both sides of a copper plate by forming a protrusion with a fine bump shape on the both sides of the copper plate, and then to provide a process for a deterioration of an electroplating solution for plating copper to become hard to progress therein.MEANS FOR SOLVING THE PROBLEMS: First of all, there is designed to be arranged electrodes (3, 3) as a similar pole for therebetween to be opposed to each other in an electroplating copper solution 2, and then to be arranged a copper plate 4 at therebetween. And then at first there becomes to be performed an anodic treatment for generating a copper fine particles on both surfaces of the copper plate 4, by performing an electrolytic process with the copper plate 4 as a positive electrode and the electrodes 3 as negative electrodes. And then thereafter there becomes to be performed a cathodic treatment, by performing an electroplating of copper with the copper plate 4 as a negative electrode and the electrodes 3 as positive electrodes, for the copper fine particles to be fixed onto the surfaces of the copper plate 4. Furthermore, there becomes to be formed the above mentioned protrusion with the fine bump shape thereon, by performing the anodic treatment and then the cathodic treatment as not less than one cycle thereof.
摘要翻译：要解决的问题：提供一种通过在铜板的两面上形成具有微小凸起形状的突起来提供铜板两侧粗糙化的方法，然后提供用于电镀的电镀液的劣化的工艺铜变得难以进展。解决问题的手段：首先，设计为在电镀铜溶液2中彼此相对地设置作为相似的极的电极（3,3），然后设置为铜板4 在它们之间。首先，通过以铜板4为正极进行电解处理，将电极3作为负极进行电镀处理，在铜板4的两面上进行阳极处理，生成铜微粒。然后，进行阴极处理，通过以铜板4作为负极进行铜的电镀，将电极3作为正极进行阴极处理，将铜微粒固定在铜板的表面上此外，通过进行阳极处理，然后阴极处理为不止一个循环，形成上述具有微小凸起形状的突起。

9. 发明申请

US20140308538A1 SURFACE TREATED ALUMINUM FOIL FOR ELECTRONIC CIRCUITS 审中-公开
标题翻译：用于电子电路的表面处理铝箔
公开(公告)号：US20140308538A1
公开(公告)日：2014-10-16
申请号：US14216502
申请日：2014-03-17
申请人： GBC Metals, LLC
发明人： Szuchain F. Chen
IPC分类号： B32B15/01
CPC分类号： B32B15/017 , B32B2457/08 , C23C18/54 , C23C28/025 , C25D3/12 , C25D3/38 , C25D5/12 , C25D5/44 , C25D5/48 , C25D7/0614 , H05K1/09 , H05K3/384 , H05K3/388 , H05K2201/0355 , Y10T428/12438
摘要： The surface of an aluminum substrate is modified to enhance the adhesion of the metal to polymeric materials. Intermediate layers, such as Zn/Sn, Co/Ni, and a Cu strike are applied before depositing a nodular Cu layer for bond enhancement. The surface treated aluminum substrate can be used in printed circuit boards, leadframes, or any electrical/electronic devices where Cu is typically used to reduce the cost and weight of the devices.
摘要翻译：铝基材的表面被改性以增强金属与聚合材料的粘合性。在沉积用于结合增强的结节状Cu层之前，施加中间层，例如Zn / Sn，Co / Ni和Cu冲击。经表面处理的铝基板可用于印刷电路板，引线框架或任何电气/电子设备，其中Cu通常用于降低设备的成本和重量。

10. 发明申请

US20140057123A1 COPPER FOIL FOR PRINTED CIRCUIT 审中-公开
标题翻译：印刷电路用铜箔
公开(公告)号：US20140057123A1
公开(公告)日：2014-02-27
申请号：US14006140
申请日：2012-02-10
申请人： Hideta Arai , Atsushi Miki
发明人： Hideta Arai , Atsushi Miki
IPC分类号： H05K1/09
CPC分类号： H05K1/09 , C25D5/14 , C25D5/48 , C25D7/0614 , H05K3/384 , H05K3/388 , H05K3/389 , H05K2201/0352 , H05K2201/0355 , H05K2203/0723 , Y10T428/12049 , Y10T428/12076 , Y10T428/12438
摘要： Provided is a copper foil with surface treated layers, wherein a copper foil or a copper alloy foil includes a plurality of surface treated layers configured from a roughened layer formed on the copper foil or the copper alloy foil by roughening treatment, a heat-resistant layer made from a Ni—Co layer formed on the roughened layer, and a weathering layer and a rust-preventive layer which contain Zn, Ni, and Cr and is formed on the heat-resistant layer, and the surface treated layers having a (total Zn)/[(total Zn)+(total Ni)] ratio of 0.13 or more and 0.23 or less. In a copper foil clad laminate which uses a copper foil for a printed circuit obtained by performing roughening treatment on a surface of a copper foil and then forming a heat-resistant layer and a rust-preventive layer thereon, and to which silane coupling treatment is subsequently performed, the copper foil for a printed circuit can further inhibit the deterioration in adhesion caused by the acid infiltration into the interface of the copper foil circuit and the substrate resin upon performing acid treatment or chemical etching to the substrate after forming a fine-pattern printed circuit. Thus, the copper foil for printed circuit has superior acid-resistant adhesive strength and superior alkali etchability.
摘要翻译：提供一种具有表面处理层的铜箔，其中铜箔或铜合金箔包括通过粗糙化处理在铜箔或铜合金箔上形成的粗糙层构成的多个表面处理层，耐热层由形成在粗糙层上的Ni-Co层制成，并且在耐热层上形成含有Zn，Ni和Cr的耐候层和防锈层，并且表面处理层具有（总计 Zn）/ [（总Zn）+（总Ni）]比为0.13以上且0.23以下。在使用铜箔作为印刷电路的铜箔复合层叠体上，通过对铜箔的表面进行粗糙化处理，然后在其上形成耐热层和防锈层而得到，并且硅烷偶联处理为随后，印刷电路用铜箔可以进一步抑制由于在形成精细图案之后对基板进行酸处理或化学蚀刻时，酸浸入到铜箔电路和基板树脂的界面中引起的粘附性的劣化印刷电路因此，用于印刷电路的铜箔具有优异的耐酸粘合强度和优异的碱蚀刻性。

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