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    • 10. 发明授权
    • Optimization design method for the chassis structure of an electronic device based on mechanical, electrical and thermal three-field coupling
    • 基于机械,电和热三场耦合的电子设备底盘结构的优化设计方法
    • US08744824B2
    • 2014-06-03
    • US13259262
    • 2009-09-24
    • Baoyan DuanHui QiaoPeng LiShibo JiangBoyuan MaNing HanLizhi ZengYu He
    • Baoyan DuanHui QiaoPeng LiShibo JiangBoyuan MaNing HanLizhi ZengYu He
    • G06F17/50
    • G06F17/5018G06F2217/16G06F2217/80
    • An optimizing design method for a chassis structure of electronic equipment is disclosed, including: investigating from the point of view of mechanical, electric and thermal three-field coupling, determining the preliminary design size of the chassis, performing a mechanical analysis by using a mechanical analysis software such as ANSYS; converting the mesh model among the three-fields, obtaining the mesh model used for the electromagnetic and thermal analyses; setting the thermal analysis parameters, performing the thermal analysis by using an electromagnetic analysis software such as ICEPAK; determining a resonance frequency of the chassis and an electric parameter of the absorbing material, performing an electromagnetic analysis by using a thermal analysis software such as FEKO; correcting the analysis result by sample testing; determining whether the chassis satisfies the design requirement, if it satisfies the requirement, the optimizing design will be finished, otherwise, modifying the preliminary computer assisted design model, the electromagnetic analysis parameter and the thermal analysis parameter, repeating the above processes until the requirement is satisfied.
    • 公开了一种用于电子设备底盘结构的优化设计方法,包括:从机械,电和热三场耦合的角度考察,确定底盘的初步设计尺寸,通过使用机械 分析软件如ANSYS; 在三场中转换网格模型,获得用于电磁和热分析的网格模型; 设置热分析参数,使用ICEPAK等电磁分析软件进行热分析; 确定底盘的共振频率和吸收材料的电参数,通过使用诸如FEKO的热分析软件执行电磁分析; 通过样本测试纠正分析结果; 确定底盘是否满足设计要求,如果满足要求,优化设计将完成,否则,修改初步计算机辅助设计模型,电磁分析参数和热分析参数,重复上述过程,直到要求为 满意。