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1. 发明授权

US08019395B2 Foldable mobile electronic device 失效
标题翻译：可折叠移动电子设备
公开(公告)号：US08019395B2
公开(公告)日：2011-09-13
申请号：US11952961
申请日：2007-12-07
申请人： Jiung-Cheng Pan , Ning-Han Nan
发明人： Jiung-Cheng Pan , Ning-Han Nan
IPC分类号： H04M1/00
CPC分类号： H04M1/022 , H04M1/0216
摘要： A foldable mobile electronic device includes a body, a top cover and a hinge. The body includes a first sliding mechanism. The top cover includes a second sliding mechanism moving between a first position and a second position relative to the body. The hinge includes a first protrusion and a second protrusion. The first protrusion corresponds to the first sliding mechanism and the second protrusion corresponds to the second sliding mechanism. When the top cover is in the first position, the hinge extends from the body and the top cover to be exposed, and when the top cover is in the second position, the hinge is accommodated in the foldable mobile electronic device.
摘要翻译：可折叠移动电子设备包括主体，顶盖和铰链。主体包括第一滑动机构。顶盖包括相对于主体在第一位置和第二位置之间移动的第二滑动机构。铰链包括第一突起和第二突起。第一突起对应于第一滑动机构，第二突起对应于第二滑动机构。当顶盖处于第一位置时，铰链从主体和顶盖延伸以露出，并且当顶盖处于第二位置时，铰链容纳在可折叠的移动电子设备中。

2. 发明申请

US20080176610A1 FOLDABLE MOBILE ELECTRONIC DEVICE 失效
标题翻译：可折叠移动电子设备
公开(公告)号：US20080176610A1
公开(公告)日：2008-07-24
申请号：US11952961
申请日：2007-12-07
申请人： Jiung-Cheng Pan , Ning-Han Nan
发明人： Jiung-Cheng Pan , Ning-Han Nan
IPC分类号： H04M1/02
CPC分类号： H04M1/022 , H04M1/0216
摘要： A foldable mobile electronic device includes a body, a top cover and a hinge. The body includes a first sliding mechanism. The top cover includes a second sliding mechanism moving between a first position and a second position relative to the body. The hinge includes a first protrusion and a second protrusion. The first protrusion corresponds to the first sliding mechanism and the second protrusion corresponds to the second sliding mechanism. When the top cover is in the first position, the hinge extends from the body and the top cover to be exposed, and when the top cover is in the second position, the hinge is accommodated in the foldable mobile electronic device.
摘要翻译：可折叠移动电子设备包括主体，顶盖和铰链。主体包括第一滑动机构。顶盖包括相对于主体在第一位置和第二位置之间移动的第二滑动机构。铰链包括第一突起和第二突起。第一突起对应于第一滑动机构，第二突起对应于第二滑动机构。当顶盖处于第一位置时，铰链从主体和顶盖延伸以露出，并且当顶盖处于第二位置时，铰链容纳在可折叠的移动电子设备中。

3. 发明申请

US20120016639A1 OPTIMIZATION DESIGN METHOD FOR THE CHASSIS STRUCTURE OF AN ELECTRONIC DEVICE BASED ON MECHANICAL, ELECTRICAL AND THERMAL THREE-FIELD COUPLING 有权
标题翻译：基于机械，电和热三相耦合的电子设备底盘结构优化设计方法
公开(公告)号：US20120016639A1
公开(公告)日：2012-01-19
申请号：US13259262
申请日：2009-09-24
申请人： Baoyan Duan , Hui Qiao , Peng Li , Shibo Jiang , Boyuan Ma , Ning Han , Lizhi Zeng , Yu He
发明人： Baoyan Duan , Hui Qiao , Peng Li , Shibo Jiang , Boyuan Ma , Ning Han , Lizhi Zeng , Yu He
IPC分类号： G06F17/50 , G06F17/10
CPC分类号： G06F17/5018 , G06F2217/16 , G06F2217/80
摘要： An optimizing design method for a chassis structure of electronic equipment is disclosed, including: investigating from the point of view of mechanical, electric and thermal three-field coupling, determining the preliminary design size of the chassis, performing a mechanical analysis by using the software Ansys; converting the mesh model among the three-fields, obtaining the mesh model used for the electromagnetic and thermal analyses; setting the thermal analysis parameters, performing the thermal analysis by using the software IcePak; determining a resonance frequency of the chassis and an electric parameter of the absorbing material, performing an electromagnetic analysis by using the software FeKo; correcting the analysis result by sample testing; determining whether the chassis satisfies the design requirement, if it satisfies the requirement, the optimizing design will be finished, otherwise, modifying the preliminary CAD model, the electromagnetic analysis parameter and the thermal analysis parameter, repeating the above processes until the requirement is satisfied.
摘要翻译：公开了一种电子设备底盘结构的优化设计方法，包括：从机械，电和热三场耦合的角度考察，确定机箱的初步设计尺寸，使用软件进行机械分析安斯斯在三场中转换网格模型，获得用于电磁和热分析的网格模型; 设置热分析参数，使用IcePak软件执行热分析; 确定底盘的共振频率和吸收材料的电参数，使用软件FeKo执行电磁分析; 通过样本测试纠正分析结果; 确定底盘是否满足设计要求，如果满足要求，优化设计将完成，否则，修改初步CAD模型，电磁分析参数和热分析参数，重复上述过程直到满足要求。

4. 发明授权

US08744824B2 Optimization design method for the chassis structure of an electronic device based on mechanical, electrical and thermal three-field coupling 有权
标题翻译：基于机械，电和热三场耦合的电子设备底盘结构的优化设计方法
公开(公告)号：US08744824B2
公开(公告)日：2014-06-03
申请号：US13259262
申请日：2009-09-24
申请人： Baoyan Duan , Hui Qiao , Peng Li , Shibo Jiang , Boyuan Ma , Ning Han , Lizhi Zeng , Yu He
发明人： Baoyan Duan , Hui Qiao , Peng Li , Shibo Jiang , Boyuan Ma , Ning Han , Lizhi Zeng , Yu He
IPC分类号： G06F17/50
CPC分类号： G06F17/5018 , G06F2217/16 , G06F2217/80
摘要： An optimizing design method for a chassis structure of electronic equipment is disclosed, including: investigating from the point of view of mechanical, electric and thermal three-field coupling, determining the preliminary design size of the chassis, performing a mechanical analysis by using a mechanical analysis software such as ANSYS; converting the mesh model among the three-fields, obtaining the mesh model used for the electromagnetic and thermal analyses; setting the thermal analysis parameters, performing the thermal analysis by using an electromagnetic analysis software such as ICEPAK; determining a resonance frequency of the chassis and an electric parameter of the absorbing material, performing an electromagnetic analysis by using a thermal analysis software such as FEKO; correcting the analysis result by sample testing; determining whether the chassis satisfies the design requirement, if it satisfies the requirement, the optimizing design will be finished, otherwise, modifying the preliminary computer assisted design model, the electromagnetic analysis parameter and the thermal analysis parameter, repeating the above processes until the requirement is satisfied.
摘要翻译：公开了一种用于电子设备底盘结构的优化设计方法，包括：从机械，电和热三场耦合的角度考察，确定底盘的初步设计尺寸，通过使用机械分析软件如ANSYS; 在三场中转换网格模型，获得用于电磁和热分析的网格模型; 设置热分析参数，使用ICEPAK等电磁分析软件进行热分析; 确定底盘的共振频率和吸收材料的电参数，通过使用诸如FEKO的热分析软件执行电磁分析; 通过样本测试纠正分析结果; 确定底盘是否满足设计要求，如果满足要求，优化设计将完成，否则，修改初步计算机辅助设计模型，电磁分析参数和热分析参数，重复上述过程，直到要求为满意。

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