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1. 发明授权

US08643834B2 Apparatus of inspecting defect in semiconductor and method of the same 失效
标题翻译：检测半导体缺陷的装置及其方法
公开(公告)号：US08643834B2
公开(公告)日：2014-02-04
申请号：US13648001
申请日：2012-10-09
申请人： Akira Hamamatsu , Shunji Maeda , Hisae Shibuya
发明人： Akira Hamamatsu , Shunji Maeda , Hisae Shibuya
IPC分类号： G01N21/88 , G01B11/00
CPC分类号： G01N21/956
摘要： When size of a defect on an increasingly miniaturized pattern is obtained by defect inspection apparatus in the related art, a value is inconveniently given, which is different from a measured value of the same defect by SEM. Thus, a dimension value of a defect detected by defect inspection apparatus needs to be accurately calculated to be approximated to a value measured by SEM. To this end, size of the defect detected by the defect inspection apparatus is corrected depending on feature quantity or type of the defect, thereby defect size can be accurately calculated.
摘要翻译：当通过现有技术的缺陷检查装置获得越来越小型化的图案的缺陷的尺寸时，不方便地给出不同于SEM的相同缺陷的测量值的值。因此，需要精确地计算由缺陷检查装置检测到的缺陷的尺寸值，以近似于通过SEM测量的值。为此，由缺陷检查装置检测到的缺陷的尺寸根据缺陷的特征量或类型进行修正，从而可以精确地计算缺陷尺寸。

2. 发明授权

US08437534B2 Defect classification method and apparatus, and defect inspection apparatus 有权
标题翻译：缺陷分类方法和装置，以及缺陷检查装置
公开(公告)号：US08437534B2
公开(公告)日：2013-05-07
申请号：US11779905
申请日：2007-07-19
申请人： Hisae Shibuya , Shunji Maeda , Akira Hamamatsu
发明人： Hisae Shibuya , Shunji Maeda , Akira Hamamatsu
IPC分类号： G06K9/00 , G06K9/68 , G05B13/02 , G06F7/00 , G06F17/00
CPC分类号： G06T7/0004 , G01N21/9501 , G01N21/956 , G06K9/03 , G06K9/6254 , G06K9/6282 , G06T2207/30148
摘要： A defect classification method to classify defects by using a classifier having a binary tree structure based on features of defects extracted from detected signals acquired from a defect inspection apparatus includes a classifier construction process for constructing the classifier by setting a branch condition including defect classes respectively belonging to groups located on both sides of the branch point, a feature to be used for branching, and a discriminant reference, for each branch point in the structure based on instruction of defect classes and feature data respectively associated therewith beforehand. The process includes a priority order specification process for previously specifying target classification performance of purity and accuracy for each defect class, whole and in worst case, with priority order, and an evaluation process for evaluating whether the specified target classification performance under the branching condition is satisfied and displaying a result of evaluation, every item.
摘要翻译：通过使用基于从缺陷检查装置获取的检测信号提取的缺陷的特征的具有二叉树结构的分类器对缺陷进行分类的缺陷分类方法包括：分类器构造处理，用于通过设置包括分别属于的缺陷类的分支条件来构建分类器基于分支点两侧的组，用于分支的特征，以及基于与预先分别相关联的缺陷类别和特征数据的指示的结构中的每个分支点的判别参考。该处理包括优先顺序指定处理，用于以优先级顺序预先指定每个缺陷类的全部和最坏情况下的纯度和精度的目标分类性能，以及用于评估分支条件下的指定目标分类性能是否为满意并显示评估结果，每个项目。

3. 发明授权

US08306312B2 Method and apparatus for detecting pattern defects 失效
标题翻译：检测图案缺陷的方法和装置
公开(公告)号：US08306312B2
公开(公告)日：2012-11-06
申请号：US13049943
申请日：2011-03-17
申请人： Hisae Shibuya , Akira Hamamatsu , Yuji Takagi
发明人： Hisae Shibuya , Akira Hamamatsu , Yuji Takagi
IPC分类号： G06K9/00 , G06K9/62
CPC分类号： G06K9/6221 , G01N21/9501 , G01N21/95607 , G01N2021/8854 , G01N2021/95676
摘要： With the objective of achieving defect kind training in a short period of time to teach classification conditions of defects detected as a result of inspecting a thin film device, according to one aspect of the present invention, there is provided a visual inspection method, and an apparatus therefor, comprising the steps of: detecting defects based on inspection images acquired by optical or electronic defect detection means, and at the same time calculating features of the defects; and classifying the defects according to classification conditions set beforehand, wherein said classification condition setting step further includes the steps of: collecting defect features over a large number of defects acquired beforehand from the defect detection step; sampling defects based on the distribution of the collected defect features over the large number of defects; and setting defect classification conditions based on the result of reviewing the sampled defects.
摘要翻译：为了在短时间内实现缺陷种类训练，目的在于教导检查薄膜装置的检测缺陷的分类条件，根据本发明的一个方面，提供一种目视检查方法，其装置包括以下步骤：基于由光学或电子缺陷检测装置获取的检查图像检测缺陷，同时计算缺陷的特征; 并根据预先设定的分类条件对缺陷进行分类，其中所述分类条件设置步骤还包括以下步骤：从缺陷检测步骤预先获取的大量缺陷中收集缺陷特征; 基于收集的缺陷特征分布在大量缺陷上的采样缺陷; 并根据检查采样缺陷的结果设置缺陷分类条件。

4. 发明授权

US08289507B2 Method of apparatus for detecting particles on a specimen 有权
标题翻译：用于检测样品上的颗粒的装置的方法
公开(公告)号：US08289507B2
公开(公告)日：2012-10-16
申请号：US13118004
申请日：2011-05-27
申请人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Sachio Uto , Taketo Ueno , Hiroyuki Nakano , Takahiro Jingu , Hisashi Hatano , Yukihisa Mohara , Seiji Otani , Takahiro Togashi
发明人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Sachio Uto , Taketo Ueno , Hiroyuki Nakano , Takahiro Jingu , Hisashi Hatano , Yukihisa Mohara , Seiji Otani , Takahiro Togashi
IPC分类号： G01N21/00
CPC分类号： G01N21/956
摘要： A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.
摘要翻译：通过检查其中形成有多个图案的样本的表面的样本来检测缺陷的方法和装置，通过从仰角不同的多个方向之一的细长形状的光束照射，根据要检测的缺陷的种类从照明光源发射的光束。通过用安装在不同仰角方向上的多个图像传感器捕获由细长形状光束照射的样本的多个光学图像，通过根据在照射细长的照射区域中在样品上形成的图案的密度来改变放大倍率形状光通量。通过处理由多个图像传感器捕获的图像来检测样本上的缺陷。

5. 发明授权

US08274651B2 Method of inspecting a semiconductor device and an apparatus thereof 有权
标题翻译：检查半导体器件的方法及其装置
公开(公告)号：US08274651B2
公开(公告)日：2012-09-25
申请号：US13234897
申请日：2011-09-16
申请人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
发明人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
IPC分类号： G01N21/00 , G06K9/00
CPC分类号： G06T7/001 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G01N2021/8867 , G06T7/97 , G06T2207/10152 , G06T2207/30148
摘要： A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.
摘要翻译：在多个检查条件下检查样本的样本的检查方法和装置以及在多个检查条件中的每一个下检查样本而获得的检查数据以及对应于检查日期的样本的位置信息具有相应的检查条件。多个检查条件中的每一个的检查数据通过使用关于样本的位置信息彼此相对来确定待检查的位置，并且在待检查位置处的样本的图像是详细的获得。对所获得的图像进行分类，确定通过使用图像分类信息的样本的检查条件。

6. 发明申请

US20120194809A1 METHOD AND APPARATUS FOR DETECTING DEFECTS 失效
标题翻译：检测缺陷的方法和装置
公开(公告)号：US20120194809A1
公开(公告)日：2012-08-02
申请号：US13362808
申请日：2012-01-31
申请人： Hiroyuki Nakano , Toshihiko Nakata , Sachio Uto , Akira Hamamatsu , Shunji Maeda , Yuta Urano
发明人： Hiroyuki Nakano , Toshihiko Nakata , Sachio Uto , Akira Hamamatsu , Shunji Maeda , Yuta Urano
IPC分类号： G01N21/956
CPC分类号： G01N21/956 , G01N21/47 , G01N21/94 , G01N21/9501 , G01N2021/8822
摘要： A method and apparatus for detecting defects are provided for detecting defects or foreign matter on an object to be inspected. The apparatus includes a movable stage for mounting a specimen, an illumination system for irradiating a circuit pattern with light from an inclined direction, and an image-forming optical system for forming an image of an irradiated detection area on a detector from the upward and oblique directions. With this arrangement, diffracted light and scattered light caused on the circuit pattern through the illumination by the illumination system is collected. A spatial filter is provided on a Fourier transform surface for blocking the diffracted light from a linear part of the circuit pattern. The scattered and reflected light received by the detector is converted into an electrical signal. The converted electrical signal of one chip is compared with that of the other adjacent chip.
摘要翻译：提供一种用于检测缺陷的方法和装置，用于检测被检测物体上的缺陷或异物。该装置包括用于安装样本的可移动台，用于从倾斜方向的光照射电路图案的照明系统和用于从上方和倾斜形成检测器上的照射检测区域的图像的图像形成光学系统方向。利用这种布置，收集通过照明系统的照明在电路图案上产生的衍射光和散射光。在傅立叶变换表面上提供空间滤波器，用于阻挡来自电路图形的线性部分的衍射光。由检测器接收的散射和反射光被转换成电信号。将一个芯片的转换电信号与另一个芯片的转换电信号进行比较。

7. 发明申请

US20120162665A1 Inspecting Method and Inspecting Apparatus for Substrate Surface 有权
标题翻译：基板表面检查方法及检查装置
公开(公告)号：US20120162665A1
公开(公告)日：2012-06-28
申请号：US13404749
申请日：2012-02-24
申请人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
发明人： Akira Hamamatsu , Yoshimasa Oshima , Shunji Maeda , Hisae Shibuya , Yuta Urano , Toshiyuki Nakao , Shigenobu Maruyama
IPC分类号： G01B11/30
CPC分类号： G01B11/303 , G01N21/47 , G01N21/94 , G01N21/9501
摘要： An inspecting method and apparatus for inspecting a substrate surface includes application of a light to the substrate surface, detection of scattered light or reflected light from the substrate surface due to the applied light at a plurality of positions to obtain a plurality of electrical signals, extraction of a signal in a mutually different frequency band from each of the plurality of electrical signals, and calculation of a value regarding a state of film of the substrate through an arithmetical operation process of a plurality of extracted signals in the frequency bands.
摘要翻译：用于检查基板表面的检查方法和装置包括：由于在多个位置处施加的光，向基板表面施加光，检测散射光或来自基板表面的反射光，以获得多个电信号，提取在与所述多个电信号中的每一个相互不同的频带中的信号的信号，以及通过所述频带中的多个提取的信号的算术运算处理来计算关于所述衬底的膜的状态的值。

8. 发明申请

US20120006131A1 METHOD OF INSPECTING A SEMICONDUCTOR DEVICE AND AN APPARATUS THEREOF 有权
公开(公告)号：US20120006131A1
公开(公告)日：2012-01-12
申请号：US13234897
申请日：2011-09-16
申请人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
发明人： Akira Hamamatsu , Minori Noguchi , Yoshimasa Ohshima , Hidetoshi Nishiyama , Kenji Oka , Takanori Ninomiya , Maki Tanaka , Kenji Watanabe , Tetsuya Watanabe , Yoshio Morishige
IPC分类号： G01D21/00
CPC分类号： G06T7/001 , G01N21/8851 , G01N21/9501 , G01N2021/8861 , G01N2021/8867 , G06T7/97 , G06T2207/10152 , G06T2207/30148
摘要： A method and apparatus of inspecting a sample, in which the sample is inspected under a plurality of inspection conditions, and inspection data obtained by inspecting the sample under each of the plurality of inspection conditions and position information on the sample of the inspection date in correspondence with the respective inspection conditions, are stored. The inspection data for each of the plurality of inspection conditions is against each other by the use of the position information on the sample to determine a position to be inspected in detail, and an image of the sample at a position to be inspected in detail is obtained. The obtained image is classified, the inspection condition of the sample by the use of information of classification of the image is determined.

9. 发明授权

US08072597B2 Method and its apparatus for inspecting particles or defects of a semiconductor device 有权
标题翻译：用于检查半导体器件的颗粒或缺陷的方法及其装置
公开(公告)号：US08072597B2
公开(公告)日：2011-12-06
申请号：US12138889
申请日：2008-06-13
申请人： Hidetoshi Nishiyama , Minori Noguchi , Yoshimasa Ooshima , Akira Hamamatsu , Kenji Watanabe , Tetsuya Watanabe , Takahiro Jingu
发明人： Hidetoshi Nishiyama , Minori Noguchi , Yoshimasa Ooshima , Akira Hamamatsu , Kenji Watanabe , Tetsuya Watanabe , Takahiro Jingu
IPC分类号： G01N15/02
CPC分类号： G01N21/4738 , G01N21/8806 , G01N21/93 , G01N21/94 , G01N21/9501 , G01N2015/1486 , G01N2015/1493
摘要： Conventionally, a particle/defect inspection apparatus outputs a total number of detected particles/defects as the result of detection. For taking countermeasures to failures in manufacturing processes, the particles/defects detected by the inspection apparatus are analyzed. Since the inspection apparatus outputs a large number of detected particles/defects, an immense time is required for analyzing the detected particles/defects, resulting in a delay in taking countermeasures to a failure in the manufacturing processes. In the present invention, an apparatus for optically inspecting particles or defects relates a particle or defect size to a cause of failure in an inspection result. A data processing circuit points out a cause of failure from the statistics on the inspection result, and displays information on the inspection result. A failure analysis is conducted by setting a threshold for identifying a failure in each of regions on a semiconductor device or the like to statistically evaluate detected particles.
摘要翻译：通常，作为检测结果，粒子/缺陷检查装置输出检测出的粒子/缺陷的总数。对于制造过程中的故障采取对策，分析检查装置检测到的颗粒/缺陷。由于检查装置输出大量检测到的粒子/缺陷，所以需要巨大的时间来分析检测到的粒子/缺陷，从而导致制造过程中的失败的对策的延迟。在本发明中，用于光学检查颗粒或缺陷的装置在检查结果中将颗粒或缺陷尺寸与故障原因相关联。数据处理电路从检查结果统计中指出故障原因，并显示检查结果信息。通过设定用于识别半导体装置等上的各区域的故障的阈值来进行故障分析，以统计学评价检测出的粒子。

10. 发明申请

US20110228258A1 METHOD OF APPARATUS FOR DETECTING PARTICLES ON A SPECIMEN 有权
标题翻译：检测样品中颗粒物的方法
公开(公告)号：US20110228258A1
公开(公告)日：2011-09-22
申请号：US13118004
申请日：2011-05-27
申请人： Akira HAMAMATSU , Minori NOGUCHI , Yoshimasa OHSHIMA , Sachio UTO , Taketo UENO , Hiroyuki NAKANO , Takahiro JINGU , Hisashi HATANO , Yukihisa MOHARA , Seiji OTANI , Takahiro TOGASHI
发明人： Akira HAMAMATSU , Minori NOGUCHI , Yoshimasa OHSHIMA , Sachio UTO , Taketo UENO , Hiroyuki NAKANO , Takahiro JINGU , Hisashi HATANO , Yukihisa MOHARA , Seiji OTANI , Takahiro TOGASHI
IPC分类号： G01N21/88
CPC分类号： G01N21/956
摘要： A method and apparatus of detecting a defect by inspecting a specimen in which a surface of a specimen on which plural patterns are formed is illuminated with an elongated shape light flux from one of plural directions which are different in elevation angle by switching an optical path of the light flux emitted from an illuminating light source in accordance with a kind of defect to be detected. Plural optical images of the specimen illuminated by the elongated shape light flux are captured with plural image sensors installed in different elevation angle directions by changing an enlarging magnification in accordance with a density of the pattern formed on the sample in an area irradiated with the illuminating elongated shape light flux. A defect on the specimen is detected by processing the images captured by the plural image sensors.
摘要翻译：通过检查其中形成有多个图案的样本的表面的样本来检测缺陷的方法和装置，通过从仰角不同的多个方向之一的细长形状的光束照射，根据要检测的缺陷的种类从照明光源发射的光束。通过用安装在不同仰角方向上的多个图像传感器捕获由细长形状光束照射的样本的多个光学图像，通过根据在照射细长的照射区域中在样品上形成的图案的密度来改变放大倍率形状光通量。通过处理由多个图像传感器捕获的图像来检测样本上的缺陷。

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