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    • 1. 发明授权
    • Method for inspecting pattern defect and device for realizing the same
    • 检查图案缺陷的方法及其实现方法
    • US08748795B2
    • 2014-06-10
    • US12329274
    • 2008-12-05
    • Yuta UranoHiroyuki NakanoShunji MaedaSachio Uto
    • Yuta UranoHiroyuki NakanoShunji MaedaSachio Uto
    • G01N21/00
    • G01N21/9501G01N21/47G01N21/4788G01N21/94G01N21/956
    • When using a CCD sensor as a photo-detector in a device for inspecting foreign matters and defects, it has a problem of causing electric noise while converting the signal charge, produced inside by photoelectric conversion, into voltage and reading it. Therefore, the weak detected signal obtained by detecting reflected and scattered light from small foreign matters and defects is buried in the electric noise, which has been an obstacle in detecting small foreign matters and defects. In order to solve the above problem, according to the present invention, an electron multiplying CCD sensor is used as a photo-detector. The electron multiplying CCD sensor is capable of enlarging signals brought about by inputted light relatively to the electric noise by multiplying the electrons produced through photoelectric conversion and reading them. Accordingly, compared to a conventional CCD sensor, it can detect weaker light and, therefore, smaller foreign matters and defects.
    • 当在用于检查异物和缺陷的装置中使用CCD传感器作为光检测器时,存在在将由光电转换产生的信号电荷转换成电压并读取的同时将电噪声引起的问题。 因此,通过检测来自小异物和缺陷的反射和散射光获得的弱检测信号被埋在电噪声中,这是检测小异物和缺陷的障碍。 为了解决上述问题,根据本发明,使用电子倍增CCD传感器作为光检测器。 电子倍增CCD传感器能够通过将通过光电转换产生的电子与其进行读取而相对于电噪声放大由输入的光产生的信号。 因此,与常规CCD传感器相比,它可以检测较弱的光,因此可以检测较小的异物和缺陷。
    • 2. 发明授权
    • Apparatus and method for inspecting defect on object surface
    • 检测物体表面缺陷的装置和方法
    • US08482728B2
    • 2013-07-09
    • US12244958
    • 2008-10-03
    • Sachio UtoHidetoshi NishiyamaMinori Noguchi
    • Sachio UtoHidetoshi NishiyamaMinori Noguchi
    • G01N21/00
    • H01L21/02334B08B6/00G01B11/0625G01B11/303G01N3/04G01N21/15G01N21/94G01N21/9501G01N21/95623G01N2021/9563H01L21/02057H01L21/02082
    • An aspect of the invention provides a defect inspection apparatus being able to accurately inspect a micro foreign matter or defect at a high speed for an inspection target substrate in which a repetitive pattern and a non-repetitive pattern are mixed. In a foreign matter anti-adhesive means 180, a transparent plate 187 is placed on a placement table 34 through a frame 185. In the foreign matter anti-adhesive means 180, a shaft 181 which is rotatably supported by two columnar supports 184 fixed onto a base 186 is coupled to a motor 182 by a coupling 183. The shaft 181 is inserted into a part of a frame 185 between the two columnar supports 184 such that the frame 185 and the transparent plate 187 are turnable about the shaft 181. Therefore, the whole of the frame 185 is opened and closed in a Z-direction about the shaft 181, and a wafer 1 on the placement table 34 can be covered with the frame 185 and the transparent plate 187.
    • 本发明的一个方面提供了一种缺陷检查装置,其能够精确地检查混合有重复图案和非重复图案的检查对象基板的高速微细异物或缺陷。 在异物防粘连装置180中,通过框架185将透明板187放置在放置台34上。在异物防粘装置180中,轴181可旋转地由两个柱状支撑件184支撑固定到 基座186通过联轴器183联接到马达18.轴181插入到两个柱状支撑件184之间的框架185的一部分中,使得框架185和透明板187围绕轴181可转动。因此 ,整个框架185围绕轴181沿Z方向打开和关闭,并且放置台34上的晶片1可以被框架185和透明板187覆盖。
    • 7. 发明申请
    • PATTERN DEFECT INSPECTING APPARATUS AND METHOD
    • 图案缺陷检查装置及方法
    • US20110221886A1
    • 2011-09-15
    • US13059908
    • 2009-07-08
    • Hidetoshi NishiyamaMasaaki ItoSachio UtoKei Shimura
    • Hidetoshi NishiyamaMasaaki ItoSachio UtoKei Shimura
    • H04N7/18
    • G01N21/956G01N21/94H01L22/12
    • In recent years, a wafer inspection time in semiconductor manufacturing processes is being required to be reduced for reduction in manufacturing time and for early detection of yield reduction factors. To meet this requirement, there is a need to reduce the time required for inspection parameter setup, as well as the time actually required for inspection. Based on the speed or position change information relating to a transport system 2, inspection is also conducted during acceleration/deceleration of the transport system 2 by controlling an accumulation time and/or operational speed of a detector or by correcting acquired images. Alternate display of review images of a detection region at fixed time intervals improves visibility of the detection region and makes it possible to confirm within a short time whether a defect is present.
    • 近年来,为了减少制造时间和减少因素的早期检测,需要减少半导体制造工序中的晶片检查时间。 为了满足这一要求,需要减少检查参数设置所需的时间以及检查所需的时间。 基于与运输系统2有关的速度或位置变化信息,通过控制检测器的累积时间和/或操作速度或通过校正所获取的图像,也可以在运输系统2的加速/减速期间进行检查。 以固定的时间间隔交替显示检测区域的检查图像提高了检测区域的可视性,并且使得可以在短时间内确认是否存在缺陷。
    • 9. 发明申请
    • APPARATUS AND METHOD FOR INSPECTING AN OBJECT SURFACE DEFECT
    • 用于检查物体表面缺陷的装置和方法
    • US20110141272A1
    • 2011-06-16
    • US13059523
    • 2009-07-10
    • Sachio UtoHidetoshi NishiyamaKei ShimuraMasaaki Ito
    • Sachio UtoHidetoshi NishiyamaKei ShimuraMasaaki Ito
    • H04N7/18G01N21/956
    • G01N21/95607G01N21/94G01N21/9501
    • Disclosed is an apparatus having a light source of a deep ultraviolet ray for detecting a small foreign matter or pattern defect, which may arise during a process for manufacturing a semiconductor device or the like, in high resolution. The apparatus comprises a means for detecting a damage on an optical system due to a wavelength reduction thereby to save a damaged portion, and a means for comparing an optical system arrangement with that at the manufacturing time and detecting the abnormality thereof, to thereby make a correction, so that the apparatus can inspect the defect on an object substrate stably at a high speed and in high sensitivity. Also disclosed is a method for the stable inspection. The apparatus is provided, in the optical path of the optical system, with a means for detecting the intensity and the convergent state of an illumination light, and a means for detecting the abnormality of the optics system and for saving an abnormal portion from alignment with an optical axis. The apparatus is constituted such that the optical system is adjusted to make corrections for the optical conditions at the manufacturing time, thereby to elongate the lifetime of the optical system in the inspecting apparatus and to detect the small defect stably.
    • 公开了一种具有用于检测在高分辨率的半导体器件等的制造工艺期间可能出现的小异物或图案缺陷的深紫外线光源的装置。 该装置包括用于检测由于波长减小而导致的光学系统的损坏从而节省损坏部分的装置,以及用于将光学系统布置与制造时间布置进行比较并检测其异常的装置,从而使 校正,使得设备可以高速和高灵敏度稳定地检查对象基板上的缺陷。 还公开了用于稳定检查的方法。 该装置在光学系统的光路中设置有用于检测照明光的强度和收敛状态的装置,以及用于检测光学系统的异常并且用于保存异常部分与对准的装置 光轴。 该装置被构造成使得光学系统被调整以对制造时的光学条件进行校正,从而延长了检查装置中的光学系统的寿命并且稳定地检测小缺陷。