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1. 发明授权

US09408240B2 Method and system for communicating message notifications to mobile devices 有权
标题翻译：将消息通知传送到移动设备的方法和系统
公开(公告)号：US09408240B2
公开(公告)日：2016-08-02
申请号：US12065287
申请日：2006-08-30
申请人： Alain Caron , Sylvain Legault , Haraldur Thorkelsson , Felix-Etienne Trepanier , Teresa Hunkeler , Jean Regnier
发明人： Alain Caron , Sylvain Legault , Haraldur Thorkelsson , Felix-Etienne Trepanier , Teresa Hunkeler , Jean Regnier
IPC分类号： G06F15/16 , H04W76/02 , H04L29/06 , H04W68/00 , H04W80/06
CPC分类号： H04W76/022 , H04L69/14 , H04L69/16 , H04W68/00 , H04W76/12 , H04W80/06
摘要： There is disclosed a system and method for choosing between different Communication Initiation Request (CIR) channels in a mobile communications system when there are multiple CIR channels amongst which to choose. Additionally, there is disclosed a system and method for exploiting a Transmission Control Protocol (TCP) connection usage pattern that is characterized by periods of inactivity.
摘要翻译：公开了当存在多个CIR信道以供选择时，在移动通信系统中在不同的通信发起请求（CIR）信道之间进行选择的系统和方法。此外，公开了一种利用以不活动时段为特征的传输控制协议（TCP）连接使用模式的系统和方法。

2. 发明授权

US08629562B2 Techniques for modular chip fabrication 失效
标题翻译：模块化芯片制造技术
公开(公告)号：US08629562B2
公开(公告)日：2014-01-14
申请号：US13600716
申请日：2012-08-31
申请人： Alain Caron , John Ulrich Knickerbocker
发明人： Alain Caron , John Ulrich Knickerbocker
IPC分类号： H01L23/48
CPC分类号： H01L23/5385 , H01L21/486 , H01L23/5384 , H01L23/60 , H01L24/16 , H01L25/0652 , H01L2224/16 , H01L2224/16225 , H01L2924/00014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01047 , H01L2924/01078 , H01L2924/01322 , H01L2924/04941 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/19105 , H01L2924/00 , H01L2224/48
摘要： Techniques for modular chip fabrication are provided. In one aspect, a modular chip structure is provided. The modular chip structure comprises a substrate; a carrier platform attached to the substrate, the carrier platform comprising a plurality of conductive vias extending through the carrier platform; and a wiring layer on the carrier platform in contact with one or more of the conductive vias, wherein the wiring layer comprises one or more wiring levels and is configured to divide the carrier platform into a plurality of voltage islands; and chips, chip macros or at least one chip in combination with at least one chip macro assembled on the carrier platform.
摘要翻译：提供了模块化芯片制造技术。一方面，提供了一种模块化芯片结构。模块化芯片结构包括基板; 载体平台，其附接到所述基底，所述载体平台包括延伸穿过所述载体平台的多个导电通孔; 以及载体平台上的一个或多个导电通孔接触的布线层，其中所述布线层包括一个或多个布线层，并且被配置为将所述载体平台划分成多个电压岛; 芯片，芯片宏或至少一个芯片组合在载体平台上组装的至少一个芯片宏。

3. 发明授权

US08288866B2 Techniques for modular chip fabrication 有权
标题翻译：模块化芯片制造技术
公开(公告)号：US08288866B2
公开(公告)日：2012-10-16
申请号：US13013517
申请日：2011-01-25
申请人： Alain Caron , John Ulrich Knickerbocker
发明人： Alain Caron , John Ulrich Knickerbocker
IPC分类号： H01L23/48
CPC分类号： H01L23/5385 , H01L21/486 , H01L23/5384 , H01L23/60 , H01L24/16 , H01L25/0652 , H01L2224/16 , H01L2224/16225 , H01L2924/00014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01047 , H01L2924/01078 , H01L2924/01322 , H01L2924/04941 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/19105 , H01L2924/00 , H01L2224/48
摘要： Techniques for modular chip fabrication are provided. In one aspect, a modular chip structure is provided. The modular chip structure comprises a substrate; a carrier platform attached to the substrate, the carrier platform comprising a plurality of conductive vias extending through the carrier platform; and a wiring layer on the carrier platform in contact with one or more of the conductive vias, wherein the wiring layer comprises one or more wiring levels and is configured to divide the carrier platform into a plurality of voltage islands; and chips, chip macros or at least one chip in combination with at least one chip macro assembled on the carrier platform.
摘要翻译：提供了模块化芯片制造技术。一方面，提供了一种模块化芯片结构。模块化芯片结构包括基板; 载体平台，其附接到所述基底，所述载体平台包括延伸穿过所述载体平台的多个导电通孔; 以及载体平台上的一个或多个导电通孔接触的布线层，其中所述布线层包括一个或多个布线层，并且被配置为将所述载体平台划分成多个电压岛; 芯片，芯片宏或至少一个芯片组合在载体平台上组装的至少一个芯片宏。

4. 发明申请

US20110121456A1 Techniques for Modular Chip Fabrication 有权
标题翻译：模块化芯片制造技术
公开(公告)号：US20110121456A1
公开(公告)日：2011-05-26
申请号：US13013517
申请日：2011-01-25
申请人： Alain Caron , John Ulrich Knickerbocker
发明人： Alain Caron , John Ulrich Knickerbocker
IPC分类号： H01L23/48
CPC分类号： H01L23/5385 , H01L21/486 , H01L23/5384 , H01L23/60 , H01L24/16 , H01L25/0652 , H01L2224/16 , H01L2224/16225 , H01L2924/00014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01047 , H01L2924/01078 , H01L2924/01322 , H01L2924/04941 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/19105 , H01L2924/00 , H01L2224/48
摘要： Techniques for modular chip fabrication are provided. In one aspect, a modular chip structure is provided. The modular chip structure comprises a substrate; a carrier platform attached to the substrate, the carrier platform comprising a plurality of conductive vias extending through the carrier platform; and a wiring layer on the carrier platform in contact with one or more of the conductive vias, wherein the wiring layer comprises one or more wiring levels and is configured to divide the carrier platform into a plurality of voltage islands; and chips, chip macros or at least one chip in combination with at least one chip macro assembled on the carrier platform.
摘要翻译：提供了模块化芯片制造技术。一方面，提供了一种模块化芯片结构。模块化芯片结构包括基板; 载体平台，其附接到所述基底，所述载体平台包括延伸穿过所述载体平台的多个导电通孔; 以及载体平台上的一个或多个导电通孔接触的布线层，其中所述布线层包括一个或多个布线层，并且被配置为将所述载体平台划分成多个电压岛; 芯片，芯片宏或至少一个芯片组合在载体平台上组装的至少一个芯片宏。

5. 发明授权

US09088416B2 Method for securely associating data with HTTP and HTTPS sessions 有权
标题翻译：安全地将数据与HTTP和HTTPS会话关联的方法
公开(公告)号：US09088416B2
公开(公告)日：2015-07-21
申请号：US12094894
申请日：2006-11-24
申请人： Nikolai Grigoriev , Haraldur Thorkelsson , Sylvain Legault , Alain Caron
发明人： Nikolai Grigoriev , Haraldur Thorkelsson , Sylvain Legault , Alain Caron
IPC分类号： H04L29/06 , H04L9/32 , H04L29/08
CPC分类号： H04L9/3213 , H04L63/0428 , H04L63/168 , H04L67/02
摘要： A computing system, method and product comprising a server, a mobile device comprising a client interconnected with the server via a data network, the client identified by a credential which is unavailable to the client and an intermediate node interconnected to the client and the server via the data network wherein the credential is available to the intermediate node. Upon reception of a service request from the client at a first server address the server redirects the client to transmit the service request to a second server address via the intermediate node together with a token, wherein the intermediate node appends a credential identifying the client to the redirected service request and the token and relays the redirected service request, the token and the credential to the second server address.
摘要翻译：一种包括服务器的计算系统，方法和产品，包括经由数据网络与服务器互连的客户端的移动设备，由客户端不可用的证书标识的客户端和经由客户端与服务器互连的中间节点数据网络，其中证书可用于中间节点。当在第一服务器地址从客户端接收到服务请求时，服务器重定向客户机，经由中间节点与令牌一起将服务请求发送到第二服务器地址，其中中间节点将识别客户端的证书附加到重定向的服务请求和令牌，并将重定向的服务请求，令牌和凭证中继到第二个服务器地址。

6. 发明授权

US08812597B2 Method and system for instant messaging traffic routing 有权
标题翻译：即时消息流量路由的方法和系统
公开(公告)号：US08812597B2
公开(公告)日：2014-08-19
申请号：US12033489
申请日：2008-02-19
申请人： Gwenael Le Bodic , Alain Caron , Jean Regnier , Manuel Laflamme
发明人： Gwenael Le Bodic , Alain Caron , Jean Regnier , Manuel Laflamme
IPC分类号： G06F15/16 , H04L12/58
CPC分类号： H04L51/04 , H04L51/00 , H04L51/38
摘要： There is described an interconnect hub for routing an Instant Message (IM) or related communication between a sending IM device in a first IM community and a recipient IM device in one of a plurality of potential second IM communities. The interconnect hub comprises a router for determining the destination of IM communications and routing the IM communications to the intended recipient, a search function for finding the service provider providing IM services to the user identifier, and a cache comprising a plurality of records associating user identifiers with corresponding service providers (mobile or Internet). When the IM communication is received by the interconnect hub, the router examines the recipient user identifier, accesses the cache keying on the recipient user identifier, retrieves the service provider associated with the recipient user identifier, and forwards the IM communication to the associated service provider for delivery to the intended recipient. If there is no record in the cache for the user identifier, the searcher initiates a search to identify the service provider and to update the cache if the service provider is found.
摘要翻译：描述了用于路由即时消息（IM）或第一IM社区中的发送IM设备与多个潜在第二IM社区之一中的接收者IM设备之间的相关通信的互连中心。互连集线器包括用于确定IM通信的目的地并将IM通信路由到预期接收者的路由器，用于查找为用户标识符提供IM服务的服务提供商的搜索功能，以及包括将用户标识符相关联的多个记录的高速缓存与相应的服务提供商（移动或互联网）。当互连集线器接收到IM通信时，路由器检查接收方用户标识符，访问接收方用户标识符上的缓存密钥，检索与接收方用户标识符相关联的服务提供商，并将IM通信转发给相关联的服务提供商送到预定的收件人。如果高速缓存中没有用户标识符的记录，则搜索者启动搜索以识别服务提供商并且如果找到服务提供者则更新缓存。

7. 发明申请

US20120326321A1 Techniques for Modular Chip Fabrication 失效
标题翻译：模块化芯片制造技术
公开(公告)号：US20120326321A1
公开(公告)日：2012-12-27
申请号：US13600716
申请日：2012-08-31
申请人： Alain Caron , John Ulrich Knickerbocker
发明人： Alain Caron , John Ulrich Knickerbocker
IPC分类号： H01L23/48
CPC分类号： H01L23/5385 , H01L21/486 , H01L23/5384 , H01L23/60 , H01L24/16 , H01L25/0652 , H01L2224/16 , H01L2224/16225 , H01L2924/00014 , H01L2924/01015 , H01L2924/01021 , H01L2924/01047 , H01L2924/01078 , H01L2924/01322 , H01L2924/04941 , H01L2924/09701 , H01L2924/10253 , H01L2924/13091 , H01L2924/14 , H01L2924/1433 , H01L2924/15311 , H01L2924/19105 , H01L2924/00 , H01L2224/48
摘要： Techniques for modular chip fabrication are provided. In one aspect, a modular chip structure is provided. The modular chip structure comprises a substrate; a carrier platform attached to the substrate, the carrier platform comprising a plurality of conductive vias extending through the carrier platform; and a wiring layer on the carrier platform in contact with one or more of the conductive vias, wherein the wiring layer comprises one or more wiring levels and is configured to divide the carrier platform into a plurality of voltage islands; and chips, chip macros or at least one chip in combination with at least one chip macro assembled on the carrier platform.
摘要翻译：提供了模块化芯片制造技术。一方面，提供了一种模块化芯片结构。模块化芯片结构包括基板; 载体平台，其附接到所述基底，所述载体平台包括延伸穿过所述载体平台的多个导电通孔; 以及载体平台上的一个或多个导电通孔接触的布线层，其中所述布线层包括一个或多个布线层，并且被配置为将所述载体平台划分成多个电压岛; 芯片，芯片宏或至少一个芯片组合在载体平台上组装的至少一个芯片宏。

8. 发明申请

US20080201441A1 Method and System for Instant Messaging Traffic Routing 有权
标题翻译：即时消息流量路由的方法和系统
公开(公告)号：US20080201441A1
公开(公告)日：2008-08-21
申请号：US12033489
申请日：2008-02-19
申请人： Gwenael Le Bodic , Alain Caron , Jean Regnier , Manuel Laflamme
发明人： Gwenael Le Bodic , Alain Caron , Jean Regnier , Manuel Laflamme
IPC分类号： G06F17/30 , G06F7/10 , G06F15/16
CPC分类号： H04L51/04 , H04L51/00 , H04L51/38
摘要： There is described an interconnect hub for routing an Instant Message (IM) or related communication between a sending IM device in a first IM community and a recipient IM device in one of a plurality of potential second IM communities. The interconnect hub comprises a router for determining the destination of IM communications and routing the IM communications to the intended recipient, a search function for finding the service provider providing IM services to the user identifier, and a cache comprising a plurality of records associating user identifiers with corresponding service providers (mobile or Internet). When the IM communication is received by the interconnect hub, the router examines the recipient user identifier, accesses the cache keying on the recipient user identifier, retrieves the service provider associated with the recipient user identifier, and forwards the IM communication to the associated service provider for delivery to the intended recipient. If there is no record in the cache for the user identifier, the searcher initiates a search to identify the service provider and to update the cache if the service provider is found.
摘要翻译：描述了用于路由即时消息（IM）或第一IM社区中的发送IM设备与多个潜在第二IM社区之一中的接收者IM设备之间的相关通信的互连中心。互连集线器包括用于确定IM通信的目的地并将IM通信路由到预期接收者的路由器，用于查找为用户标识符提供IM服务的服务提供商的搜索功能，以及包括将用户标识符相关联的多个记录的高速缓存与相应的服务提供商（移动或互联网）。当互连集线器接收到IM通信时，路由器检查接收方用户标识符，访问接收方用户标识符上的缓存密钥，检索与接收方用户标识符相关联的服务提供商，并将IM通信转发给相关联的服务提供商送到预定的收件人。如果高速缓存中没有用户标识符的记录，则搜索者启动搜索以识别服务提供商并且如果找到服务提供者则更新缓存。

9. 发明授权

US07146596B2 Integrated circuit chip having a ringed wiring layer interposed between a contact layer and a wiring grid 失效
标题翻译：集成电路芯片，其具有介于接触层和布线栅之间的环形布线层
公开(公告)号：US07146596B2
公开(公告)日：2006-12-05
申请号：US10604995
申请日：2003-08-29
申请人： Thomas R. Bednar , Timothy W. Budell , Patrick H. Buffet , Alain Caron , James V. Crain, Jr. , Douglas W. Kemerer , Donald S. Kent , Esmaeil Rahmati
发明人： Thomas R. Bednar , Timothy W. Budell , Patrick H. Buffet , Alain Caron , James V. Crain, Jr. , Douglas W. Kemerer , Donald S. Kent , Esmaeil Rahmati
IPC分类号： G06F17/50 , H01L23/52
CPC分类号： H01L23/5286 , H01L2924/0002 , H01L2924/00
摘要： An integrated circuit chip having a contact layer that includes a plurality of Vdd, Vddx, ground and I/O contacts arranged in a generally radial pattern having diagonal and major axis symmetry and generally defining four quadrants. A multilayer X-Y power grid is located beneath the contact layer. A wiring layer is interposed between the contact layer and power grid to provide a well-behaved electrical transition between the generally radial Vdd, Vddx and ground contacts and the rectangular X-Y power grid. The interposed wiring layer includes concentric square rings of Vdd, Vddx and ground wires located alternatingly with one another. The Vddx wires are discontinuous between adjacent quadrants so that the magnitude of Vddx may be different in each quadrant of the chip if desired.
摘要翻译：一种具有接触层的集成电路芯片，该接触层包括多个Vdd，Vddx，接地和I / O触点，其以大致径向图案布置，具有对角线和长轴对称性并且通常限定四个象限。多层X-Y电网位于接触层下方。在接触层和电网之间插入布线层，以在大致径向Vdd，Vddx和接地触点和矩形X-Y电网之间提供良好的电转变。所插入的布线层包括彼此交替布置的Vdd，Vddx和接地线的同心方形环。 Vddx线在相邻象限之间是不连续的，使得如果需要，Vddx的幅度可以在芯片的每个象限中不同。

10. 发明授权

US06703706B2 Concurrent electrical signal wiring optimization for an electronic package 有权
标题翻译：电子封装并发电信号布线优化
公开(公告)号：US06703706B2
公开(公告)日：2004-03-09
申请号：US10041347
申请日：2002-01-08
申请人： Jean Audet , Timothy W. Budell , Patrick H. Buffet , Alain Caron
发明人： Jean Audet , Timothy W. Budell , Patrick H. Buffet , Alain Caron
IPC分类号： H01L2334
CPC分类号： H05K1/0216 , G06F17/5077 , H01L23/50 , H01L2924/0002 , H01L2924/3011 , H05K1/0237 , H05K1/0298 , H05K3/0005 , H05K2201/09236 , H05K2201/09672 , H01L2924/00
摘要： An electrical structure to optimize a signal wire structure. The electrical structure provides concurrent optimization of a plurality of wire parameters, providing a plurality of wiring solutions, wherein each of said wiring solutions produces a wiring package having different wire parameters, providing an electronic package, determining the optimal wiring solutions for said electronic package; and producing an electronic package, using the optimized wiring package solutions. The resulting apparatus is also disclosed.
摘要翻译：一种优化信号线结构的电气结构。电结构提供多个线参数的并发优化，提供多个布线解决方案，其中每个所述布线解决方案产生具有不同导线参数的布线封装，提供电子封装，确定用于所述电子封装的最佳布线解决方案; 并使用优化的布线包解决方案生产电子封装。还公开了所得装置。

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