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    • 7. 发明授权
    • Method for manufacturing multi-layer ceramic capacitor
    • 制造多层陶瓷电容器的方法
    • US5311651A
    • 1994-05-17
    • US940586
    • 1992-09-04
    • Yoon Ho KimTae Sung OhChang Bong Lee
    • Yoon Ho KimTae Sung OhChang Bong Lee
    • H01G4/12H01G4/232H01G4/30
    • H01G4/2325H01G4/302Y10T29/435
    • A method for manufacturing multi-layer ceramic capacitors wherein the internal electrodes are formed by introducing molten metallic material into the void layers of a ceramic dielectric body. The method comprises of applying and baking paste of silver or platinum/silver on the opposite end surfaces of ceramic dielectric body to form first external electrodes and introducing molten metallic material into void layers through injection openings which are in communication with the void layers and open at side surfaces of the ceramic dielectric body to form internal electrodes. The ceramic dielectric body can be filled with molten metal for relative short time and under low pressure as compared with a prior art ceramic dielectric body having porous penetrable barriers.
    • 一种制造多层陶瓷电容器的方法,其中通过将熔融金属材料引入陶瓷电介质体的空隙层而形成内部电极。 该方法包括在陶瓷介电体的相对端面上涂敷和烘烤银或铂/银的糊料,以形成第一外部电极,并通过与空隙层连通的开口将熔融金属材料引入空隙层, 陶瓷电介质体的侧表面形成内部电极。 与具有多孔可穿透屏障的现有技术的陶瓷电介质体相比,陶瓷电介质体可以相对较短时间和低压下填充熔融金属。