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1. 发明申请

US20120038383A1 DIRECT-DOCKING PROBING DEVICE 审中-公开
标题翻译：直接锁定探测器
公开(公告)号：US20120038383A1
公开(公告)日：2012-02-16
申请号：US13091148
申请日：2011-04-21
申请人： Chien-Chou WU , Ming-Chi CHEN , Tsung-Yi CHEN , Chung-Che LI
发明人： Chien-Chou WU , Ming-Chi CHEN , Tsung-Yi CHEN , Chung-Che LI
IPC分类号： G01R31/00
CPC分类号： G01R31/2887 , G01R31/2889
摘要： A direct-docking probing device is provided. The probing device includes a probe interface board, a space transformer, a conductive elastic member, a fixing frame, and at least one vertical probe assembly. The space transformer includes a space transforming plate and a reinforcing plate, and the mechanical strength of the reinforcing plate is larger than that of the space transforming plate. The reinforcing plate is electrically connected with the space transforming plate. Furthermore, the conductive elastic member is electrically connected with the probe interface board and the reinforcing plate. The fixing frame includes a stiffener, a frame body, and a pressing portion. The stiffener is disposed on the probe interface board. The frame body contains the conductive elastic member. The pressing portion is pressed on the space transformer. The vertical probe assembly includes a plurality of vertical probes which are electrically connected with the space transforming plate.
摘要翻译：提供直接对接探测装置。探测装置包括探针接口板，空间变压器，导电弹性构件，固定框架和至少一个垂直探针组件。空间变压器包括空间转换板和加强板，并且加强板的机械强度大于空间转换板的机械强度。加强板与空间转换板电连接。此外，导电弹性构件与探针接口板和加强板电连接。固定框架包括加强件，框架体和按压部分。加强筋设置在探针接口板上。框体包含导电弹性构件。按压部分被压在空间变压器上。垂直探针组件包括与空间变换板电连接的多个垂直探头。

2. 发明授权

US09234917B2 Probing device and manufacturing method thereof 有权
标题翻译：探测装置及其制造方法
公开(公告)号：US09234917B2
公开(公告)日：2016-01-12
申请号：US13612849
申请日：2012-09-13
申请人： Chien-Chou Wu , Ming-Chi Chen , Chung-Che Li
发明人： Chien-Chou Wu , Ming-Chi Chen , Chung-Che Li
IPC分类号： G01R31/00 , G01R3/00 , H01F38/20 , H01F41/00 , H05K3/24 , H05K3/32 , G01R1/073
CPC分类号： G01R3/00 , G01R1/07378 , H01F38/20 , H01F41/00 , H05K3/241 , H05K3/32 , Y10T29/4902 , Y10T29/49124
摘要： A probing device and manufacturing method thereof are provided. The manufacturing method includes first disposing a plurality of space transformers on a reinforcing plate and the space transformer includes several first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings is formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer is planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.
摘要翻译：提供探测装置及其制造方法。该制造方法包括：在加强板上首先设置多个空间变压器，空间变压器包括多个第一焊盘。然后，空间变压器固定在加强板上。此后，在空间变压器上形成具有多个开口的光致抗蚀剂膜。第一垫设置在开口中。之后，形成金属层并将其覆盖在第一焊盘上。之后，除去光致抗蚀剂膜，并且将金属层平坦化以形成第二焊盘。之后，加强板与PCB电连接。此后，设置具有多个探测区域的探头，并且每个探测区域对应于空间变换器之一。探测区域中的探头与空间变压器的内部电路电连接。

3. 发明申请

US20130033283A1 PROBING DEVICE 有权
标题翻译：探测器件
公开(公告)号：US20130033283A1
公开(公告)日：2013-02-07
申请号：US13562276
申请日：2012-07-30
申请人： Chien-Chou Wu , Ming-Chi Chen , Chung-Che Li
发明人： Chien-Chou Wu , Ming-Chi Chen , Chung-Che Li
IPC分类号： G01R31/00
CPC分类号： G01R1/07342 , G01R1/07378
摘要： A probing device includes a circuit board, a reinforcing plate, at least one space transformer and at least one probe assembly. The reinforcing plate is disposed on the circuit board, and the reinforcing plate has a plurality of inner conductive wires electrically connecting to those of the circuit board. The reinforcing plate defines a plurality of receiving space therein. The space transformer is disposed on the reinforcing plate, and the space transformer has a plurality of inner conductive wires electrically connecting to those of the reinforcing plate via a plurality of first solder balls. The probe assembly is disposed on the space transformer, and the probe assembly includes a plurality of probes. The first solder balls are disposed in the receiving spaces, and the reinforcing plate abuts against the space transformer.
摘要翻译：探测装置包括电路板，加强板，至少一个空间变压器和至少一个探针组件。加强板设置在电路板上，加强板具有与电路板电连接的多个内导电线。加强板在其中限定多个容纳空间。空间变压器设置在加强板上，空间变压器具有通过多个第一焊球与多个加强板电连接的多个内导电线。探针组件设置在空间变换器上，探针组件包括多个探针。第一焊球设置在接收空间中，并且加强板抵靠空间变换器。

4. 发明授权

US09347971B2 Probing device 有权
标题翻译：探测装置
公开(公告)号：US09347971B2
公开(公告)日：2016-05-24
申请号：US13562276
申请日：2012-07-30
申请人： Chien-Chou Wu , Ming-Chi Chen , Chung-Che Li
发明人： Chien-Chou Wu , Ming-Chi Chen , Chung-Che Li
IPC分类号： G01R31/00 , G01R1/073
CPC分类号： G01R1/07342 , G01R1/07378
摘要： A probing device includes a circuit board, a reinforcing plate, at least one space transformer and at least one probe assembly. The reinforcing plate is disposed on the circuit board, and the reinforcing plate has a plurality of inner conductive wires electrically connecting to those of the circuit board. The reinforcing plate defines a plurality of receiving space therein. The space transformer is disposed on the reinforcing plate, and the space transformer has a plurality of inner conductive wires electrically connecting to those of the reinforcing plate via a plurality of first solder balls. The probe assembly is disposed on the space transformer, and the probe assembly includes a plurality of probes. The first solder balls are disposed in the receiving spaces, and the reinforcing plate abuts against the space transformer.
摘要翻译：探测装置包括电路板，加强板，至少一个空间变压器和至少一个探针组件。加强板设置在电路板上，加强板具有与电路板电连接的多个内导电线。加强板在其中限定多个容纳空间。空间变压器设置在加强板上，空间变压器具有通过多个第一焊球与多个加强板电连接的多个内导电线。探针组件设置在空间变换器上，探针组件包括多个探针。第一焊球设置在接收空间中，并且加强板抵靠空间变换器。

5. 发明申请

US20130069686A1 PROBING DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：探测装置及其制造方法
公开(公告)号：US20130069686A1
公开(公告)日：2013-03-21
申请号：US13612849
申请日：2012-09-13
申请人： Chien-Chou Wu , Ming-Chi Chen , Chung-Che Li
发明人： Chien-Chou Wu , Ming-Chi Chen , Chung-Che Li
IPC分类号： G01R1/073 , G01R3/00
CPC分类号： G01R3/00 , G01R1/07378 , H01F38/20 , H01F41/00 , H05K3/241 , H05K3/32 , Y10T29/4902 , Y10T29/49124
摘要： A probing device and manufacturing method thereof are provided. The manufacturing method includes first disposing a plurality of space transformers on a reinforcing plate and the space transformer includes several first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings is formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer is planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.
摘要翻译：提供探测装置及其制造方法。该制造方法包括：在加强板上首先设置多个空间变压器，空间变压器包括多个第一焊盘。然后，空间变压器固定在加强板上。此后，在空间变压器上形成具有多个开口的光致抗蚀剂膜。第一垫设置在开口中。之后，形成金属层并将其覆盖在第一焊盘上。之后，除去光致抗蚀剂膜，并且将金属层平坦化以形成第二焊盘。之后，加强板与PCB电连接。此后，设置具有多个探测区域的探头，并且每个探测区域对应于空间变换器之一。探测区域中的探头与空间变压器的内部电路电连接。

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