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    • 1. 发明申请
    • PROBING DEVICE
    • 探测器件
    • US20130033283A1
    • 2013-02-07
    • US13562276
    • 2012-07-30
    • Chien-Chou WuMing-Chi ChenChung-Che Li
    • Chien-Chou WuMing-Chi ChenChung-Che Li
    • G01R31/00
    • G01R1/07342G01R1/07378
    • A probing device includes a circuit board, a reinforcing plate, at least one space transformer and at least one probe assembly. The reinforcing plate is disposed on the circuit board, and the reinforcing plate has a plurality of inner conductive wires electrically connecting to those of the circuit board. The reinforcing plate defines a plurality of receiving space therein. The space transformer is disposed on the reinforcing plate, and the space transformer has a plurality of inner conductive wires electrically connecting to those of the reinforcing plate via a plurality of first solder balls. The probe assembly is disposed on the space transformer, and the probe assembly includes a plurality of probes. The first solder balls are disposed in the receiving spaces, and the reinforcing plate abuts against the space transformer.
    • 探测装置包括电路板,加强板,至少一个空间变压器和至少一个探针组件。 加强板设置在电路板上,加强板具有与电路板电连接的多个内导电线。 加强板在其中限定多个容纳空间。 空间变压器设置在加强板上,空间变压器具有通过多个第一焊球与多个加强板电连接的多个内导电线。 探针组件设置在空间变换器上,探针组件包括多个探针。 第一焊球设置在接收空间中,并且加强板抵靠空间变换器。
    • 2. 发明申请
    • PROBING DEVICE AND MANUFACTURING METHOD THEREOF
    • 探测装置及其制造方法
    • US20130069686A1
    • 2013-03-21
    • US13612849
    • 2012-09-13
    • Chien-Chou WuMing-Chi ChenChung-Che Li
    • Chien-Chou WuMing-Chi ChenChung-Che Li
    • G01R1/073G01R3/00
    • G01R3/00G01R1/07378H01F38/20H01F41/00H05K3/241H05K3/32Y10T29/4902Y10T29/49124
    • A probing device and manufacturing method thereof are provided. The manufacturing method includes first disposing a plurality of space transformers on a reinforcing plate and the space transformer includes several first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings is formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer is planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.
    • 提供探测装置及其制造方法。 该制造方法包括:在加强板上首先设置多个空间变压器,空间变压器包括多个第一焊盘。 然后,空间变压器固定在加强板上。 此后,在空间变压器上形成具有多个开口的光致抗蚀剂膜。 第一垫设置在开口中。 之后,形成金属层并将其覆盖在第一焊盘上。 之后,除去光致抗蚀剂膜,并且将金属层平坦化以形成第二焊盘。 之后,加强板与PCB电连接。 此后,设置具有多个探测区域的探头,并且每个探测区域对应于空间变换器之一。 探测区域中的探头与空间变压器的内部电路电连接。
    • 3. 发明授权
    • Probing device
    • 探测装置
    • US09347971B2
    • 2016-05-24
    • US13562276
    • 2012-07-30
    • Chien-Chou WuMing-Chi ChenChung-Che Li
    • Chien-Chou WuMing-Chi ChenChung-Che Li
    • G01R31/00G01R1/073
    • G01R1/07342G01R1/07378
    • A probing device includes a circuit board, a reinforcing plate, at least one space transformer and at least one probe assembly. The reinforcing plate is disposed on the circuit board, and the reinforcing plate has a plurality of inner conductive wires electrically connecting to those of the circuit board. The reinforcing plate defines a plurality of receiving space therein. The space transformer is disposed on the reinforcing plate, and the space transformer has a plurality of inner conductive wires electrically connecting to those of the reinforcing plate via a plurality of first solder balls. The probe assembly is disposed on the space transformer, and the probe assembly includes a plurality of probes. The first solder balls are disposed in the receiving spaces, and the reinforcing plate abuts against the space transformer.
    • 探测装置包括电路板,加强板,至少一个空间变压器和至少一个探针组件。 加强板设置在电路板上,加强板具有与电路板电连接的多个内导电线。 加强板在其中限定多个容纳空间。 空间变压器设置在加强板上,空间变压器具有通过多个第一焊球与多个加强板电连接的多个内导电线。 探针组件设置在空间变换器上,探针组件包括多个探针。 第一焊球设置在接收空间中,并且加强板抵靠空间变换器。
    • 4. 发明授权
    • Probing device and manufacturing method thereof
    • 探测装置及其制造方法
    • US09234917B2
    • 2016-01-12
    • US13612849
    • 2012-09-13
    • Chien-Chou WuMing-Chi ChenChung-Che Li
    • Chien-Chou WuMing-Chi ChenChung-Che Li
    • G01R31/00G01R3/00H01F38/20H01F41/00H05K3/24H05K3/32G01R1/073
    • G01R3/00G01R1/07378H01F38/20H01F41/00H05K3/241H05K3/32Y10T29/4902Y10T29/49124
    • A probing device and manufacturing method thereof are provided. The manufacturing method includes first disposing a plurality of space transformers on a reinforcing plate and the space transformer includes several first pads. Then, the space transformer is fixed on the reinforcing plate. Thereafter, photoresist films having a plurality of openings is formed on the space transformer. The first pads are disposed in the openings. After that, a metal layer is formed and covered on the first pad. Later, the photoresist film is removed and the metal layer is planarized to form a second pad. Afterwards, the reinforcing plate is electrically connected with a PCB. Thereafter, a probe head having a plurality of probing area is provided and each probing area is corresponding to one of the space transformer. The probes in the probing area are electrically connected with the internal circuitry of the space transformer.
    • 提供探测装置及其制造方法。 该制造方法包括:在加强板上首先设置多个空间变压器,空间变压器包括多个第一焊盘。 然后,空间变压器固定在加强板上。 此后,在空间变压器上形成具有多个开口的光致抗蚀剂膜。 第一垫设置在开口中。 之后,形成金属层并将其覆盖在第一焊盘上。 之后,除去光致抗蚀剂膜,并且将金属层平坦化以形成第二焊盘。 之后,加强板与PCB电连接。 此后,设置具有多个探测区域的探头,并且每个探测区域对应于空间变换器之一。 探测区域中的探头与空间变压器的内部电路电连接。