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1. 发明申请

US20230068210A1 BRAZING MATERIAL, METHOD FOR PRODUCING THE SAME, AND METHOD FOR PRODUCING METAL-CERAMICS BONDED SUBSTRATE 有权
公开(公告)号：US20230068210A1
公开(公告)日：2023-03-02
申请号：US17914853
申请日：2021-03-18
申请人： DOWA METALTECH CO., LTD.
发明人： Ayumu OZAKI
IPC分类号： B23K35/30 , B23K35/02
摘要： Provided are a brazing material in paste form containing a powder mixture that contains titanium powder having an average particle diameter (D50) of 20 μm or less in an amount of 0.7 to 2.0 mass %, copper powder in an amount of 3 to 15 mass %, and silver powder as the remaining portion, and a vehicle, and techniques associated with the brazing material.

2. 发明申请

US20220033317A1 ALUMINUM/CERAMIC BONDING SUBSTRATE AND METHOD FOR PRODUCING SAME 有权
公开(公告)号：US20220033317A1
公开(公告)日：2022-02-03
申请号：US17383541
申请日：2021-07-23
申请人： DOWA METALTECH CO, LTD. , Mitsubishi Electric Corporation
发明人： Koji Kobayashi , Takuma Tsubota , Hideyo Osanai , Daisuke Oya
IPC分类号： C04B37/02 , C22C21/08 , H05K3/10
摘要： There is provided an aluminum/ceramic bonding substrate having a ceramic substrate, an aluminum plate of an aluminum alloy which is bonded directly to one side of the ceramic substrate, an aluminum base plate of the aluminum alloy which is bonded directly to the other side of the ceramic substrate, and a plate-shaped reinforcing member which has a higher strength than that of the aluminum base plate and which is arranged in the aluminum base plate to be bonded directly to the aluminum base plate, wherein the aluminum alloy contains 0.01 to 0.2% by weight of magnesium, 0.01 to 0.1% by weight of silicon, and the balance being aluminum and unavoidable impurities.

3. 发明授权

US11208730B2 Composite plated product and method for producing same 有权
公开(公告)号：US11208730B2
公开(公告)日：2021-12-28
申请号：US16810963
申请日：2020-03-06
申请人： DOWA METALTECH CO., LTD.
发明人： Yuta Sonoda , Yukiya Kato , Hiroto Narieda
IPC分类号： B32B15/00 , C25D3/46 , C25D15/00 , C25D5/12
摘要： There are provided a composite plated product, which has little uneven appearance and good wear resistance, and a method for producing the same without the need of any cyanide-containing silver-plating solutions and any silver-plating solutions containing silver nitrate as a silver salt. A sulfonic-acid-containing silver-plating solution, to which a carbon particle dispersing solution (preferably containing a silicate) is added, is used for electroplating a base material (preferably made of copper or a copper alloy) to form a composite plating film of a composite material, which contains the carbon particles in a silver layer, on the base material to produce a composite plated product.

4. 发明授权

US11047023B2 Cu-Ni-Si based copper alloy sheet material and production method 有权
公开(公告)号：US11047023B2
公开(公告)日：2021-06-29
申请号：US16087829
申请日：2016-10-14
申请人： DOWA METALTECH CO., LTD.
发明人： Toshiya Shutoh , Hisashi Suda , Fumiaki Sasaki
IPC分类号： C22C9/06 , C22F1/08 , C22C9/10 , B21B3/00 , B21D1/10
摘要： A copper alloy sheet material that is excellent in surface smoothness of an etched surface has a composition containing, (mass %), from 1.0 to 4.5% of Ni, from 0.1 to 1.2% of Si, from 0 to 0.3% of Mg, from 0 to 0.2% of Cr, from 0 to 2.0% of Co, from 0 to 0.1% of P, from 0 to 0.05% of B, from 0 to 0.2% of Mn, from 0 to 0.5% of Sn, from 0 to 0.5% of Ti, from 0 to 0.2% of Zr, from 0 to 0.2% of Al, from 0 to 0.3% of Fe, from 0 to 1.0% of Zn, the balance Cu and unavoidable impurities. A number density of coarse secondary phase particles has a major diameter of 1.0 μm or more of 4.0×103 per square millimeter or less. KAM value measured with a step size of 0.5 μm is more than 3.00.

5. 发明申请

US20190264313A1 SHEET MATERIAL OF COPPER ALLOY AND METHOD FOR PRODUCING SAME 审中-公开
公开(公告)号：US20190264313A1
公开(公告)日：2019-08-29
申请号：US16345298
申请日：2017-10-24
申请人： Dowa Metaltech Co., Ltd.
发明人： Naota Higami , Takanobu Sugimoto , Tomotsugu Aoyama , Hiroto Narieda
IPC分类号： C22F1/08 , C22C9/04
摘要： There are provided an inexpensive sheet material of a copper alloy having an excellent bending workability and an excellent stress corrosion cracking resistance while maintaining a high strength, and a method for producing the same. The sheet material of the copper alloy is produced by a method comprising the steps of: melting and casting raw materials of a copper alloy which has a chemical composition comprising 17 to 32% by weight of zinc, 0.1 to 4.5% by weight of tin, 0.01 to 2.0% by weight of silicon, 0.01 to 5.0% by weight of nickel, and the balance being copper and unavoidable impurities; hot-rolling the cast copper alloy in a temperature range of from 900° C. to 400° C.; cooling the hot-rolled copper alloy at a cooling rate of 1 to 15° C./min. from 400° C. to 300° C.; cold-rolling the cooled copper alloy; recrystallization-annealing the cold-rolled copper alloy at a temperature of 300 to 800° C.; and then, ageing-annealing the recrystallization-annealed copper alloy at a temperature of 300 to 600° C.

6. 发明申请

US20170370015A1 SILVER-PLATED PRODUCT AND METHOD FOR PRODUCING SAME 审中-公开
公开(公告)号：US20170370015A1
公开(公告)日：2017-12-28
申请号：US15542946
申请日：2016-01-15
申请人： DOWA METALTECH CO., LTD.
发明人： Shunki Sadamori , Hiroshi Miyazawa , Masafumi Ogata , Keisuke Shinohara
IPC分类号： C25D3/46 , H01R4/58 , H01H1/025 , C25D7/00 , C25D5/00 , H01R13/03 , B32B15/01
CPC分类号： C25D3/46 , B32B15/018 , C25D3/12 , C25D5/00 , C25D5/12 , C25D7/00 , H01H1/025 , H01H2011/046 , H01R4/58 , H01R13/03 , Y10T428/12896
摘要： A silver-plated product is produced by forming a surface layer of silver on a base material by electroplating at a liquid temperature of 10 to 35° C. and a current density of 3 to 15 A/dm2 in a silver plating solution so as to satisfy (32.6x−300)≦y≦(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and a current density is y (g·A/L·dm2) and that a liquid temperature of the silver plating solution is x (° C.), the silver plating solution containing 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium.

7. 发明授权

US09646739B2 Method for producing silver-plated product 有权
公开(公告)号：US09646739B2
公开(公告)日：2017-05-09
申请号：US14348118
申请日：2012-09-20
申请人： DOWA METALTECH CO., LTD.
发明人： Keisuke Shinohara , Masafumi Ogata , Hiroshi Miyazawa , Akira Sugawara
IPC分类号： H01B13/00 , H01B5/14 , H01B1/02 , C22C5/06 , C23C30/00 , C25D3/46 , C25D7/00 , C23C28/02 , H01R13/03 , H01H1/023 , H01H11/04 , H01R43/16 , C25D5/34
CPC分类号： H01B5/14 , C22C5/06 , C23C28/02 , C23C28/021 , C23C28/023 , C23C30/00 , C23C30/005 , C25D3/46 , C25D5/34 , C25D7/00 , H01B1/02 , H01B13/00 , H01H1/023 , H01H11/041 , H01R13/03 , H01R43/16 , Y10T428/12882
摘要： There is provided a silver-plated product which has a good bendability and which can restrain the rise of the contact resistance thereof even if it is used in a high-temperature environment, and a method for producing the same. In a silver-plated product wherein a surface layer of silver is formed on the surface of a base material of copper or a copper alloy, or on the surface of an underlying layer of copper or a copper alloy formed on the base material, the percentage of an X-ray diffraction intensity on {200} plane of the surface layer with respect to the sum of X-ray diffraction intensities on {111}, {200}, {220} and {311} planes of the surface layer is 40% or more.

8. 发明申请

US20170122681A1 HEAT RADIATING PLATE AND METHOD FOR PRODUCING SAME 审中-公开
公开(公告)号：US20170122681A1
公开(公告)日：2017-05-04
申请号：US15278340
申请日：2016-09-28
申请人： DOWA METALTECH CO., LTD.
发明人： Tomotsugu Aoyama , Akira Sugawara
IPC分类号： F28F21/08 , C22C9/02 , B21B3/00 , H01L23/373 , H01L21/48 , C22F1/08 , H01L23/367
CPC分类号： F28F21/085 , B21B3/00 , B21B2003/005 , B21B2261/22 , C22C9/02 , C22F1/08 , H01L21/4878 , H01L23/367 , H01L23/3736
摘要： In a method for producing a heat radiating plate 20, the method containing the steps of: finish cold-rolling an annealed material to obtain a strip; causing the strip to wind in the shape of a coil to prepare a coil stock; unwinding the coil stock by means of an uncoiler 10 to obtain a strip 12; causing the strip 12 to pass through a gap between the rolls of a leveler 14 to correct the shape thereof; progressively feeding the corrected strip 12 to a progressive die 18 via a feeder 16 to progressively press-working the strip 12 to produce a heat radiating plate 20, the finish cold-rolling is carried out so that a ratio of the Vickers hardness HV after the finish cold-rolling to the Vickers hardness HV before the finish cold-rolling is not less than 1.2, and the corrected strip 12 is allowed to bend due to its own weight between the leveler 14 and the feeder 16 so that the minimum value of deflection (L1−L0) is 0.5 to 2.0 m assuming that L0 is a distance between a roll at the last sending side of the leveler 14 and a roll at the first entrance side of the feeder 16 and that L1 is the length of the strip 12 between the roll at the last sending side of the leveler 14 and the roll at the first entrance side of the feeder 16.

9. 发明授权

US09412482B2 Cu-Ni-Co-Si based copper alloy sheet material and method for producing the same 有权
标题翻译： Cu-Ni-Co-Si系铜合金板材及其制造方法
公开(公告)号：US09412482B2
公开(公告)日：2016-08-09
申请号：US14068256
申请日：2013-10-31
申请人： DOWA METALTECH CO., LTD.
发明人： Toshiya Kamada , Takashi Kimura , Weilin Gao , Fumiaki Sasaki , Akira Sugawara
IPC分类号： C22C9/06 , H01B1/02 , C22F1/08
CPC分类号： H01B1/026 , C21D2201/05 , C21D2211/004 , C22C9/06 , C22F1/08
摘要： A Cu—Ni—Co—Si based copper alloy sheet material has second phase particles existing in a matrix, with a number density of ultrafine second phase particles is 1.0×109 number/mm2 or more. A number density of fine second phase particles is not more than 5.0×107 number/mm2. A number density of coarse second phase particles is 1.0×105 number/mm2 or more and not more than 1.0×106 number/mm2. The material has crystal orientation satisfying the following equation (1): I{200}/I0{200}≧3.0 (1) wherein I{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane on the sheet material sheet surface; and I0{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane in a pure copper standard powder sample.
摘要翻译： Cu-Ni-Co-Si系铜合金板材具有存在于基体中的第二相粒子，超细二次粒子的数量密度为1.0×10 9个/ mm 2以上。细密度的第二相颗粒的密度不超过5.0×10 7个/ mm 2。粗二次粒子的数密度为1.0×10 5个/ mm 2以上且1.0×10 6个/ mm 2以下。该材料具有满足以下等式（1）的晶体取向：I {200} / I0 {200}≥3.0（1）其中I {200}表示{200}晶面的X射线衍射峰的积分强度在片材表面上; I0 {200}表示纯铜标准粉末样品中{200}晶面的X射线衍射峰的积分强度。

10. 发明申请

US20140291159A1 PARTIAL PLATING DEVICE AND PARTIAL PLATING METHOD 有权
标题翻译：部分镀层器件和部分镀层法
公开(公告)号：US20140291159A1
公开(公告)日：2014-10-02
申请号：US14351713
申请日：2012-10-18
申请人： DOWA METALTECH CO., LTD.
发明人： Kentaro Arai , Hiroshi Miyazawa
IPC分类号： C25D17/06
CPC分类号： C25D17/06 , C25D5/022 , C25D7/0635 , C25D7/0671 , C25D7/0685 , C25D17/00
摘要： A partial plating device includes a drum jig which has a plurality of positioning pins provided on the outer peripheral surface thereof, and which feeds a metal member around the outer periphery thereof by engaging the metal member with the positioning pins; a rotating shaft which rotatably supports the drum jig, a jet unit that supplies plating liquid to the metal member, and a brake unit that reduces the circumferential speed of the drum jig, and which is fitted to the rotating shaft. A plating device and a partial plating method in which plating is not carried out on the first region of a metal member on the carrying-in side of the drum jig, but in which plating is carried out on the second region of a metal member on the carrying-out side.
摘要翻译：局部电镀装置包括滚筒夹具，该滚筒夹具具有设置在其外周面上的多个定位销，并且通过使金属构件与定位销接合而将金属构件周向地供给金属构件; 可旋转地支撑滚筒夹具的旋转轴，向金属构件供应电镀液体的喷射单元，以及减小滚筒夹具的圆周速度并且安装在旋转轴上的制动单元。电镀装置和部分电镀方法，其中在滚筒夹具的承载侧的金属构件的第一区域上不进行电镀，但是在金属构件的第二区域上进行电镀执行方面。

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