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1. 发明授权

US09646739B2 Method for producing silver-plated product 有权
公开(公告)号：US09646739B2
公开(公告)日：2017-05-09
申请号：US14348118
申请日：2012-09-20
申请人： DOWA METALTECH CO., LTD.
发明人： Keisuke Shinohara , Masafumi Ogata , Hiroshi Miyazawa , Akira Sugawara
IPC分类号： H01B13/00 , H01B5/14 , H01B1/02 , C22C5/06 , C23C30/00 , C25D3/46 , C25D7/00 , C23C28/02 , H01R13/03 , H01H1/023 , H01H11/04 , H01R43/16 , C25D5/34
CPC分类号： H01B5/14 , C22C5/06 , C23C28/02 , C23C28/021 , C23C28/023 , C23C30/00 , C23C30/005 , C25D3/46 , C25D5/34 , C25D7/00 , H01B1/02 , H01B13/00 , H01H1/023 , H01H11/041 , H01R13/03 , H01R43/16 , Y10T428/12882
摘要： There is provided a silver-plated product which has a good bendability and which can restrain the rise of the contact resistance thereof even if it is used in a high-temperature environment, and a method for producing the same. In a silver-plated product wherein a surface layer of silver is formed on the surface of a base material of copper or a copper alloy, or on the surface of an underlying layer of copper or a copper alloy formed on the base material, the percentage of an X-ray diffraction intensity on {200} plane of the surface layer with respect to the sum of X-ray diffraction intensities on {111}, {200}, {220} and {311} planes of the surface layer is 40% or more.

2. 发明申请

US20170122681A1 HEAT RADIATING PLATE AND METHOD FOR PRODUCING SAME 审中-公开
公开(公告)号：US20170122681A1
公开(公告)日：2017-05-04
申请号：US15278340
申请日：2016-09-28
申请人： DOWA METALTECH CO., LTD.
发明人： Tomotsugu Aoyama , Akira Sugawara
IPC分类号： F28F21/08 , C22C9/02 , B21B3/00 , H01L23/373 , H01L21/48 , C22F1/08 , H01L23/367
CPC分类号： F28F21/085 , B21B3/00 , B21B2003/005 , B21B2261/22 , C22C9/02 , C22F1/08 , H01L21/4878 , H01L23/367 , H01L23/3736
摘要： In a method for producing a heat radiating plate 20, the method containing the steps of: finish cold-rolling an annealed material to obtain a strip; causing the strip to wind in the shape of a coil to prepare a coil stock; unwinding the coil stock by means of an uncoiler 10 to obtain a strip 12; causing the strip 12 to pass through a gap between the rolls of a leveler 14 to correct the shape thereof; progressively feeding the corrected strip 12 to a progressive die 18 via a feeder 16 to progressively press-working the strip 12 to produce a heat radiating plate 20, the finish cold-rolling is carried out so that a ratio of the Vickers hardness HV after the finish cold-rolling to the Vickers hardness HV before the finish cold-rolling is not less than 1.2, and the corrected strip 12 is allowed to bend due to its own weight between the leveler 14 and the feeder 16 so that the minimum value of deflection (L1−L0) is 0.5 to 2.0 m assuming that L0 is a distance between a roll at the last sending side of the leveler 14 and a roll at the first entrance side of the feeder 16 and that L1 is the length of the strip 12 between the roll at the last sending side of the leveler 14 and the roll at the first entrance side of the feeder 16.

3. 发明授权

US09412482B2 Cu-Ni-Co-Si based copper alloy sheet material and method for producing the same 有权
标题翻译： Cu-Ni-Co-Si系铜合金板材及其制造方法
公开(公告)号：US09412482B2
公开(公告)日：2016-08-09
申请号：US14068256
申请日：2013-10-31
申请人： DOWA METALTECH CO., LTD.
发明人： Toshiya Kamada , Takashi Kimura , Weilin Gao , Fumiaki Sasaki , Akira Sugawara
IPC分类号： C22C9/06 , H01B1/02 , C22F1/08
CPC分类号： H01B1/026 , C21D2201/05 , C21D2211/004 , C22C9/06 , C22F1/08
摘要： A Cu—Ni—Co—Si based copper alloy sheet material has second phase particles existing in a matrix, with a number density of ultrafine second phase particles is 1.0×109 number/mm2 or more. A number density of fine second phase particles is not more than 5.0×107 number/mm2. A number density of coarse second phase particles is 1.0×105 number/mm2 or more and not more than 1.0×106 number/mm2. The material has crystal orientation satisfying the following equation (1): I{200}/I0{200}≧3.0 (1) wherein I{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane on the sheet material sheet surface; and I0{200} represents an integrated intensity of an X-ray diffraction peak of the {200} crystal plane in a pure copper standard powder sample.
摘要翻译： Cu-Ni-Co-Si系铜合金板材具有存在于基体中的第二相粒子，超细二次粒子的数量密度为1.0×10 9个/ mm 2以上。细密度的第二相颗粒的密度不超过5.0×10 7个/ mm 2。粗二次粒子的数密度为1.0×10 5个/ mm 2以上且1.0×10 6个/ mm 2以下。该材料具有满足以下等式（1）的晶体取向：I {200} / I0 {200}≥3.0（1）其中I {200}表示{200}晶面的X射线衍射峰的积分强度在片材表面上; I0 {200}表示纯铜标准粉末样品中{200}晶面的X射线衍射峰的积分强度。

4. 发明申请

US20140248809A1 FITTING TYPE CONNECTING TERMINAL AND METHOD FOR PRODUCING SAME 有权
标题翻译：连接型连接端子及其制造方法
公开(公告)号：US20140248809A1
公开(公告)日：2014-09-04
申请号：US14351586
申请日：2012-10-10
申请人： DOWA METALTECH CO., LTD , YAZAKI CORPORATION
发明人： Akifumi Onodera , Masatoshi Nakamura , Akira Sugawara , Hiroto Narieda
IPC分类号： H01R13/02 , H01R43/16
CPC分类号： H01R13/02 , H01R13/03 , H01R13/187 , H01R43/16 , Y10T29/49224
摘要： In a fitting type connecting terminal having male and female terminals, each of which has a tin plating layer formed on an electrically conductive base material, a surface of a contact portion of one of the male and female terminals with the other thereof has a plurality of grooves or recessed portions which are spaced from each other in longitudinal directions, and the grooves or recessed portions are formed so as to satisfy d≦b, d≦a≦L and a+c≦L assuming that the width of each of the grooves or recessed portions is a (μm), the depth thereof being b (μm), the distance between two of the grooves or recessed portions adjacent to each other in the longitudinal directions being c (μm), the sliding distance producible between the male terminal and the female terminal in a state that the male terminal is fitted into and fixed to the female terminal being L (μm), and the maximum grain size of the oxide of abrasion powder producible due to sliding between the male terminal and the female terminal being d (μm).
摘要翻译：在具有阳，阴端子的配合型连接端子中，每个具有形成在导电基材上的镀锡层，其中一个阳，阴端子的一个接触部分的表面与另一个具有多个凹槽或凹部在纵向上彼此间隔开，并且凹槽或凹部形成为满足d＆nlE; b，d＆nlE; a＆nlE; L和a + c＆nlE; L，假设每个凹槽的宽度或凹部为（μm），其深度为b（μm），在长度方向上彼此相邻的两个槽或凹部之间的距离为c（μm），在公端子之间产生的滑动距离并且在母端子嵌入并固定到母端子的状态下的母端子为L（μm），并且由于阳端子之间的滑动而可生产的磨损粉末的氧化物的最大晶粒尺寸女性终端为d（μm）。

5. 发明申请

US20190136398A1 TIN-PLATED PRODUCT AND METHOD FOR PRODUCING SAME 审中-公开
公开(公告)号：US20190136398A1
公开(公告)日：2019-05-09
申请号：US16099791
申请日：2017-04-18
申请人： DOWA METALTECH CO., LTD. , Yazaki Corporation
发明人： Hirotaka Kotani , Hiroto Narieda , Akira Sugawara , Yuta Sonoda , Yoshitaka Ito
IPC分类号： C25D5/50 , C25D3/30 , C25D5/12 , C25D7/00 , B32B15/01 , C22F1/16 , H01R13/03 , H01R43/16
摘要： After drying the surface of a tin plating layer having a thickness of 0.4 to 3 μm which is formed on a base material of copper or a copper alloy by electroplating at a current density of 5 to 13 A/dm2 in a tin plating solution consisting of water, tin sulfate, sulfuric acid and a surfactant, the surface of the tin plating layer is heated to melt tin, and then, cooled to cause a layer of the tin plating layer on the side of the outermost surface to be a tin layer, which has a structure obtained by solidification after melting, while causing a layer of the tin plating layer between the tin layer and the base material to be a copper-tin alloy layer, to produce a tin-plated product wherein a tin layer, which has a structure obtained by solidification after melting, is formed on a copper-tin alloy layer formed on a base material of copper or a copper alloy and wherein the tin-plated product has a glossiness of 0.3 to 0.7.

6. 发明授权

US10199132B2 High strength Cu—Ni—Co—Si based copper alloy sheet material and method for producing the same, and current carrying component 有权
公开(公告)号：US10199132B2
公开(公告)日：2019-02-05
申请号：US14762479
申请日：2014-02-10
申请人： DOWA METALTECH CO., LTD.
发明人： Takashi Kimura , Toshiya Kamada , Weilin Gao , Fumiaki Sasaki , Akira Sugawara
IPC分类号： C22C9/06 , C22F1/08 , H01B1/02
摘要： A copper alloy sheet material comprises (by mass %) from 2.50 to 4.00% in total of Ni and Co, from 0.50 to 2.00% of Co, from 0.70 to 1.50% of Si, from 0 to 0.50% of Fe, from 0 to 0.10% of Mg, from 0 to 0.50% of Sn, from 0 to 0.15% of Zn, from 0 to 0.07% of B, from 0 to 0.10% of P, from 0 to 0.10% of REM, from 0 to 0.01% in total of Cr, Zr, Hf, Nb and S, the balance Cu and unavoidable impurities. A number density of coarse secondary phase particles (particle diameter of 5 mm or more) is 10 per mm2 or less. A number density of fine secondary phase particles (particle diameter of from 5 to 10 nm) is 1.0·109 per mm2 or more. A Si concentration in the parent phase is 0.10% by mass or more.

7. 发明授权

US10180293B2 Heat radiating plate and method for producing same 有权
公开(公告)号：US10180293B2
公开(公告)日：2019-01-15
申请号：US15278340
申请日：2016-09-28
申请人： DOWA METALTECH CO., LTD.
发明人： Tomotsugu Aoyama , Akira Sugawara
IPC分类号： B21B3/00 , C22C9/02 , C22F1/08 , F28F21/08 , H01L21/48 , H01L23/367 , H01L23/373
摘要： A method for producing a heat radiating plate, the method containing the steps of: finish cold-rolling an annealed material to obtain a strip; causing the strip to wind in the shape of a coil to prepare a coil stock; unwinding the coil stock by means of an uncoiler to obtain a strip; causing the strip to pass through a gap between the rolls of a leveler to correct the shape thereof; progressively feeding the corrected strip to a progressive die via a feeder to progressively press-working the strip to produce a heat radiating plate.

8. 发明授权

US10077502B2 Silver-plated product 有权
公开(公告)号：US10077502B2
公开(公告)日：2018-09-18
申请号：US14778159
申请日：2014-02-18
申请人： DOWA METALTECH CO., LTD.
发明人： Keisuke Shinohara , Masafumi Ogata , Hiroshi Miyazawa , Akira Sugawara
IPC分类号： B32B15/01 , C25D5/10 , C25D3/46 , C25D7/00 , H01H1/025 , H01H11/04 , H01R13/03 , C25D5/34
CPC分类号： C25D5/10 , C25D3/46 , C25D5/34 , C25D7/00 , H01H1/025 , H01H11/041 , H01H2011/046 , H01R13/03
摘要： There is provided a silver-plated product which has good thermal resistance, bendability and wear resistance. In a silver-plated product wherein a surface layer of silver having a thickness of 10 μm or less is formed on a base material of copper or a copper alloy, the full-width at half maximum of a rocking curve on a preferred orientation plane (preferably {200} or {111} plane) of the surface layer is caused to be 2 to 8°, preferably 3 to 7°, to improve the out-of-plane orientation of the surface layer to improve the thermal resistance, bendability and wear resistance of the silver-plated product.

9. 发明授权

US09614300B2 Electrical connector and manufacturing method thereof 有权
公开(公告)号：US09614300B2
公开(公告)日：2017-04-04
申请号：US14327073
申请日：2014-07-09
申请人： Yazaki Corporation , Dowa Metaltech Co., Ltd.
发明人： Masatoshi Nakamura , Akifumi Onodera , Akira Sugawara , Hiroto Narieda
IPC分类号： H01R13/11 , H01R13/24 , H01R4/48 , H01R13/20 , H01R43/16 , H01R13/05
CPC分类号： H01R4/48 , H01R13/05 , H01R13/11 , H01R13/113 , H01R13/114 , H01R13/20 , H01R13/2464 , H01R43/16 , Y10T29/49204 , Y10T29/49224
摘要： An electrical connector connecting a male connector and a female connector in a freely engageable and detachable manner, in which: a male tab is provided at the male connector; a housing part where the male tab is inserted is provided at the female connector; a spring state contact piece and a beat piece to sandwich the male tab are provided at the housing part; and a protrusion protruding toward the male tab inserted into the housing part is provided at least one of the contact piece and the beat piece, wherein the protrusion includes a contact part which is in contact with the male tab inserted into the housing part and a sidewall part which is provided at a periphery of the contact part, and the contact part has so-called a star-shape in a plan view.

10. 发明授权

US09534307B2 Silver-plated product and method for producing same 有权
标题翻译：镀银产品及其制造方法
公开(公告)号：US09534307B2
公开(公告)日：2017-01-03
申请号：US14430653
申请日：2013-09-17
申请人： DOWA METALTECH CO., LTD.
发明人： Keisuke Shinohara , Masafumi Ogata , Hiroshi Miyazawa , Akira Sugawara
IPC分类号： B32B15/01 , C25D3/46 , C25D7/00 , C25D5/50 , H01R13/03 , H01H1/02 , C22C5/06 , C22C9/00 , C22F1/08 , C22F1/14 , H01H1/023 , H01H11/04 , H01H1/025
CPC分类号： C25D3/46 , B32B15/018 , C22C5/06 , C22C9/00 , C22F1/08 , C22F1/14 , C25D5/10 , C25D5/34 , C25D5/50 , C25D7/00 , H01H1/02 , H01H1/023 , H01H1/025 , H01H11/041 , H01H11/045 , H01H2011/046 , H01R13/03 , H01R2201/26 , Y10T428/12896
摘要： In a silver-plated product wherein a surface layer of silver is formed on the surface of a base material or on the surface of an underlying layer formed on the base material, the surface layer of silver is formed by electroplating in a silver plating bath which contains 1 to 15 mg/L of selenium and wherein a mass ratio of silver to free cyanogen is in the range of from 0.9 to 1.8, and thereafter, an aging treatment is carried out to produce a silver-plated product wherein an area fraction in {200} orientation of the surface layer is 15% or more.
摘要翻译：在其中在基材表面上或在形成在基材上的下层的表面上形成银表面的镀银产品中，银的表面层通过电镀在银镀浴中形成，含有1〜15mg / L的硒，其中银与游离氰的质量比在0.9〜1.8的范围内，然后进行时效处理，得到镀银制品，其中， {200}表面层的取向为15％以上。

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