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    • 1. 发明授权
    • Induced transducer head vibration
    • 感应换能器头振动
    • US08786977B2
    • 2014-07-22
    • US13274186
    • 2011-10-14
    • Dadi SetiadiStefan A. WeissnerDavid Gordon Qualey
    • Dadi SetiadiStefan A. WeissnerDavid Gordon Qualey
    • G11B21/02
    • G11B5/607G11B5/6076
    • Vibration of a transducer slider can be used during slider fly height calibration to detect contact of the transducer slider with a disc surface. Amplification of the vibration may cause the transducer slider to tap the disc surface rather than drag across the disc surface when detecting contact with the disc surface. Amplification may be achieved by applying an in-phase AC signal to the transducer slider at the same frequency as the vibration of the slider. Reduced contact between the slider and the disc surface reduces wear on and the possibility of damage to the transducer slider and/or the disc surface. Once the fly height of the transducer slider is calibrated, the AC signal may be shifted out-of-phase with the slider vibration to dampen the slider vibration.
    • 可以在滑块飞行高度校准期间使用传感器滑块的振动,以检测传感器滑块与光盘表面的接触。 当检测到与盘表面的接触时,振动的扩大可能导致换能器滑块敲击盘表面而不是拖过盘表面。 可以通过以与滑块的振动相同的频率向换能器滑块施加同相AC信号来实现放大。 滑块和盘表面之间的减少的接触减少了传感器滑块和/或盘表面损坏的可能性。 一旦传感器滑块的飞行高度被校准,AC信号可能会与滑块振动异相移动,以抑制滑块的振动。
    • 2. 发明申请
    • INDUCED TRANSDUCER HEAD VIBRATION
    • 感应传感器头部振动
    • US20130094107A1
    • 2013-04-18
    • US13274186
    • 2011-10-14
    • Dadi SetiadiStefan A. WeissnerDavid Gordon Qualey
    • Dadi SetiadiStefan A. WeissnerDavid Gordon Qualey
    • G11B17/32
    • G11B5/607G11B5/6076
    • Vibration of a transducer slider can be used during slider fly height calibration to detect contact of the transducer slider with a disc surface. Amplification of the vibration may cause the transducer slider to tap the disc surface rather than drag across the disc surface when detecting contact with the disc surface. Amplification may be achieved by applying an in-phase AC signal to the transducer slider at the same frequency as the vibration of the slider. Reduced contact between the slider and the disc surface reduces wear on and the possibility of damage to the transducer slider and/or the disc surface. Once the fly height of the transducer slider is calibrated, the AC signal may be shifted out-of-phase with the slider vibration to dampen the slider vibration.
    • 可以在滑块飞行高度校准期间使用传感器滑块的振动,以检测传感器滑块与光盘表面的接触。 当检测到与盘表面的接触时,振动的扩大可能导致换能器滑块敲击盘表面而不是拖过盘表面。 可以通过以与滑块的振动相同的频率向换能器滑块施加同相AC信号来实现放大。 滑块和盘表面之间的减少的接触减少了传感器滑块和/或盘表面损坏的可能性。 一旦传感器滑块的飞行高度被校准,AC信号可能会与滑块振动异相移动,以抑制滑块的振动。
    • 4. 发明授权
    • Head gimbal assembly with flex circuit arrangement between slider and head interconnect assembly
    • 头部万向节组件,其具有在滑块和头部互连组件之间的柔性电路布置
    • US06985332B1
    • 2006-01-10
    • US09455851
    • 1999-12-07
    • David Allen SluzewskiDavid Gordon QualeyKevin Jon SchulzGordon Merle Jones
    • David Allen SluzewskiDavid Gordon QualeyKevin Jon SchulzGordon Merle Jones
    • G11B5/60G11B21/21
    • G11B5/4826G11B5/3103G11B5/4853H05K3/361
    • A slider scale package assembly in a head gimbal assembly (HGA) for electrically coupling a slider/magnetic recording (MR) head to a head interconnect circuit in a disc drive includes a flex circuit attached to the back of the slider/MR head which turns the slider/MR head into the slider scale package with at least one repositioned interconnect pad disposed at the back of the slider/MR head. The flex circuit further includes a conductive material, one end of which is electrically bonded to a bond pad of the slider/MR head, and the other end is electrically bonded to a conductive material of the head interconnect circuit via the interconnect pad. A plurality of flex circuits can be made in a sheet format and dividable into a plurality of individual flex circuits to be attached to a plurality of slider/MR heads. The bonding of the conductive material of the flex circuit to the slider/MR head and the bonding of the interconnect pad of the flex circuit to the conductive material of the head interconnect circuit can be done in a separate automated process.
    • 用于将滑块/磁记录(MR)磁头电耦合到磁盘驱动器中的磁头互连电路的磁头万向架组件(HGA)中的滑块刻度封装组件包括附接到滑块/ MR磁头背面的柔性电路 滑块/ MR头进入滑块尺度封装,其中至少一个重新定位的互连焊盘设置在滑块/ MR头的后部。 柔性电路还包括导电材料,其一端电连接到滑块/ MR磁头的接合焊盘,另一端通过互连焊盘电连接到磁头互连电路的导电材料。 多个柔性电路可以以薄片形式制成并且可分割成多个单独的柔性电路以附接到多个滑块/ MR磁头。 柔性电路的导电材料与滑块/ MR磁头的接合以及柔性电路的互连焊盘与磁头互连电路的导电材料的接合可以在单独的自动化过程中完成。