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1. 发明授权

US08913384B2 Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) 有权
标题翻译：将电子卡耦合到冷却剂冷却结构的热转印结构
公开(公告)号：US08913384B2
公开(公告)日：2014-12-16
申请号：US13527947
申请日：2012-06-20
申请人： Milnes P. David , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Pritish R. Parida , Roger R. Schmidt , Mark E. Steinke
发明人： Milnes P. David , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Pritish R. Parida , Roger R. Schmidt , Mark E. Steinke
IPC分类号： H05K7/20 , H05K13/00
CPC分类号： H05K7/20745 , H05K7/2079 , H05K13/00
摘要： Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.
摘要翻译：提供冷却装置和冷却剂冷却的电子系统，其包括热传递结构，其被配置成与弹簧力接合一个或多个电子卡，其中电子卡在电子系统的相应插座内对接。冷却装置的热传递结构包括具有第一热传导表面的散热器和耦合到散热器的导电表面的导热弹簧组件，并被定位和配置成驻留在物理上耦合电子器件的第一表面卡到散热器的第一表面，使电子卡在电子系统的插座内对接。在一个实施例中，热传递结构是冶金结合到冷却剂冷却结构，并且有助于将热量从电子卡传递到流过冷却剂冷却结构的冷却剂。

2. 发明申请

US20130000736A1 ADJUSTABLE AND DIRECTIONAL FLOW PERFORATED TILES 审中-公开
标题翻译：可调和方向流动执行平台
公开(公告)号：US20130000736A1
公开(公告)日：2013-01-03
申请号：US13172765
申请日：2011-06-29
申请人： Patrick A. Coico , David P. Graybill , Allan R. Hoeft , Madhusudan K. Iyengar , Roger R. Schmidt , Gerard V. Weber, JR.
发明人： Patrick A. Coico , David P. Graybill , Allan R. Hoeft , Madhusudan K. Iyengar , Roger R. Schmidt , Gerard V. Weber, JR.
IPC分类号： F17D3/00
CPC分类号： H05K7/20836 , F17D3/00 , H05K7/20 , H05K7/20181 , H05K7/20745 , Y10T137/0324 , Y10T137/6851
摘要： An air flow control assembly, system, and method for controlling air flow to a server rack. An example air flow control assembly includes a retractable barrier configured to block the air flow, at least partially, from passing through a perforated floor tile to the server rack. The air flow control assembly also includes a barrier mount configured to secure the retractable barrier proximate the perforated floor tile.
摘要翻译：用于控制到服务器机架的空气流的气流控制组件，系统和方法。示例性空气流量控制组件包括可缩回屏障，所述可伸缩屏障被配置为阻挡空气流，至少部分地阻止穿过穿孔的地板砖到服务器机架。空气流量控制组件还包括被配置为将可伸缩的屏障固定在穿孔地板砖附近的阻挡安装座。

3. 发明申请

US20120279686A1 COOLED ELECTRONIC SYSTEM WITH LIQUID-COOLED COLD PLATE AND THERMAL SPREADER COUPLED TO ELECTRONIC COMPONENT 有权
标题翻译：冷却电子系统与液体冷却冷却板和热传递器耦合到电子元件
公开(公告)号：US20120279686A1
公开(公告)日：2012-11-08
申请号：US13102200
申请日：2011-05-06
申请人： Timothy J. CHAINER , David P. GRAYBILL , Madhusudan K. IYENGAR , Vinod KAMATH , Bejoy J. KOCHUPARAMBIL , Roger R. SCHMIDT , Mark E. STEINKE
发明人： Timothy J. CHAINER , David P. GRAYBILL , Madhusudan K. IYENGAR , Vinod KAMATH , Bejoy J. KOCHUPARAMBIL , Roger R. SCHMIDT , Mark E. STEINKE
IPC分类号： F28D15/02 , F28D15/00
CPC分类号： H05K7/20336 , F28D15/02 , H05K7/20509 , H05K7/20772 , H05K7/20936
摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.
摘要翻译：提供了用于促进电子部件的冷却的装置和方法。该装置包括液冷冷板和与冷板相关联的散热器。冷板包括在冷板内延伸的多个冷却剂承载通道部分，以及具有比待冷却部件的表面积更大的表面积的导热表面。散热器包括一个或多个包括多个热管段的热管。一个或多个热管部分与冷板的第一区域部分对准，即，与要冷却的表面对准，并且部分地对准于位于第一区域外部的冷板的第二区域。一个或多个热管促进热量从电子部件分配到位于冷板的第二区域中的冷板的冷却剂承载通道部分。

4. 发明授权

US07837352B2 Light source for illuminating an electronics rack to facilitate servicing thereof 有权
标题翻译：用于照亮电子机架以便于维修的光源
公开(公告)号：US07837352B2
公开(公告)日：2010-11-23
申请号：US11954272
申请日：2007-12-12
申请人： David P. Graybill , Madhusudan K. Iyengar , Jeffrey A. Newcomer , Roger R. Schmidt , Prabjit Singh , Gerard V. Weber
发明人： David P. Graybill , Madhusudan K. Iyengar , Jeffrey A. Newcomer , Roger R. Schmidt , Prabjit Singh , Gerard V. Weber
IPC分类号： F21S4/00
CPC分类号： H05K7/1488 , F21K9/00 , F21S4/20 , F21V21/30
摘要： An apparatus is provided for facilitating servicing of an electronics rack. The apparatus includes a light source, which includes a plurality of light-emitting diodes. The plurality of light-emitting diodes are secured to the electronics rack or a floor tile disposed adjacent to the electronics rack, and are configured to illuminate at least a lower portion of the electronics rack at either the air inlet or air outlet side of the rack. A power supply is also provided for selectively supplying power to the plurality of light-emitting diodes. In one implementation, the light source includes an elongate light bar, which is configured to mount to either the inlet door or outlet door of the electronics rack, and the plurality of light-emitting diodes are secured to an elongate housing structure which pivotally couples to a base plate for adjustment of a direction of illumination by the light-emitting diodes.
摘要翻译：提供了一种便于维护电子机架的装置。该装置包括一个包括多个发光二极管的光源。多个发光二极管被固定到电子机架或邻近电子机架设置的地板瓦片，并且被构造成在机架的空气入口或空气出口侧的至少一部分照明电子机架。还提供用于选择性地向多个发光二极管供电的电源。在一个实施方案中，光源包括细长的光条，其被配置为安装到电子机架的入口门或出口门，并且多个发光二极管被固定到细长的壳体结构，其被枢转地耦合到用于调节发光二极管的照明方向的基板。

5. 发明授权

US09307674B2 Cooled electronic system with liquid-cooled cold plate and thermal spreader coupled to electronic component 有权
公开(公告)号：US09307674B2
公开(公告)日：2016-04-05
申请号：US13102200
申请日：2011-05-06
申请人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
发明人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
IPC分类号： H01L23/427 , H01L23/473 , H05K7/20 , F28D15/02
CPC分类号： H05K7/20336 , F28D15/02 , H05K7/20509 , H05K7/20772 , H05K7/20936
摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled cold plate and a thermal spreader associated with the cold plate. The cold plate includes multiple coolant-carrying channel sections extending within the cold plate, and a thermal conduction surface with a larger surface area than a surface area of the component to be cooled. The thermal spreader includes one or more heat pipes including multiple heat pipe sections. One or more heat pipe sections are partially aligned to a first region of the cold plate, that is, where aligned to the surface to be cooled, and partially aligned to a second region of the cold plate, which is outside the first region. The one or more heat pipes facilitate distribution of heat from the electronic component to coolant-carrying channel sections of the cold plate located in the second region of the cold plate.

6. 发明授权

US09027360B2 Thermoelectric-enhanced, liquid-based cooling of a multi-component electronic system 有权
标题翻译：多组分电子系统的热电增强型液态冷却
公开(公告)号：US09027360B2
公开(公告)日：2015-05-12
申请号：US13102195
申请日：2011-05-06
申请人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
发明人： Timothy J. Chainer , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
IPC分类号： F25D23/12 , F25D17/06
CPC分类号： H05K7/20763 , F25B21/02 , F25B21/04 , F25D17/06 , H05K7/20254 , H05K7/20263 , H05K7/20781 , H05K7/2079 , H05K7/20836
摘要： Apparatus and method are provided for facilitating cooling of an electronic component. The apparatus includes a liquid-cooled structure, a thermal conduction path coupling the electronic component and the liquid-cooled structure, a coolant loop in fluid communication with a coolant-carrying channel of the liquid-cooled structure, and an outdoor-air-cooled heat exchange unit coupled to facilitate heat transfer from the liquid-cooled structure via, at least in part, the coolant loop. The thermoelectric array facilitates transfer of heat from the electronic component to the liquid-cooled structure, and the heat exchange unit cools coolant passing through the coolant loop by dissipating heat from the coolant to outdoor ambient air. In one implementation, temperature of coolant entering the liquid-cooled structure is greater than temperature of the outdoor ambient air to which heat is dissipated.
摘要翻译：提供了用于促进电子部件的冷却的装置和方法。该装置包括液冷结构，耦合电子部件和液冷结构的热传导路径，与液冷结构的冷却剂传送通道流体连通的冷却剂回路，室外空气冷却热交换单元被耦合以便于至少部分地通过冷却剂回路从液冷结构经由热传递。热电阵列有助于将热量从电子部件传递到液冷结构，并且热交换单元通过将冷却剂的热量散发到室外环境空气来冷却通过冷却剂回路的冷却剂。在一个实施方案中，进入液冷结构的冷却剂的温度大于散热的室外环境空气的温度。

7. 发明授权

US08919143B2 Air-cooling wall with slidable heat exchangers 有权
标题翻译：具有滑动式热交换器的空气冷却壁
公开(公告)号：US08919143B2
公开(公告)日：2014-12-30
申请号：US13115390
申请日：2011-05-25
申请人： Eric A. Eckberg , David P. Graybill , Madhusudan K. Iyengar , Howard V. Mahaney, Jr. , Roger R. Schmidt , Kenneth R. Schneebeli
发明人： Eric A. Eckberg , David P. Graybill , Madhusudan K. Iyengar , Howard V. Mahaney, Jr. , Roger R. Schmidt , Kenneth R. Schneebeli
IPC分类号： F28D11/00 , F25D23/12 , H05K7/20
CPC分类号： H05K7/2079
摘要： An air-cooling apparatus is provided which includes an air-cooling wall cooling airflow passing through an electronics rack(s) of a data center. The air-cooling wall is disposed separate from and in spaced relation to the air inlet or air outlet side(s) of the electronics rack(s), and includes a wall panel support structure disposed separate from the electronics rack(s), which supports one or more slidable wall panels. The slidable wall panel(s) includes an air-to-liquid heat exchanger slidably supported and disposed in spaced relation to the air outlet or air inlet side of the electronics rack(s). The heat exchanger extracts heat from air passing across the heat exchanger and is slidable within the support structure in a direction transverse to the direction of airflow through the rack(s). Slidable support of the heat exchanger by the support structure facilitates access to the air outlet or air inlet sides of the electronics rack(s).
摘要翻译：提供了一种空气冷却装置，其包括通过数据中心的电子机架的冷却空气的冷却壁。空气冷却壁与电子机架的空气入口侧或空气出口侧分开设置并且与空气出口侧分开设置，并且包括与电子机架分离设置的壁板支撑结构，支撑一个或多个可滑动的墙板。可滑动壁板包括可滑动地支撑并设置成与电子机架的空气出口或空气入口侧间隔开的空气 - 液体热交换器。热交换器从穿过热交换器的空气中提取热量，并且可以在支撑结构内沿横向于穿过机架的气流方向的方向滑动。通过支撑结构的热交换器的可滑动支撑件便于进入电子机架的空气出口或空气入口侧。

8. 发明授权

US08493738B2 Cooled electronic system with thermal spreaders coupling electronics cards to cold rails 失效
标题翻译：冷却电子系统，散热器将电子卡耦合到冷轨
公开(公告)号：US08493738B2
公开(公告)日：2013-07-23
申请号：US13102211
申请日：2011-05-06
申请人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
发明人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , H05K7/20781 , H05K7/2079
摘要： Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.
摘要翻译：提供液冷电子系统，其包括具有电子卡的电子组件和在一端具有闩锁的插座。闩锁有助于将卡固定在插座内或从插座中取出卡。液冷冷轨布置在插座的一端，散热器将电子卡连接到冷轨。热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。导热延伸部设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除而不移除冷轨或散热器。

9. 发明申请

US20120298335A1 AIR-COOLING WALL WITH SLIDABLE HEAT EXCHANGERS 有权
标题翻译：空气冷却壁与可滑动的热交换器
公开(公告)号：US20120298335A1
公开(公告)日：2012-11-29
申请号：US13115390
申请日：2011-05-25
申请人： Eric A. ECKBERG , David P. GRAYBILL , Madhusudan K. IYENGAR , Howard V. MAHANEY, JR. , Roger R. SCHMIDT , Kenneth R. SCHNEEBELI
发明人： Eric A. ECKBERG , David P. GRAYBILL , Madhusudan K. IYENGAR , Howard V. MAHANEY, JR. , Roger R. SCHMIDT , Kenneth R. SCHNEEBELI
IPC分类号： F28D15/00
CPC分类号： H05K7/2079
摘要： An air-cooling apparatus is provided which includes an air-cooling wall cooling airflow passing through an electronics rack(s) of a data center. The air-cooling wall is disposed separate from and in spaced relation to the air inlet or air outlet side(s) of the electronics rack(s), and includes a wall panel support structure disposed separate from the electronics rack(s), which supports one or more slidable wall panels. The slidable wall panel(s) includes an air-to-liquid heat exchanger slidably supported and disposed in spaced relation to the air outlet or air inlet side of the electronics rack(s). The heat exchanger extracts heat from air passing across the heat exchanger and is slidable within the support structure in a direction transverse to the direction of airflow through the rack(s). Slidable support of the heat exchanger by the support structure facilitates access to the air outlet or air inlet sides of the electronics rack(s).
摘要翻译：提供了一种空气冷却装置，其包括通过数据中心的电子机架的冷却空气的冷却壁。空气冷却壁与电子机架的空气入口侧或空气出口侧分开设置并且与空气出口侧分开设置，并且包括与电子机架分离设置的壁板支撑结构，支撑一个或多个可滑动的墙板。可滑动壁板包括可滑动地支撑并设置成与电子机架的空气出口或空气入口侧间隔开的空气 - 液体热交换器。热交换器从穿过热交换器的空气中提取热量，并且可以在支撑结构内沿横向于穿过机架的气流方向的方向滑动。通过支撑结构的热交换器的可滑动支撑件便于进入电子机架的空气出口或空气入口侧。

10. 发明申请

US20120297807A1 COOLING UNIT FOR CONTAINER-TYPE DATA CENTER 有权
标题翻译：集装箱型数据中心冷却装置
公开(公告)号：US20120297807A1
公开(公告)日：2012-11-29
申请号：US13114203
申请日：2011-05-24
申请人： Brian A. CANNEY , David P. GRAYBILL , Madhusudan K. IYENGAR , Vinod KAMATH , Roger R. SCHMIDT
发明人： Brian A. CANNEY , David P. GRAYBILL , Madhusudan K. IYENGAR , Vinod KAMATH , Roger R. SCHMIDT
IPC分类号： F25B49/02 , B23P15/26 , F25D31/00 , F25D17/06 , F25B49/00
CPC分类号： H05K7/1497 , F25B25/005 , F25B2700/2106 , F25B2700/21173 , F25D11/003 , F25D17/02 , H05K7/2079 , Y10T29/49359
摘要： A cooling unit and cooling method are provided for a container-type data center. The cooling unit includes a heat rejection unit, for rejecting heat from coolant passing through a coolant loop to air passing across the heat rejection unit, and a refrigeration unit controllable to selectively provide auxiliary cooling to at least a portion of the coolant passing through the coolant loop. The heat rejection unit includes a heat exchange assembly, having a first heat exchanger and a second heat exchanger, and one or more air-moving devices providing airflow across the first and second heat exchangers. The first heat exchanger couples in fluid communication with the coolant loop, and the second heat exchanger is coupled in fluid communication with a refrigeration loop of the refrigeration unit for rejecting heat from refrigerant passing through the refrigeration loop to the airflow passing across the second heat exchanger.
摘要翻译：为集装箱式数据中心提供冷却装置和冷却方法。冷却单元包括排热单元，用于将来自通过冷却剂回路的冷却剂的热量排除通过散热单元的空气;以及制冷单元，其可控制以选择性地向通过冷却剂的冷却剂的至少一部分提供辅助冷却循环。散热单元包括具有第一热交换器和第二热交换器的热交换组件，以及提供横跨第一和第二热交换器的气流的一个或多个气动装置。所述第一热交换器与所述冷却剂回路流体连通，并且所述第二热交换器与所述制冷单元的制冷回路流体连通地联接，用于将通过所述制冷回路的制冷剂的热量排出到穿过所述第二热交换器的气流。

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