专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US09631880B2 Process for optimizing a heat exchanger configuration 有权
公开(公告)号：US09631880B2
公开(公告)日：2017-04-25
申请号：US13443094
申请日：2012-04-10
申请人： Eric A. Eckberg , Howard V. Mahaney, Jr. , William M. Megarity , Roger R. Schmidt , Tejas Shah , Scott A. Shurson
发明人： Eric A. Eckberg , Howard V. Mahaney, Jr. , William M. Megarity , Roger R. Schmidt , Tejas Shah , Scott A. Shurson
IPC分类号： F28F9/007 , F28F27/00 , H05K7/20
CPC分类号： F28F27/00 , F28F2200/00 , H05K7/20836
摘要： A heat exchanger door and heat exchanger core optimization method are provided. The door resides at an air inlet or outlet side of an electronics rack, and includes an air-to-coolant heat exchanger with a heat exchanger core. The core includes a first coolant channel coupled to a coolant inlet manifold downstream from a second coolant channel, and the first channel has a shorter channel length than the second channel. Further, coolant channels of the core are coupled to provide counter-flow cooling of an airflow passing across the core. The core optimization method determines at least one combination of parameters that optimize for a particular application at least two performance metrics of the heat exchanger. This method includes obtaining performance metrics for boundary condition(s) of possible heat exchanger configurations with different variable parameters to determine a combination of parameters that optimize the performance metrics for the heat exchanger.

2. 发明授权

US09179574B2 Cooling unit for container-type data center 有权
标题翻译：集装箱式数据中心冷却装置
公开(公告)号：US09179574B2
公开(公告)日：2015-11-03
申请号：US13114203
申请日：2011-05-24
申请人： Brian A. Canney , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Roger R. Schmidt
发明人： Brian A. Canney , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Roger R. Schmidt
IPC分类号： H05K7/14 , H05K7/20 , F25B25/00 , F25D11/00 , F25D17/02
CPC分类号： H05K7/1497 , F25B25/005 , F25B2700/2106 , F25B2700/21173 , F25D11/003 , F25D17/02 , H05K7/2079 , Y10T29/49359
摘要： A cooling unit and cooling method are provided for a container-type data center. The cooling unit includes a heat rejection unit, for rejecting heat from coolant passing through a coolant loop to air passing across the heat rejection unit, and a refrigeration unit controllable to selectively provide auxiliary cooling to at least a portion of the coolant passing through the coolant loop. The heat rejection unit includes a heat exchange assembly, having a first heat exchanger and a second heat exchanger, and one or more air-moving devices providing airflow across the first and second heat exchangers. The first heat exchanger couples in fluid communication with the coolant loop, and the second heat exchanger is coupled in fluid communication with a refrigeration loop of the refrigeration unit for rejecting heat from refrigerant passing through the refrigeration loop to the airflow passing across the second heat exchanger.
摘要翻译：为集装箱式数据中心提供冷却装置和冷却方法。冷却单元包括排热单元，用于将来自通过冷却剂回路的冷却剂的热量排除通过散热单元的空气;以及制冷单元，其可控制以选择性地向通过冷却剂的冷却剂的至少一部分提供辅助冷却循环。散热单元包括具有第一热交换器和第二热交换器的热交换组件，以及提供横跨第一和第二热交换器的气流的一个或多个气动装置。所述第一热交换器与所述冷却剂回路流体连通，并且所述第二热交换器与所述制冷单元的制冷回路流体连通地联接，用于将通过所述制冷回路的制冷剂的热量排出到穿过所述第二热交换器的气流。

3. 发明授权

US08953320B2 Coolant drip facilitating partial immersion-cooling of electronic components 有权
标题翻译：冷却液滴液促进电子部件的部分浸没冷却
公开(公告)号：US08953320B2
公开(公告)日：2015-02-10
申请号：US13613873
申请日：2012-09-13
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： H05K7/20 , H01L23/427
CPC分类号： H05K7/20809 , F28D15/02 , F28D15/046 , F28F3/048 , H05K7/203
摘要： Cooling apparatus and methods are provided for partial immersion-cooling of multiple electronic components. The cooling apparatus includes a housing at least partially surrounding and forming a compartment about the components, and a fluid disposed within the compartment. First and second electronic components are at least partially non-immersed within the fluid, with the first component being a different type of electronic component with different configuration than the second component. A vapor condenser is provided with a vapor-condensing surface disposed within the compartment for condensing fluid vapor, and a condensate redirect structure is disposed within the compartment between the vapor condenser and the first and second components. The redirect structure is differently configured over the first electronic component compared with over the second electronic component, and provides a different pattern of condensate drip over the first component compared with over the second component.
摘要翻译：提供冷却装置和方法用于多个电子部件的部分浸没冷却。冷却装置包括至少部分围绕部件周围并形成隔室的壳体以及设置在隔间内的流体。第一和第二电子部件至少部分地不浸在流体内，其中第一部件是与第二部件不同的构造的不同类型的电子部件。蒸汽冷凝器设置有设置在隔间内的蒸汽冷凝表面，用于冷凝流体蒸气，并且冷凝物重新导向结构设置在蒸气冷凝器和第一和第二部件之间的隔间内。与第二电子部件相比，重定向结构在第一电子部件上被不同地配置，并且与第二部件相比，在第一部件上提供了不同的冷凝物滴落模式。

4. 发明授权

US08941993B2 Heat exchanger door for an electronics rack 有权
标题翻译：用于电子机架的热交换器门
公开(公告)号：US08941993B2
公开(公告)日：2015-01-27
申请号：US13443070
申请日：2012-04-10
申请人： Eric A. Eckberg , Howard V. Mahaney, Jr. , William M. Megarity , Roger R. Schmidt , Tejas Shah , Scott A. Shurson
发明人： Eric A. Eckberg , Howard V. Mahaney, Jr. , William M. Megarity , Roger R. Schmidt , Tejas Shah , Scott A. Shurson
IPC分类号： H05K7/20 , G06F1/20
CPC分类号： B23P15/26 , H05K7/2079 , Y10T29/4935 , Y10T70/5761 , Y10T292/0917
摘要： An air-cooling apparatus is provided which includes a heat exchanger door and a catch bracket. The door is hingedly mounted to the air inlet or outlet side of an electronics rack, and includes: a door frame spanning at least a portion of the air inlet or outlet side of the rack, wherein the frame includes an airflow opening which facilitates airflow through the rack; an air-to-coolant heat exchanger supported by the door frame and disposed so that airflow through the airflow opening passes thereacross; and a door latch mechanism to selectively latch the heat exchanger door to the rack. The catch bracket is attached to the rack and sized to extend from the rack into the heat exchanger door through a catch opening, and the door latch mechanism is configured and mounted within the heat exchanger door to physically engage the catch bracket within the heat exchanger door.
摘要翻译：提供一种空气冷却装置，其包括热交换器门和收纳支架。门被铰接地安装到电子机架的空气入口或出口侧，并且包括：跨越架子的空气入口或出口侧的至少一部分的门框，其中框架包括气流开口，其有助于气流通过架子由所述门框架支撑并布置成使得通过所述气流开口的气流通过所述空气至冷却剂热交换器; 以及门闩机构，用于选择性地将热交换器门闩锁到机架上。捕获支架附接到支架上并且尺寸设计成通过卡合开口从支架延伸到热交换器门中，并且门闩锁机构构造并安装在热交换器门内以物理地接合热交换器门内的卡扣支架。

5. 发明授权

US08925333B2 Thermoelectric-enhanced air and liquid cooling of an electronic system 有权
标题翻译：电子系统的热电增强空气和液体冷却
公开(公告)号：US08925333B2
公开(公告)日：2015-01-06
申请号：US13613832
申请日：2012-09-13
申请人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
发明人： Levi A. Campbell , Richard C. Chu , Milnes P. David , Michael J. Ellsworth, Jr. , Madhusudan K. Iyengar , Roger R. Schmidt , Robert E. Simons
IPC分类号： F25B21/02
CPC分类号： B21D53/02 , F25B21/02 , F25B2321/0252 , H05K7/2079 , Y10T29/49359
摘要： Thermoelectric-enhanced air and liquid cooling of an electronic system is provided by a cooling apparatus which includes a liquid-cooled structure in thermal communication with an electronic component(s), and liquid-to-liquid and air-to-liquid heat exchangers coupled in series fluid communication via a coolant loop, which includes first and second loop portions coupled in parallel. The liquid-cooled structure is supplied coolant via the first loop portion, and a thermoelectric array is disposed with the first and second loop portions in thermal contact with first and second sides of the array. The thermoelectric array operates to transfer heat from coolant passing through the first loop portion to coolant passing through the second loop portion, and cools coolant passing through the first loop portion before the coolant passes through the liquid-cooled structure. Coolant passing through the first and second loop portions passes through the series-coupled heat exchangers, one of which functions as heat sink.
摘要翻译：电子系统的热电增强空气和液体冷却由包括与电子部件热连通的液冷结构的冷却装置提供，液 - 液和空 - 液热交换器经由冷却剂回路串联流体连通，其包括并联连接的第一和第二回路部分。液冷结构经由第一回路部分供应冷却剂，热电阵列设置有第一和第二回路部分与阵列的第一和第二侧热接触。热电阵列用于将热量从穿过第一环路部分的冷却剂传递到穿过第二环路部分的冷却剂，并且在冷却剂通过液冷结构之前冷却通过第一环部分的冷却剂。通过第一和第二回路部分的冷却剂通过串联耦合的热交换器，其中一个用作散热器。

6. 发明授权

US08804334B2 Multi-rack, door-mounted heat exchanger 有权
标题翻译：多机架，门式换热器
公开(公告)号：US08804334B2
公开(公告)日：2014-08-12
申请号：US13115404
申请日：2011-05-25
申请人： Eric A. Eckberg , David P. Graybill , Madhusudan K. Iyengar , Howard V. Mahaney, Jr. , Roger R. Schmidt , Kenneth R. Schneebeli
发明人： Eric A. Eckberg , David P. Graybill , Madhusudan K. Iyengar , Howard V. Mahaney, Jr. , Roger R. Schmidt , Kenneth R. Schneebeli
IPC分类号： H05K7/20 , B23P15/26
CPC分类号： B23P15/26 , H05K7/20718 , H05K7/2079 , H05K7/20818 , Y10T29/4935
摘要： An air-cooling apparatus is provided which includes a securing mechanism for holding two or more separate electronics racks in fixed relation adjacent to each other, and a multi-rack door sized and configured to span the air inlet or air outlet sides of the racks. The securing mechanism holds the electronics racks in fixed relation with their air inlet sides facing a first direction, and air outlet sides facing a second direction. The door includes a door frame with an airflow opening. The airflow opening facilitates the ingress or egress of airflow through the electronics racks, and the door further includes an air-to-liquid heat exchanger supported by the door frame, and disposed so that air flowing through the airflow opening passes across the heat exchanger. In operation, the heat exchanger extracts heat from the air passing through the separate electronics racks.
摘要翻译：提供了一种空气冷却装置，其包括用于保持两个或更多个彼此相邻的固定关系的独立电子机架的固定机构，以及尺寸设计成跨越机架的空气入口侧或空气出口侧的多齿条门。固定机构使电子机架与其空气入口侧面对第一方向固定，并且空气出口侧面向第二方向。门包括具有气流开口的门框。气流开口有助于通过电子机架进入或流出气流，并且门还包括由门框架支撑的空气对液体热交换器，并且设置成使流过气流开口的空气穿过热交换器。在操作中，热交换器从通过分离的电子机架的空气中提取热量。

7. 发明授权

US08687364B2 Directly connected heat exchanger tube section and coolant-cooled structure 有权
标题翻译：直接连接热交换器管段和冷却剂冷却结构
公开(公告)号：US08687364B2
公开(公告)日：2014-04-01
申请号：US13283933
申请日：2011-10-28
申请人： Timothy J. Chainer , Patrick A. Coico , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
发明人： Timothy J. Chainer , Patrick A. Coico , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： B23P15/26 , H05K7/20781 , H05K7/20827 , Y10T29/4935 , Y10T29/49826
摘要： A cooling apparatus for an electronics rack is provided which includes an air-to-liquid heat exchanger, one or more coolant-cooled structures and a tube. The heat exchanger, which is associated with the electronics rack and disposed to cool air passing through the rack, includes a plurality of distinct, coolant-carrying tube sections, each tube section having a coolant inlet and a coolant outlet, one of which is coupled in fluid communication with a coolant loop to facilitate flow of coolant through the tube section. The coolant-cooled structure(s) is in thermal contact with an electronic component(s) of the rack, and facilitates transfer of heat from the component(s) to the coolant. The tube connects in fluid communication one coolant-cooled structure and the other of the coolant inlet or outlet of the one tube section, and facilitates flow of coolant directly between that coolant-carrying tube section of the heat exchanger and the coolant-cooled structure.
摘要翻译：提供了一种用于电子机架的冷却装置，其包括空气 - 液体热交换器，一个或多个冷却剂冷却结构和管。与电子机架相关联并设置成冷却通过齿条的空气的热交换器包括多个不同的冷却剂承载管部分，每个管部分具有冷却剂入口和冷却剂出口，其中一个耦合与冷却剂回路流体连通以便于冷却剂流过管段。冷却剂冷却结构与机架的电子部件热接触，并且有助于将热量从部件传递到冷却剂。该管连接流体连通一个冷却剂冷却结构和一个管部分的冷却剂入口或出口中的另一个，并且促使冷却剂直接在热交换器的冷却剂承载管部分和冷却剂冷却结构之间流动。

8. 发明授权

US08636406B2 Apparatus for thermal characterization under non-uniform heat load 有权
标题翻译：非均匀热负荷下热表征的装置
公开(公告)号：US08636406B2
公开(公告)日：2014-01-28
申请号：US13445641
申请日：2012-04-12
申请人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Roger R. Schmidt
发明人： Hendrik F. Hamann , Madhusudan K. Iyengar , James A. Lacey , Roger R. Schmidt
IPC分类号： G01N25/72 , G01K3/00
CPC分类号： H01L23/34 , H01L2924/0002 , H01L2924/00
摘要： An apparatus determines cooling characteristics of an operational cooling device used for transferring heat from an electronic device. The operational cooling device is thermally coupled to a heat pipe. The heat pipe has an exposed surface for selective application of heat thereon. Heat from a localized heat source is selectively applied to at least one region of the exposed surface. The heat source is preferably capable of being varied both positionally relative to the exposed surface and in heat intensity. A heat shield is preferably positioned around the exposed surface of the heat pipe to isolate the operational cooling device from the heat from the localized heat source. A temperature detector repeatedly measures a temperature distribution across the exposed surface while the cooling device is in a heat transfer mode. The temperature distribution is then used to thermally characterize the operational cooling device.
摘要翻译：设备确定用于从电子设备传送热量的操作冷却装置的冷却特性。操作冷却装置热耦合到热管。热管具有用于选择性地在其上施加热量的暴露表面。来自局部热源的热量被选择性地施加到暴露表面的至少一个区域。热源优选能够相对于暴露的表面和热强度在位置上都变化。优选地，隔热板围绕热管的暴露表面定位，以将操作冷却装置与来自局部热源的热隔离。当冷却装置处于传热模式时，温度检测器重复测量暴露表面上的温度分布。然后将温度分布用于热操作冷却装置的特征。

9. 发明申请

US20130343005A1 THERMAL TRANSFER STRUCTURES COUPLING ELECTRONICS CARD(S) TO COOLANT-COOLED STRUCTURE(S) 有权
标题翻译：热转印结构将电子卡耦合到冷却冷却结构（S）
公开(公告)号：US20130343005A1
公开(公告)日：2013-12-26
申请号：US13527947
申请日：2012-06-20
申请人： Milnes P. DAVID , David P. GRAYBILL , Madhusudan K. IYENGAR , Vinod KAMATH , Bejoy J. KOCHUPARAMBIL , Pritish R. PARIDA , Roger R. SCHMIDT , Mark E. STEINKE
发明人： Milnes P. DAVID , David P. GRAYBILL , Madhusudan K. IYENGAR , Vinod KAMATH , Bejoy J. KOCHUPARAMBIL , Pritish R. PARIDA , Roger R. SCHMIDT , Mark E. STEINKE
IPC分类号： H05K7/20 , H05K13/00
CPC分类号： H05K7/20745 , H05K7/2079 , H05K13/00
摘要： Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.
摘要翻译：提供冷却装置和冷却剂冷却的电子系统，其包括热传递结构，其被配置成与弹簧力接合一个或多个电子卡，其中电子卡在电子系统的相应插座内对接。冷却装置的热传递结构包括具有第一热传导表面的散热器和耦合到散热器的导电表面的导热弹簧组件，并被定位和配置成驻留在物理上耦合电子器件的第一表面卡到散热器的第一表面，使电子卡在电子系统的插座内对接。在一个实施例中，热传递结构是冶金结合到冷却剂冷却结构，并且有助于将热量从电子卡传递到流过冷却剂冷却结构的冷却剂。

10. 发明申请

US20130264027A1 PROCESS FOR OPTIMIZING A HEAT EXCHANGER CONFIGURATION 有权
标题翻译：优化热交换器配置的过程
公开(公告)号：US20130264027A1
公开(公告)日：2013-10-10
申请号：US13443094
申请日：2012-04-10
申请人： Eric A. ECKBERG , Howard V. MAHANEY, JR. , William M. MEGARITY , Roger R. SCHMIDT , Tejas SHAH , Scott A. SHURSON
发明人： Eric A. ECKBERG , Howard V. MAHANEY, JR. , William M. MEGARITY , Roger R. SCHMIDT , Tejas SHAH , Scott A. SHURSON
IPC分类号： F28F9/007 , G06F15/00
CPC分类号： F28F27/00 , F28F2200/00 , H05K7/20836
摘要： A heat exchanger door and heat exchanger core optimization method are provided. The door resides at an air inlet or outlet side of an electronics rack, and includes an air-to-coolant heat exchanger with a heat exchanger core. The core includes a first coolant channel coupled to a coolant inlet manifold downstream from a second coolant channel, and the first channel has a shorter channel length than the second channel. Further, coolant channels of the core are coupled to provide counter-flow cooling of an airflow passing across the core. The core optimization method determines at least one combination of parameters that optimize for a particular application at least two performance metrics of the heat exchanger. This method includes obtaining performance metrics for boundary condition(s) of possible heat exchanger configurations with different variable parameters to determine a combination of parameters that optimize the performance metrics for the heat exchanger.
摘要翻译：提供了一种换热器门和热交换器芯优化方法。门位于电子机架的空气入口或出口侧，并且包括具有热交换器芯的空气 - 冷却剂热交换器。该芯包括与第二冷却剂通道下游的冷却剂入口歧管相连的第一冷却剂通道，并且第一通道具有比第二通道更短的通道长度。此外，芯的冷却剂通道被联接以提供穿过芯的气流的逆流冷却。核心优化方法确定为特定应用优化热交换器的至少两个性能度量的参数的至少一个组合。该方法包括获得具有不同可变参数的可能热交换器配置的边界条件的性能指标，以确定优化热交换器的性能指标的参数的组合。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式