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    • 10. 发明授权
    • Transducing head and method for forming a recessed shield for a transducing head
    • 用于形成用于换能头的凹形屏蔽的转换头和方法
    • US06510030B1
    • 2003-01-21
    • US09528286
    • 2000-03-17
    • Dian SongNurul Amin
    • Dian SongNurul Amin
    • G11B5127
    • B82Y25/00B82Y10/00G11B5/11G11B5/313G11B5/3146G11B5/3163G11B5/3903G11B5/3909G11B5/3912G11B5/398Y10T29/49021
    • A method for forming a transducing head first requires the deposition of a bottom shield, a bottom thick gap, a bottom thin gap, a sensor, a first flux guide, a top thin gap, a top thick gap, and a top shield. After each of the layers is deposited, an air bearing portion of both the top and bottom thick gaps is removed, such that a length of the air bearing portion of the top thick gap is substantially equal to a length of the air bearing portion of the bottom thick gap. Next, an air bearing shield is deposited over the air bearing surface, the air bearing shield being in contact with the top and bottom shields, the top and bottom thick gaps, the top and bottom thin gaps, and the flux guide. Finally, the air bearing surface of the transducing head is planarized, resulting in the top and bottom thin gaps and the first flux guide each being exposed at the air bearing surface.
    • 用于形成换能头的方法首先需要沉积底部屏蔽层,底部厚间隙,底部薄间隙,传感器,第一磁通引导件,顶部薄间隙,顶部厚间隙和顶部屏蔽。 在沉积每个层之后,去除顶部和底部厚间隙的空气轴承部分,使得顶部厚间隙的空气轴承部分的长度基本上等于 底部厚差。 接下来,空气轴承屏蔽层沉积在空气轴承表面上,空气轴承屏蔽与顶部和底部屏蔽件,顶部和底部较厚间隙,顶部和底部薄间隙以及磁通引导件接触。 最后,换能头的空气轴承表面被平坦化,导致顶部和底部薄的间隙以及第一个磁通引导件都被暴露在空气轴承表面。