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1. 发明公开

US20230418618A1 COMPUTER INTELLIGENT SWITCHING SYSTEM AND METHOD THEREOF 审中-公开
公开(公告)号：US20230418618A1
公开(公告)日：2023-12-28
申请号：US17849551
申请日：2022-06-24
申请人： EVGA CORPORATION
发明人： TAI-SHENG HAN
IPC分类号： G06F9/4401 , G06F1/26
CPC分类号： G06F9/4401 , G06F1/26
摘要： A computer intelligent switching system and a method thereof comprise a portable object and a circuit baseplate, the portable object is used to send a broadcast packet with a Bluetooth address (BD address), the circuit baseplate is disposed in a computer device and electrically connected to a motherboard of the computer device. After a series of comparison and confirmation procedures between the circuit baseplate and the portable object, the circuit baseplate determines whether to execute an operation on the computer device or disconnect connection with the portable object to re-enter a detection procedure according to a replied signal.

2. 发明授权

US10401927B2 Wireless graphics card monitoring device 有权
公开(公告)号：US10401927B2
公开(公告)日：2019-09-03
申请号：US15602113
申请日：2017-05-23
申请人： EVGA CORPORATION
发明人： Tai-Sheng Han
IPC分类号： G06F1/20 , G06F3/14 , G05B15/02 , F24F11/70 , G09G3/04 , G09G3/36
摘要： A wireless graphics card monitoring device includes a graphics card, which includes a control element in information connection with the graphics card to control hardware status data of the graphics card and mobile control software loaded in a mobile device and in wireless information connection with the control element ton control and display the hardware status data. The control element is operable to control the hardware status data, such as an operation temperature of the graphics card, a rotational speed of a fan, or a processing frequency. The mobile control software controls and displays the hardware status data. As such, a user may use the mobile control software of the mobile device to establish wireless connection with the control element to monitor and control the hardware status data of the graphics card.

3. 发明授权

US10278308B2 Interlaced heat dissipation structure of addin card 有权
公开(公告)号：US10278308B2
公开(公告)日：2019-04-30
申请号：US15475159
申请日：2017-03-31
申请人： EVGA CORPORATION
发明人： Tai-Sheng Han
IPC分类号： H05K7/20 , G06F1/20
摘要： An interlaced heat dissipation structure of an addin card generally includes an addin card, a plurality of heat dissipation fins arranged on the addin card, at least one receiving space defined between the heat dissipation fins, a plurality of cooling pipes extending through the heat dissipation fins, and a plurality of heat dissipative elements arranged in the receiving space in a manner of being interlaced with the cooling pipes. As such, the heat dissipation fins, the cooling pipes, and the heat dissipative elements help cool down the addin card to keep the operation of the addin card stable. The interlaced arrangement of the cooling pipes and the heat dissipative elements in the receiving space defined between the heat dissipation fins makes it possible to maximize the total effective heat dissipation area.

4. 发明申请

US20180203493A1 HEAT DISSIPATION CONTROL DEVICE BASED ON GRAPHICS CARD CORE PARAMETERS 审中-公开
公开(公告)号：US20180203493A1
公开(公告)日：2018-07-19
申请号：US15475158
申请日：2017-03-31
申请人： EVGA CORPORATION
发明人： Tai-Sheng Han
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/206 , H05K7/20172 , H05K7/20209 , Y02D10/16
摘要： Disclosed is a head dissipation control device based on graphics card core parameters, including a graphics card, a cooling element arranged at one side of the graphics card, a control board arranged at one side of the cooling element and electrically connected with the cooling element, a graphics processor arranged on the graphics card, a detection unit provided in the control board, and at least one computation unit provided in the control board and in information communication with the detection unit. The detection unit reads and access chip specification of the graphics processor and detect a power consumption parameter of the graphics processor. The computation unit integrates the chip specification and the power consumption parameter to generate an optimum operation speed of the cooling element. A user may operate the control board to adjust the cooling element according to the operation speed so as to achieve an optimum cooling efficiency.

5. 发明申请

US20180188785A1 ASYNCHRONOUS TEMPERATURE CONTROL INTEGRATED DEVICE 审中-公开
公开(公告)号：US20180188785A1
公开(公告)日：2018-07-05
申请号：US15436736
申请日：2017-02-17
申请人： EVGA CORPORATION
发明人： Tai-Sheng Han
IPC分类号： G06F1/20 , H05K7/20 , G06F1/04
CPC分类号： G06F1/206 , G06F1/04 , G06F1/20 , H05K7/20909
摘要： An asynchronous temperature control integrated device includes a graphics card body including a graphics processor and a power supply circuit, a first heat dissipation device, at least one first temperature sensor arranged at one side of the first heat dissipation device, at least one second heat dissipation device arranged on the power supply circuit, at least one second temperature sensor arranged at one side of the second heat dissipation device, and a control device arranged on the graphics card body. As such, two groups of heat dissipation device and temperature sensor are provided to respectively detect the temperatures of two major heat sources on the graphics card body, and the control device is operable to individually control the heat dissipation performances of the two heat dissipation devices to make time and efficient use of the operations of the heat dissipation devices.

6. 发明申请

US20180101202A1 HEAT DISSIPATION DEVICE FOR DISPLAY CARD 有权
公开(公告)号：US20180101202A1
公开(公告)日：2018-04-12
申请号：US15381131
申请日：2016-12-16
申请人： EVGA CORPORATION
发明人： Tai-Sheng Han
IPC分类号： G06F1/20 , H05K7/20
CPC分类号： G06F1/20 , G06F2200/201 , H05K7/20154 , H05K7/20263 , H05K7/20272 , H05K7/20409 , H05K7/20436
摘要： The heat dissipation device is for a display card and includes an air cooling member on a power supply circuit of the display card, a water cooling member on a processing element of the display card, and an auxiliary member disposed to a side of the water cooling member adjacent to the display card. The auxiliary member has at least an opening corresponding to the processing element and an extension piece extended away from the opening corresponding to a memory of the display card. As such, the heat from power supply circuit, the processing element, and the memory is respectively dissipated by the air cooling member, the water cooling member, and the auxiliary member and its extension piece, thereby achieving significantly enhanced heat dissipation performance.

7. 发明申请

US20170030493A1 STRUCTURE OF WATER-COOLING PIPING SYSTEM 审中-公开
标题翻译：水冷管道系统结构
公开(公告)号：US20170030493A1
公开(公告)日：2017-02-02
申请号：US14814517
申请日：2015-07-31
申请人： EVGA CORPORATION
发明人： TAI-SHENG HAN
IPC分类号： F16L9/19 , H05K7/20
CPC分类号： F16L9/20 , G06F1/20 , H01L23/473
摘要： A water-cooling piping system generally includes at least one water-cooling heat dissipation device, at least one heat dissipation conduit connected to one side of the water-cooling heat dissipation device, a hot flow tube arranged in the heat dissipation conduit, a cold flow tube arranged in the heat dissipation conduit and beside the hot flow tube, and an insulator arranged in the heat dissipation conduit. The insulator surrounds an outside wall of each of the hot flow tube and the cold flow tube to have the hot flow tube and the cold flow tube isolated from and independent of each other. With such an arrangement, the hot flow tube and the cold flow tube are arranged in the heat dissipation conduit to form an integrated structure so that the space occupied by the tubes can be reduced and the installation of the heat dissipation conduit and the water-cooling heat dissipation device can be simplified. In addition, the insulator is provided to isolate the hot flow tube and the cold flow tube from each other so as to effectively improve the overall water cooling effect.
摘要翻译：水冷管道系统通常包括至少一个水冷散热装置，至少一个连接到水冷散热装置的一侧的散热管，布置在散热管中的热流管，冷布置在散热管道和热流管旁边的流管，以及布置在散热管中的绝缘体。绝热体围绕热流管和冷流管各自的外壁，使热流管和冷流管彼此隔离并相互独立。通过这样的布置，热流管和冷流管布置在散热管中，以形成一体的结构，从而可以减少由管占据的空间，并且安装散热管和水冷散热装置可以简化。此外，提供绝缘体以将热流管和冷流管彼此隔离，以有效地提高整体的水冷却效果。

8. 发明授权

US11829217B2 Asynchronous temperature control integrated device 有权
公开(公告)号：US11829217B2
公开(公告)日：2023-11-28
申请号：US17405046
申请日：2021-08-18
申请人： EVGA CORPORATION
发明人： Tai-Sheng Han
IPC分类号： G06F1/26 , G06F1/20 , H05K7/20 , G08B5/36 , G08B21/18
CPC分类号： G06F1/206 , G06F1/26 , G08B5/36 , G08B21/18 , H05K7/20209
摘要： An asynchronous temperature control integrated device includes a graphics card body including a graphics processor and a power supply circuit, at least one external fan connection port, a first heat dissipation device, at least one first temperature sensor, a second heat dissipation device, a plurality of second temperature sensors, a plurality of light emission elements, and a control device including an externality control member, a high-power drive module, and a scenario database. Thus, two groups of heat dissipation device and temperature sensor are provided to respectively detect the temperatures of two major heat sources on the graphics card body, and the heat dissipation performances of the two heat dissipation devices are individually controllable to make timely and efficient operations of the heat dissipation devices, and also to collaboratively drive an external fan to thereby enhance overall airflow, reduce system internal temperature, and achieve bettered conditions of temperature control.

9. 发明公开

US20230327385A1 POWER ADAPTER 审中-公开
公开(公告)号：US20230327385A1
公开(公告)日：2023-10-12
申请号：US18193666
申请日：2023-03-31
申请人： EVGA CORPORATION
发明人： Tai-Sheng HAN
IPC分类号： H01R31/06 , H01R4/42 , H01R13/518
CPC分类号： H01R31/06 , H01R4/42 , H01R13/621 , H01R2201/06 , H01R13/518
摘要： A power adapter includes a housing, at least one conductive bar, a first electrical connector, and a fixing assembly. The conductive bar is disposed in the housing. The first electrical connector is movably disposed on one side of the housing and includes at least one electrical contact portion extending into the housing. The fixing assembly is movably disposed on the housing and includes two clamping members and an actuating member. The actuating member is configured to move the clamping members toward each other, so as to make the conductive bar and the electrical contact portion to abut against each other.

10. 发明授权

US10303228B2 Multi-directional cooling structure for interface card 有权
公开(公告)号：US10303228B2
公开(公告)日：2019-05-28
申请号：US15604676
申请日：2017-05-25
申请人： EVGA CORPORATION
发明人： Tai-Sheng Han
IPC分类号： G06F1/20 , H05K7/20
摘要： A multi-directional cooling structure for an interface card includes: a first cooling plate, configured on the interface card; a second cooling plate, configured at one side of the first cooling plate; at least one heat conduction element, configured on the first cooling plate and second cooling plate, and including a first heat conduction portion positioned on the first cooling plate and a second heat conduction portion in connection with the first heat conduction portion and positioned on the second cooling plate; and at least one cooling fin set, configured on one side of the heat conduction element away from the first and second cooling plates, and in direct contact with the heat conduction element. Therefore, the heat can be conducted not only to one side through the heat conduction element but to the cooling fin sets above, advantageously achieving multi-directional heat dissipation.

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