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1. 发明申请

US20190214173A1 AN APPARATUS FOR TRANSFERRING HEAT FROM A HEAT SOURCE TO A HEAT SINK 审中-公开
公开(公告)号：US20190214173A1
公开(公告)日：2019-07-11
申请号：US16323220
申请日：2017-08-03
申请人： Nanyang Technological University
发明人： Raju V. RAMANUJAN , Varun CHAUDHARY
IPC分类号： H01F1/44 , H01L23/473 , F25B21/00 , H02K9/19
CPC分类号： H01F1/445 , F25B21/00 , F25B2321/0021 , H01F1/017 , H01L23/473 , H02K9/19 , Y02B30/66
摘要： An apparatus for transferring heat from a heat source to a heat sink is disclosed. The apparatus comprises: a conduit containing a ferrofluid which comprises a plurality of magnetic nanoparticles, a first portion of the conduit being thermally coupleable to the heat source and a second portion of the conduit being thermally coupleable to the heat sink; and a magnetic element arranged to provide a magnetic field to the ferrofluid; wherein the magnetic element is located upstream of the first portion to drive a flow of the ferrofluid in the direction of the heat source.

2. 发明申请

US20190204026A1 FLUID HEAT EXCHANGE SYSTEMS 审中-公开
公开(公告)号：US20190204026A1
公开(公告)日：2019-07-04
申请号：US16297289
申请日：2019-03-08
申请人： CoolIT Systems Inc.
发明人： Geoff Sean Lyon
IPC分类号： F28F3/12 , F28F3/04 , F28D15/00 , H01L23/473
CPC分类号： F28F3/12 , F28D15/00 , F28F3/048 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A fluid heat exchanger includes: a heat spreader plate including an intended heat generating component contact region; a plurality of microchannels for directing heat transfer fluid over the heat spreader plate, the plurality of microchannels each having a first end and an opposite end and each of the plurality of microchannels extending substantially parallel with each other microchannel and each of the plurality of microchannels having a continuous channel flow path between their first end and their opposite end; a fluid inlet opening for the plurality of microchannels and positioned between the microchannel first and opposite ends, a first fluid outlet opening from the plurality of microchannels at each of the microchannel first ends; and an opposite fluid outlet opening from the plurality of microchannels at each of the microchannel opposite ends, the fluid inlet opening and the first and opposite fluid outlet openings providing that any flow of heat transfer fluid that passes into the plurality of microchannels, flows along the full length of each of the plurality of microchannels in two directions outwardly from the fluid inlet opening. A method of cooling a heat generating component uses a fluid heat exchanger that splits a mass flow of coolant.

3. 发明申请

US20190191596A1 ELECTRICAL APPARATUS 审中-公开
公开(公告)号：US20190191596A1
公开(公告)日：2019-06-20
申请号：US16161300
申请日：2018-10-16
申请人： TOYOTA JIDOSHA KABUSHIKI KAISHA
发明人： Yoshihiro MORITA , Jun ASADA
IPC分类号： H05K7/20 , H01L23/473 , F16L5/12
CPC分类号： H05K7/20872 , F16L5/12 , F25B41/003 , H01L23/473 , H05K7/20927
摘要： An electrical apparatus configured to be mounted in a vehicle includes a case that accommodates an electrical component; a cooler accommodated in the case and configured to cool the electrical component with use of a liquid refrigerant; and a refrigerant pipe that extends through a wall of the case and is connected to the cooler. A notch is provided on an outer surface of the refrigerant pipe such that the notch is located outside the case.

4. 发明申请

US20190157186A1 COMPOSITE HEAT SINK STRUCTURES 审中-公开
公开(公告)号：US20190157186A1
公开(公告)日：2019-05-23
申请号：US16251177
申请日：2019-01-18
申请人： INTERNATIONAL BUSINESS MACHINES CORPORATION
发明人： Levi A. CAMPBELL , Milnes P. DAVID , Dustin W. DEMETRIOU , Michael J. ELLSWORTH, JR. , Roger R. SCHMIDT , Robert E. SIMONS
IPC分类号： H01L23/473 , B29C43/20 , H01L23/427 , H05K7/20 , B29C70/84 , B29C70/88 , B29C43/18
CPC分类号： H01L23/473 , B29C43/18 , B29C43/203 , B29C70/84 , B29C70/88 , B29K2101/12 , B29K2705/00 , B29L2009/00 , B29L2031/3406 , H01L23/3672 , H01L23/4006 , H01L23/427 , H01L2924/00 , H01L2924/0002 , H05K7/20254 , H05K7/20436 , H05K7/20509 , H05K7/20772
摘要： Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.

5. 发明申请

US20190115519A1 THERMOELECTRIC GENERATOR 审中-公开
公开(公告)号：US20190115519A1
公开(公告)日：2019-04-18
申请号：US16091125
申请日：2017-03-24
申请人： DENSO CORPORATION
发明人： Takuya MATSUDA , Shinya KITAGAWA , Yoshiyuki OKAMOTO
IPC分类号： H01L35/30 , H01L35/32
CPC分类号： H01L35/30 , F28F3/025 , F28F3/027 , F28F2215/04 , F28F2215/08 , H01L23/10 , H01L23/467 , H01L23/473 , H01L25/10 , H01L35/32 , H02N11/00
摘要： A thermoelectric generator includes a tube in which a first fluid flows, a power generation module, a holding member, and a heat exchanging fin. The power generation module includes a thermoelectric conversion element. The holding member holds a stacked body in which the power generation module and the tube are stacked with each other such that heat can be transferred between the power generation module and the tube. Both end portions of the holding member are located and fixed outside both ends of the stacked body. The heat exchanging fin includes a pair of end fin portions provided on the reverse surface of the holding member at portions corresponding to the both ends of the stacked body, and an intermediate fin located between the pair of end fin portions and higher in stiffness than the pair of end fin portions.

6. 发明申请

US20190109068A1 POWER CONVERSION APPARATUS 审中-公开
公开(公告)号：US20190109068A1
公开(公告)日：2019-04-11
申请号：US16151365
申请日：2018-10-04
申请人： HONDA MOTOR CO., LTD.
发明人： Takahiro Uneme , Yuko Yamada
IPC分类号： H01L23/40 , H01L23/473 , H05K7/20 , H05K7/14 , B60L11/18
CPC分类号： H01L23/4012 , B60L53/20 , H01L23/4334 , H01L23/473 , H05K7/1432 , H05K7/20927
摘要： A power conversion apparatus mounted in a vehicle includes a semiconductor stack in which a plurality of semiconductor modules and a plurality of coolants including coolant passages are disposed by being alternately stacked, and a retaining unit which presses the semiconductor stack in a stacking direction to retain the semiconductor stack. The semiconductor modules and the coolants are attached to each other by a plate-shaped insulating resin adhesive member, and a roughened area on which a roughening treatment has been performed is formed in at least a part of the outer surface of the coolants to which the resin adhesive member is attached.

7. 发明申请

US20190067251A1 ELECTRONIC DEVICE 审中-公开
公开(公告)号：US20190067251A1
公开(公告)日：2019-02-28
申请号：US16035152
申请日：2018-07-13
申请人： Rensesas Electronics Corporation
发明人： Koji Bando , Tomohiro Nishiyama
IPC分类号： H01L25/065 , H01L23/367 , H01L23/538 , H01L23/31
CPC分类号： H01L25/0657 , H01L23/31 , H01L23/3677 , H01L23/4012 , H01L23/473 , H01L23/49562 , H01L23/49575 , H01L23/5385 , H01L23/5386 , H01L2224/05554 , H01L2224/0603 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/00014 , H01L2924/00012
摘要： An improvement is achieved in the heat dissipation property of an electronic device including power transistors. A semiconductor module includes first and second packages included in an inverter circuit. In the first package, a semiconductor chip having a high-side power transistor is embedded. In the second package, a semiconductor chip having a low-side power transistor is embedded. At the both wide surfaces of the first and second packages, first metal electrodes electrically coupled to respective collector electrodes of the power transistors and second metal electrodes electrically coupled to respective emitter electrodes of the power transistors are exposed. To the first and second metal electrodes of the first and second packages, four respective bus bar plates having areas larger than those of the first and second metal electrodes are joined.

8. 发明申请

US20190051586A1 POWER MODULE AND POWER CONVERSION SYSTEM INCLUDING SAME 审中-公开
公开(公告)号：US20190051586A1
公开(公告)日：2019-02-14
申请号：US15834541
申请日：2017-12-07
申请人： HYUNDAI MOTOR COMPANY , KIA MOTORS CORPORATION
发明人： Jun Hee PARK , Hyeon Uk KIM
IPC分类号： H01L23/495 , H01L23/00
CPC分类号： H01L23/49575 , H01L21/50 , H01L23/051 , H01L23/10 , H01L23/473 , H01L23/492 , H01L23/4951 , H01L23/49513 , H01L23/49527 , H01L23/49537 , H01L23/49548 , H01L23/49558 , H01L23/49568 , H01L23/49586 , H01L24/29 , H01L24/32 , H01L24/33 , H01L2224/291 , H01L2224/32225 , H01L2224/32257 , H01L2224/32258 , H01L2224/33181 , H01L2924/15153 , H01L2924/014 , H01L2924/00014
摘要： A power module includes an upper substrate comprising a plurality of circuit pattern areas made of a metal and a dielectric area disposed between each of the plurality of circuit pattern areas; a lower substrate including a plurality of circuit pattern areas made of a metal and a dielectric area disposed between each of the plurality of circuit pattern areas; and a semiconductor element having an upper terminal and a lower terminal, the upper terminal and the lower terminal being bonded to a lower surface of the upper substrate and an upper surface of the lower substrate, respectively.

9. 发明申请

US20190029105A1 Device Array Backframe With Integral Manifolding For High Performance Fluid Cooling 审中-公开
公开(公告)号：US20190029105A1
公开(公告)日：2019-01-24
申请号：US16037082
申请日：2018-07-17
申请人： Massachusetts Institute Of Technology
发明人： James Paul Smith , Bernard A. Malouin, JR. , Eric A. Browne , Kenneth L. Smith
IPC分类号： H05K1/02 , H05K7/20 , H01L23/473
CPC分类号： H05K1/0207 , H01L23/473 , H05K1/0272 , H05K7/20254 , H05K7/20263 , H05K7/20281 , H05K7/205 , H05K2201/064
摘要： The present invention generally relates to an array backframe with integral manifolding for high performance fluid cooling of devices. The integral manifolding of the array backframe is designed to perform three functions. First, the array backframe parallelizes the fluid paths to provide uniform, cool supply fluid to every device in the array. Second, the array backframe minimizes the parasitic heat losses between supply and exhaust by use of an isolation cavity. Third, the array backframe collapses hundreds of fluid lines into a single internal manifold to enhance modularity while also serving as a structural support member.

10. 发明申请

US20180350721A1 HEAT SINK AND HEAT SINK ASSEMBLY 审中-公开
公开(公告)号：US20180350721A1
公开(公告)日：2018-12-06
申请号：US15972559
申请日：2018-05-07
申请人： FANUC CORPORATION
发明人： Masato WATANABE , Taku SASAKI
IPC分类号： H01L23/473 , H01L25/07
CPC分类号： H01L23/473 , F28D15/00 , F28D2021/0029 , F28F3/02 , F28F3/12 , F28F2215/04 , H01L23/3672 , H01L23/3735 , H01L23/3736 , H01L25/072 , H01L25/115 , H01L29/1608
摘要： A heat sink capable of dissipating heat concentrating on a chip portion of a power semiconductor device module efficiently is provided. A heat sink (20) includes a heat sink body (21) in which a power semiconductor device module (10) having a plurality of power semiconductor devices (11) is placed on a cooling surface F1 and which radiates heat generated by the power semiconductor device (11); and a heat dissipation structure portion (25) having a higher heat conductivity than the heat sink body (21) and capable of dissipating heat generated by the power semiconductor device (11), wherein the heat dissipation structure portion (25) is provided at a position overlapping the power semiconductor device (11) disposed in the power semiconductor device module (10) in a direction (Z) orthogonal to the cooling surface (F1) of the heat sink body (21).

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