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    • 2. 发明授权
    • Moving head for semiconductor wafer polishing apparatus
    • 半导体晶片抛光装置的移动头
    • US07294041B1
    • 2007-11-13
    • US11532134
    • 2006-09-15
    • Eun Sang LeeJong Goo WonJung Talk Lee
    • Eun Sang LeeJong Goo WonJung Talk Lee
    • B24B49/00
    • B24B49/10B24B37/005B24B37/04B24B49/16
    • Disclosed herein is a moving head for a semiconductor wafer polishing apparatus. The semiconductor wafer polishing apparatus has a table on which a polishing pad is formed, and the moving head mounted via a support unit to hold a wafer relative to a polishing surface of the table. In this case, the moving head includes a sensing means having a load cell and a piezoelectric sensor to measure pressing force and frictional force acting on the wafer provided in the moving head. The present invention relates to the polishing of a semiconductor wafer material from which an integrated circuit is made. That is, the present invention provides a moving head for semiconductor wafer polishing apparatuses, which detects vibrations transmitted to a wafer and outputs signals indicating frictional force and pressing force acting on the wafer, using a load cell and a piezoelectric sensor installed in the moving head so as to maintain optimum frictional force and pressing force relative to the surface of a polishing pad, thus realizing precise final polishing.
    • 本文公开了一种用于半导体晶片抛光装置的移动头。 半导体晶片抛光装置具有其上形成有抛光垫的工作台,并且经由支撑单元安装的移动头相对于工作台的抛光表面保持晶片。 在这种情况下,移动头包括具有负载传感器和压电传感器的感测装置,用于测量作用在设置在移动头部中的晶片上的按压力和摩擦力。 本发明涉及对其制造集成电路的半导体晶片材料的抛光。 也就是说,本发明提供一种用于半导体晶片抛光装置的移动头,其使用安装在移动头中的测力传感器和压电传感器来检测传输到晶片的振动并输出指示作用在晶片上的摩擦力和压力的信号 以便保持相对于抛光垫的表面的最佳摩擦力和压力,从而实现精确的最终抛光。