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1. 发明授权

US11592743B2 Positive-type photosensitive resin composition 有权
公开(公告)号：US11592743B2
公开(公告)日：2023-02-28
申请号：US16075416
申请日：2016-02-05
申请人： HITACHI CHEMICAL DUPONT MICROSYSTEMS, LTD.
发明人： Tadamitsu Nakamura
IPC分类号： G03F7/023 , G03F7/022 , G03F7/004 , G03F7/039 , G03F7/40
摘要： A positive-type photosensitive resin composition comprises a (a) polybenzoxazole precursor, a (b) crosslinking agent, a (c) photosensitive agent, and a (d) solvent, wherein the (a) component comprises a structural unit represented by Formula (1) below, and the (b) component is a compound represented by Formula (2) below. In Formula (1), U is a bivalent organic group, a single bond, —O—, or —SO2—, V is a group comprising an aliphatic structure, and the carbon number in the aliphatic structure is 1 to 30. In Formula (2), R1 is independently a hydrogen atom or a group represented by —CH2—O—R2. At least one of the plurality of R1s is a group represented by —CH2—O—R2. R2 is independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

2. 发明申请

US20220350244A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, AND DISPLAY DEVICE 有权
公开(公告)号：US20220350244A1
公开(公告)日：2022-11-03
申请号：US17640256
申请日：2020-09-03
申请人： Toray Industries, Inc.
发明人： Hideyuki Kobayashi , Mitsuhito Suwa , Yukinori Togo
IPC分类号： G03F7/022 , G03F7/023 , G03F7/075
摘要： A photosensitive resin composition includes a siloxane resin (A), particles (B) having a median diameter of 0.2 to 0.6 μm, and a naphthoquinone diazide compound (C), wherein the siloxane resin (A) contains at least 20 to 60 mol % in total of a repeating unit represented by general formula (1): wherein R1 represents an aryl group having 6 to 18 carbon atoms or an aryl group having 6 to 18 carbon atoms in which all or part of hydrogen is substituted.

3. 发明授权

US11199776B2 Resin composition 有权
公开(公告)号：US11199776B2
公开(公告)日：2021-12-14
申请号：US16314822
申请日：2017-07-25
申请人： TORAY INDUSTRIES, INC.
发明人： Yusuke Komori , Kazuto Miyoshi
IPC分类号： G03F7/023 , G03F7/038 , G03F7/40 , H01L23/29 , G03F7/20 , C07C233/80 , C08G73/10 , C07C233/44 , C08G73/22 , H05B33/10 , H01L27/32 , C08L101/02 , H01L51/50 , C08L79/08 , H05B33/22 , G03F7/004 , G03F7/022 , C08K5/20 , C07C233/43 , C07C237/40 , C08J5/18 , G03F7/039 , G03F7/16 , G03F7/30 , H01L21/78 , H01L23/544 , H01L23/00 , H01L27/12 , H01L51/00 , H01L51/56
摘要： The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate. The resin composition includes: (a) an alkali-soluble resin and (b1) an amido-phenol compound containing a phenolic hydroxyl group in which a monovalent group as represented by the undermentioned general formula (1) is located at the ortho position and/or (b2) an aromatic amido acid compound containing a carboxy group in which a monovalent group as represented by the undermentioned general formula (2) is located at the ortho position: wherein in general formula (1), X is a monovalent organic group having an alkyl group that contains 2 to 20 carbon atoms and bonds directly to the carbonyl carbon in general formula (1) or a monovalent organic group that has —(YO)n—; and in general formula (2), U is a monovalent organic group that has an alkyl group containing 2 to 20 carbon atoms and bonding directly to the amide nitrogen in general formula (2) or a monovalent organic group that has —(YO)n—; wherein Y is an alkylene group containing 1 to 10 carbon atoms and n is an integer of 1 to 20.

4. 发明申请

US20210382390A1 NOVOLAK/DNQ BASED, CHEMICALLY AMPLIFIED PHOTORESIST 有权
公开(公告)号：US20210382390A1
公开(公告)日：2021-12-09
申请号：US17056773
申请日：2019-05-22
申请人： Merck Patent GmbH
发明人： Medhat A. Toukhy , Weihong Liu , Takanori Kudo , Hung-Yang Chen , Jian Yin
IPC分类号： G03F7/023 , G03F7/022 , C08G59/14 , C09D163/04
摘要： The present invention relates to resist compositions comprising a polymer component, a photoacid generator component (PAG), a photoactive diazonaphthoquinone component (PAC), a base component, a solvent component, and optionally, a heterocyclic thiol component. The polymer component is a Novolak derivative, comprising Novolak repeat units with free phenolic hydroxy moieties, and Novolak repeat units comprising phenolic hydroxy moieties protected with an acid cleavable acetal moiety. The acetal moiety is elected from a mono functional alkyl acetal moiety protecting a repeat unit comprising a Novolak phenolic hydroxy moiety, an acetal, comprising a moiety functionalized with a PAC moiety, protecting a repeat unit comprising a Novolak phenolic hydroxy moiety; a di-functional acetal comprising moiety, linking and protecting two repeat units comprising Novolak phenolic hydroxy moieties, forming a linking point in said polymer component between two different polymer chains in said polymer component, and a mixture of any of these three types of acid cleavable acetal moieties. The PAC component is selected from said acetal, comprising a moiety functionalized with a PAC moiety, protecting a repeat unit comprising a Novolak phenolic hydroxy moiety, a free PAC component, and a mixture of these two types of PAC components. The present invention also relates to the methods of using the present compositions in either in thick or thin film photoresist device manufacturing methodologies.

5. 发明申请

US20210278765A1 RESIST COMPOSITION AND METHOD FOR PRODUCING RESIST PATTERN, AND METHOD FOR PRODUCING PLATED MOLDED ARTICLE 有权
公开(公告)号：US20210278765A1
公开(公告)日：2021-09-09
申请号：US17178794
申请日：2021-02-18
申请人： SUMITOMO CHEMICAL COMPANY, LIMITED
发明人： Masako SUGIHARA , Takashi NISHIMURA , Junji NAKANISHI
IPC分类号： G03F7/023 , G03F7/039 , G03F7/038 , C08F212/14
摘要： The present invention provides a resist composition which has sufficient resistant to a plating treatment and is capable of forming a resist pattern with high accuracy. The present invention also provides a method for producing a resist pattern using the resist composition, and a method for producing a plated molded article using the resist pattern. The present invention relates to a resist composition comprising a compound (I) having a quinone diazide sulfonyl group, a resin comprising a structural unit having an acid-labile group (A1), an alkali-soluble resin (A2) and an acid generator (B); a method for producing a resist pattern using the resist composition; and a method for producing a plated molded article using the resist pattern.

6. 发明授权

US11106133B2 Positive-type photosensitive resin composition and cured film prepared therefrom 有权
公开(公告)号：US11106133B2
公开(公告)日：2021-08-31
申请号：US16192013
申请日：2018-11-15
申请人： ROHM AND HAAS ELECTRONIC MATERIALS KOREA LTD.
发明人： Yeonok Kim , Geun Huh , Ju-Young Jung , Jung-Hwa Lee , Jong Han Yang
IPC分类号： G03F7/039 , G03F7/075 , G03F7/038 , G03F7/023 , C08G77/392 , C08G77/388 , H01L27/12
摘要： The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises an acrylic resin and a siloxane copolymer containing a sulfonated diazoquinone group at the terminal thereof. Thus, the film retention rate and adhesiveness can be further enhanced, while the sensitivity is maintained.

7. 发明授权

US11048167B2 Positive photosensitive resin composition, patterned cured film production method, patterned cured film, and electronic component 有权
公开(公告)号：US11048167B2
公开(公告)日：2021-06-29
申请号：US15545751
申请日：2016-01-22
申请人： Hitachi Chemical Dupont Microsystems, Ltd.
发明人： Daisaku Matsukawa , Tetsuya Enomoto
IPC分类号： G03F7/023 , G03F7/40 , G03F7/022 , C09D179/04 , C08G69/32 , C08G73/22 , C08K5/03 , C08K5/42 , C08L75/04 , C08G71/04
摘要： A positive photosensitive resin composition comprising (a) polybenzoxazole precursor, (b) a cross-linking agent, (c) a diazonaphoquinone compound, (d) an iodonium compound and (e) a solvent.

8. 发明授权

US10908500B2 Cured film and method for producing same 有权
公开(公告)号：US10908500B2
公开(公告)日：2021-02-02
申请号：US16063893
申请日：2017-01-10
申请人： TORAY INDUSTRIES, INC.
发明人： Yu Shoji , Yuki Masuda , Kimio Isobe , Ryoji Okuda
IPC分类号： G03F7/023 , C08G73/22 , G03F7/40 , G03F7/085 , G03F7/075 , G03F7/022
摘要： Provided is a cured film having high chemical resistance, high elongation, and high adhesion to metal copper. A cured film formed by curing a photosensitive resin composition containing a polybenzoxazole precursor, in which a rate at which the polybenzoxazole precursor is cyclized into polybenzoxazole is not less than 10% and not more than 60%.

9. 发明申请

US20200004145A1 RADIATION-SENSITIVE RESIN COMPOSITION AND ELECTRONIC COMPONENT 审中-公开
公开(公告)号：US20200004145A1
公开(公告)日：2020-01-02
申请号：US16490694
申请日：2018-01-31
申请人： ZEON CORPORATION
发明人： Makoto FUJIMURA
IPC分类号： G03F7/023 , C08G59/22 , C08L61/06 , C08K5/5419 , C08G8/10 , G03F7/075 , C08F32/02
摘要： Provided is a radiation-sensitive resin composition capable of forming a resin film for which development residue formation is sufficiently inhibited and that has excellent extensibility. The radiation-sensitive resin composition contains: a cycloolefin polymer (A-1) including a protonic polar group; a cycloolefin polymer (A-2) including a protonic polar group; a difunctional epoxy compound (B); and a radiation-sensitive compound (C). The cycloolefin polymer (A-1) has a weight-average molecular weight of not less than 1,000 and less than 10,000, and the cycloolefin polymer (A-2) has a weight-average molecular weight of not less than 10,000 and not more than 100,000. Content of the cycloolefin polymer (A-2) is not less than 5 mass % and not more than 55 mass % of total content of the cycloolefin polymer (A-1) and the cycloolefin polymer (A-2).

10. 发明授权

US10409162B2 Highly heat resistant polysilsesquioxane-based photosensitive resin composition 有权
公开(公告)号：US10409162B2
公开(公告)日：2019-09-10
申请号：US15039740
申请日：2015-08-28
申请人： LTC CO., LTD
发明人： Jun Young Kim , Hwa Young Kim , Sang Hun Cho , Kwang Hyun Ryu , Ho Sung Choi
IPC分类号： G03F7/023 , G03F7/075 , C08G77/04 , G03F7/004 , G03F7/039 , G03F7/16 , G03F7/20 , G03F7/32 , H01L27/32 , G03F7/038 , G02F1/1333 , G02F1/1362 , C08G77/14 , C08G77/18
摘要： The present invention relates to a highly heat resistant silsesquioxane-based photosensitive resin composition for a liquid crystal display device or an organic EL display device, and a positive resist insulating layer prepared therefrom, and in particular, to a silsesquioxane-based photosensitive resin composition having high heat resistance and a low dielectric property, capable of being used as an insulating layer forming a via hole of the thin film transistor (TFT), and simultaneously, capable of being used as an insulating layer for forming a bank pattern dividing pixels of an organic EL display device.

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