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1. 发明申请

US20120127452A1 METHOD FOR COARSE WAFER ALIGNMENT IN A LITHOGRAPHIC APPARATUS 审中-公开
标题翻译：方法在平面设备中进行粗糙对准
公开(公告)号：US20120127452A1
公开(公告)日：2012-05-24
申请号：US13360110
申请日：2012-01-27
申请人： Patrick WARNAAR , Franciscus Godefridus Bijnen
发明人： Patrick WARNAAR , Franciscus Godefridus Bijnen
IPC分类号： G03B27/58
CPC分类号： G03F9/7069 , G03F9/7076 , G03F9/7088
摘要： A method for alignment of a substrate, in which the substrate includes a mark in a scribe lane, and the scribe lane extends along a longitudinal direction as a first direction. The mark has a periodic structure in the first direction. The method includes providing an illumination beam for scanning the mark in a direction perpendicular to a direction of the mark's periodic structure along a first scan path across the mark, scanning the spot of the illumination beam along a second scan path across the mark, the second scan path being parallel to the first scan path, wherein the second scan path is shifted relative to the first scan path over a first shift that corresponds to a fraction of the repeating distance of the periodic structure.
摘要翻译：用于对准衬底的方法，其中衬底包括划线中的标记和划线，沿着纵向方向作为第一方向延伸。标记在第一方向上具有周期性结构。该方法包括提供照射光束，用于沿着与标记的周期结构的方向垂直的方向沿着标记的第一扫描路径扫描标记，沿着标记的第二扫描路径扫描照射光束的光点，第二扫描路径平行于第一扫描路径，其中第二扫描路径相对于对应于周期性结构的重复距离的一部分的第一移位相对于第一扫描路径移位。

2. 发明申请

US20070070311A1 Contacts to microdevices 审中-公开
标题翻译：与微型设备的联系
公开(公告)号：US20070070311A1
公开(公告)日：2007-03-29
申请号：US11233367
申请日：2005-09-23
申请人： Franciscus Godefridus Bijnen , Willem Weenink
发明人： Franciscus Godefridus Bijnen , Willem Weenink
IPC分类号： G03B27/42 , G03B27/52
CPC分类号： H01L24/13 , G03F7/70375 , G03F7/70425 , G03F9/7003 , G03F9/7084 , G03F9/7088 , H01L21/682 , H01L23/481 , H01L23/544 , H01L24/11 , H01L24/81 , H01L2223/54453 , H01L2224/1147 , H01L2224/13012 , H01L2224/13099 , H01L2224/13144 , H01L2224/16147 , H01L2224/16235 , H01L2224/16237 , H01L2224/2518 , H01L2224/81141 , H01L2224/81191 , H01L2224/81193 , H01L2224/812 , H01L2224/81801 , H01L2225/06513 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01032 , H01L2924/01033 , H01L2924/01049 , H01L2924/01061 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/30105 , H01L2924/00
摘要： Provided are microdevices, e.g. integrated circuits, with contact bumps and processes for making the same. The microdevices may have contact bumps on two or more sides of the microdevices. Also provided are stacks of microdevices.
摘要翻译：提供微器件，例如集成电路，具有接触凸块和制造相同的工艺。微器件可以在微器件的两侧或更多侧上具有接触凸点。还提供了微型设备的堆叠。

3. 发明申请

US20070252994A1 Alignment of substrates for bonding 有权
标题翻译：用于接合的基板的对准
公开(公告)号：US20070252994A1
公开(公告)日：2007-11-01
申请号：US11412112
申请日：2006-04-27
申请人： Franciscus Godefridus Bijnen , Roy Werkman
发明人： Franciscus Godefridus Bijnen , Roy Werkman
IPC分类号： G01B11/00
CPC分类号： H01L21/681 , H01L21/67092 , Y10T29/49131
摘要： An alignment apparatus for a substrate bonding system is provided with a first optical arm arranged to direct onto a detector radiation from a first alignment mark on a first substrate, and a second optical arm arranged to direct onto the detector radiation from a second alignment mark on a second substrate. The first alignment mark has a known location relative to a functional pattern provided on an opposite side of the first substrate, and the second alignment mark has a known location relative to a functional pattern provided on an opposite side of the second substrate. The substrate bonding system can be further provided with first and second substrate tables arranged to hold the first and second substrates such that they face one another, at least one of the substrate tables being movable in response to a signal output from the detector, thereby allowing the first and second substrates to be aligned with respect to each other for bonding.
摘要翻译：用于基板接合系统的对准装置设置有第一光学臂，布置成将第一对准标记上的检测器辐射引导到第一基板上，第二光臂布置成将检测器辐射从第二对准标记第二基板。第一对准标记具有相对于设置在第一基板的相对侧上的功能图案的已知位置，并且第二对准标记相对于设置在第二基板的相对侧上的功能图案具有已知位置。衬底接合系统还可以设置有第一和第二衬底台，布置成保持第一和第二衬底使得它们彼此面对，至少一个衬底台可响应于从检测器输出的信号而可移动，从而允许第一和第二基板相对于彼此对准以进行接合。

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