专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08456273B2 Chip resistor device and a method for making the same 有权
标题翻译：片式电阻器件及其制造方法
公开(公告)号：US08456273B2
公开(公告)日：2013-06-04
申请号：US13226094
申请日：2011-09-06
申请人： Full Chen
发明人： Full Chen
IPC分类号： H01C1/012
CPC分类号： H01C1/012 , H01C1/08 , H01C17/006 , H01C17/06 , Y10T29/49082
摘要： A chip resistor device includes: a dielectric substrate that has top and bottom surfaces and two opposite edge faces interconnecting the top and bottom surfaces; two electrodes that are formed on two opposite sides of the dielectric substrate and that cover the edge faces and parts of the top and bottom surfaces; a resistor layer that is formed on one of the top and bottom surfaces of the dielectric substrate between the electrodes and that is brought into contact with the electrodes; and a heat conductive layer that is disposed on the resistor layer oppositely of the dielectric substrate and between the electrodes, that contacts the resistor layer and the two electrodes, and that has a higher resistance than that of the resistor layer. A method for making the chip resistor device is also disclosed.
摘要翻译：芯片电阻器件包括：电介质基片，其具有顶表面和底表面以及互连顶表面和底表面的两个相对的边缘面; 两个电极，形成在电介质基片的两个相对的两侧，并覆盖顶面和底面的边缘面和部分; 电阻层，其形成在所述电介质基板的所述顶表面和所述底表面之一之间，并且与所述电极接触; 以及导电层，其设置在与电介质基板相反的电阻层上，并且在电极之间，与电阻层和两个电极接触，并且具有比电阻层更高的电阻。还公开了制造芯片电阻器件的方法。

2. 发明申请

US20120235782A1 CHIP RESISTOR DEVICE AND A METHOD FOR MAKING THE SAME 有权
标题翻译：芯片电阻器件及其制造方法
公开(公告)号：US20120235782A1
公开(公告)日：2012-09-20
申请号：US13226094
申请日：2011-09-06
申请人： Full CHEN
发明人： Full CHEN
IPC分类号： H01C1/012 , H01C17/00
CPC分类号： H01C1/012 , H01C1/08 , H01C17/006 , H01C17/06 , Y10T29/49082
摘要： A chip resistor device includes: a dielectric substrate that has top and bottom surfaces and two opposite edge faces interconnecting the top and bottom surfaces; two electrodes that are formed on two opposite sides of the dielectric substrate and that cover the edge faces and parts of the top and bottom surfaces; a resistor layer that is formed on one of the top and bottom surfaces of the dielectric substrate between the electrodes and that is brought into contact with the electrodes; and a heat conductive layer that is disposed on the resistor layer oppositely of the dielectric substrate and between the electrodes, that contacts the resistor layer and the two electrodes, and that has a higher resistance than that of the resistor layer. A method for making the chip resistor device is also disclosed.
摘要翻译：芯片电阻器件包括：电介质基片，其具有顶表面和底表面以及互连顶表面和底表面的两个相对的边缘面; 两个电极，形成在电介质基片的两个相对的两侧，并覆盖顶面和底面的边缘面和部分; 电阻层，其形成在所述电介质基板的所述顶表面和所述底表面之一之间，并且与所述电极接触; 以及导电层，其设置在与电介质基板相反的电阻层上，并且在电极之间，与电阻层和两个电极接触，并且具有比电阻层更高的电阻。还公开了制造芯片电阻器件的方法。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式