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1. 发明授权

US10056175B2 Thermistor mounting apparatus and thermistor component 有权
公开(公告)号：US10056175B2
公开(公告)日：2018-08-21
申请号：US15150432
申请日：2016-05-10
申请人： FUJI ELECTRIC CO., LTD.
发明人： Sayaka Yamamoto , Shogo Ogawa
IPC分类号： H01C7/10 , H01C7/00 , H01C1/012 , H05K1/02 , H05K1/14
CPC分类号： H01C7/008 , H01C1/012 , H05K1/0201 , H05K1/0268 , H05K1/141 , H05K2201/049 , H05K2201/10022
摘要： In order to realize a thermistor on a base substrate without restricting the layout of a wiring layer, a thermistor mounting apparatus is provided, the thermistor mounting apparatus including a base substrate, and a thermistor component provided over the base substrate, in which the thermistor component has an insulating substrate, an electrode provided over the insulating substrate, and a thermistor provided over the insulating substrate and electrically connected to the electrode.

2. 发明申请

US20180061533A1 RESISTOR ELEMENT AND RESISTOR ELEMENT ASSEMBLY 有权
公开(公告)号：US20180061533A1
公开(公告)日：2018-03-01
申请号：US15464649
申请日：2017-03-21
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Kwang Hyun PARK , Hae In KIM
IPC分类号： H01C1/06 , H01C1/14 , H01C1/012
CPC分类号： H01C1/06 , H01C1/012 , H01C1/14
摘要： A resistor element includes a base substrate having first and second surfaces opposing each other; a resistor layer disposed on the first surface of the base substrate; first and second terminals disposed on opposing end portions of the base substrate, respectively, and electrically connected to opposing sides of the resistor layer, respectively; a third terminal disposed between the first terminal and the second terminal on the second surface of the base substrate and spaced apart from the first terminal and the second terminal; and electrostatic discharge (ESD)-preventing members connecting the first terminal and the third terminal to each other and connecting the second terminal and the third terminal to each other.

3. 发明授权

US09870849B2 Chip resistor and mounting structure thereof 有权
公开(公告)号：US09870849B2
公开(公告)日：2018-01-16
申请号：US15069167
申请日：2016-03-14
申请人： ROHM CO., LTD.
发明人： Masaki Yoneda
IPC分类号： H01C1/012
CPC分类号： H01C1/012
摘要： A chip resistor includes a resistor board, a first electrode, a second electrode and an insulating layer. The second electrode is offset from the first electrode in a lateral direction perpendicular to the thickness direction of the resistor board. The obverse surface of the resistor board includes a first region in contact with the first electrode, a second region in contact with the second electrode and an intermediate region in contact with the insulating layer. The intermediate region is disposed between the first region and the second region in the lateral direction. The first electrode includes a first underlying layer and a first plating layer. The first underlying layer is disposed between the first plating layer and the insulating layer in the thickness direction of the resistor board.

4. 发明授权

US09668348B2 Multi-terminal electronic component, method of manufacturing the same, and board having the same 有权
公开(公告)号：US09668348B2
公开(公告)日：2017-05-30
申请号：US14672040
申请日：2015-03-27
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Jae Hoon Lee , Jung Min Nam , Young Key Kim , Hae In Kim
IPC分类号： H01C1/012 , H05K1/18 , H01C1/142 , H05K1/11
CPC分类号： H05K1/181 , H01C1/012 , H01C1/142 , H05K1/111 , H05K2201/10022 , H05K2201/10636 , Y02P70/611
摘要： A multi-terminal electronic component includes: a base material; a resistance layer disposed on a surface of the base material; a first terminal and a second terminal disposed to be spaced apart from each other while covering portions of the resistance layer, respectively; and a third terminal disposed between the first terminal and the second terminal and covering a portion of the resistance layer, wherein first and second side surfaces of the base material opposing each other are exposed from the first through third terminals.

5. 发明申请

US20170084364A1 Chip Resistor and Method for Manufacturing Same 审中-公开
公开(公告)号：US20170084364A1
公开(公告)日：2017-03-23
申请号：US15126199
申请日：2015-03-11
申请人： KOA Corporation
发明人： Kentaro MATSUMOTO
IPC分类号： H01C1/148 , H01C17/242 , H01C1/012 , H01C17/00
CPC分类号： H01C1/148 , H01C1/012 , H01C1/12 , H01C1/14 , H01C7/00 , H01C17/006 , H01C17/06 , H01C17/242
摘要： Provided are: a chip resistor whose resistance value can be adjusted with high accuracy while maintaining high sulfurization resistance of electrodes of the chip resistor even in the case where the resistance value of the chip resistor is low; and a method for manufacturing this chip resistor. This chip resistor (1) includes: an insulating film that covers a resistor substance (4) formed so as to make contact with both of a pair of electrodes (3, 3) formed on an upper surface (2A) of an insulating substrate (2). Each of the pair of electrodes (3, 3) includes: (1) a main electrode layer (3B) that contains silver as a main metal component and 10 weight % or more of palladium as another metal component, and an auxiliary electrode layer (3A) that is lower in specific resistance than the main electrode layer (3B); (2) a laminate part where the auxiliary electrode layer (3A) and the main electrode layer (3B) are sequentially laminated in this order on a single surface of the insulating substrate (2); and (3) an exposed part (3A1) of the auxiliary electrode layer (3A) where a part of the auxiliary electrode layer (3A) is not covered with the main electrode layer (3B) on a far side from the resistor substance (4), and parts (3B1) that extend from a near side to the far side with respect to the resistor substance (4).

6. 发明申请

US20160268050A1 COMPOSITE ELECTRONIC COMPONENT AND RESISTOR 审中-公开
标题翻译：复合电子元件和电阻器
公开(公告)号：US20160268050A1
公开(公告)日：2016-09-15
申请号：US15042236
申请日：2016-02-12
申请人： Murata Manufacturing Co., Ltd.
发明人： Kazuo HATTORI , Isamu FUJIMOTO , Shinichiro KUROIWA
IPC分类号： H01G4/40 , H01C1/14 , H01C1/012 , H05K1/18
CPC分类号： H01G4/40 , H01C1/012 , H01C1/14 , H05K1/181 , H05K2201/10015 , H05K2201/10022 , H05K2201/1053 , H05K2201/10636 , Y02P70/611
摘要： A composite electronic component includes a capacitor and a resistor stacked in a height direction. The capacitor includes a capacitor body, and first and second external electrodes. The resistor includes a base portion, a resistor, first and second upper surface conductors, first and second lower surface conductors, first connecting conductors, and second connecting conductors. An upper surface of the base portion of the resistor faces a lower surface of the capacitor body of the capacitor, and the first upper surface conductor and the first external electrode are electrically connected, and the second upper surface conductor and the second external electrode are electrically connected.
摘要翻译：复合电子部件包括在高度方向上堆叠的电容器和电阻器。电容器包括电容器主体，以及第一和第二外部电极。电阻器包括基部，电阻器，第一和第二上表面导体，第一和第二下表面导体，第一连接导体和第二连接导体。电阻器的基部的上表面面对电容器的电容器主体的下表面，并且第一上表面导体和第一外部电极电连接，第二上表面导体和第二外部电极是电气的连接的。

7. 发明申请

US20160163432A1 THERMALLY SPRAYED THIN FILM RESISTOR AND METHOD OF MAKING 有权
标题翻译：热喷涂薄膜电阻和制作方法
公开(公告)号：US20160163432A1
公开(公告)日：2016-06-09
申请号：US14563560
申请日：2014-12-08
申请人： Vishay Dale Electronics, Inc.
发明人： Tom J. Martin , Clark Smith , Jeff Traikoff
IPC分类号： H01C17/075 , H01C1/012 , H01C1/14 , H01C7/00
CPC分类号： H01C17/075 , H01C1/012 , H01C1/142 , H01C7/006 , H01C17/283
摘要： A thin film resistor formed using thermal spraying techniques in the manufacturing process is provided. A thin film resistor and method of manufacturing a thin film resistor are disclosed including a thermally sprayed resistive element. An alloy bond layer may be applied to a substrate and a thermally sprayed resistive layer is applied to the alloy bond layer by a thermal spraying process to form a thermally sprayed resistive element. The alloy bond layer and the thermally sprayed resistive layer may have the same chemical composition.
摘要翻译：提供了一种在制造过程中使用热喷涂技术形成的薄膜电阻器。公开了一种薄膜电阻器和制造薄膜电阻器的方法，其包括热喷涂电阻元件。可以将合金接合层施加到基板上，并且通过热喷涂工艺将热喷涂电阻层施加到合金接合层，以形成热喷涂电阻元件。合金接合层和热喷涂电阻层可以具有相同的化学组成。

8. 发明授权

US09305685B2 Chip resistor and mounting structure thereof 有权
标题翻译：芯片电阻及其安装结构
公开(公告)号：US09305685B2
公开(公告)日：2016-04-05
申请号：US14323633
申请日：2014-07-03
申请人： ROHM CO., LTD.
发明人： Masaki Yoneda
IPC分类号： H01C1/012
CPC分类号： H01C1/012
摘要： A chip resistor includes a resistor board, a first electrode, a second electrode and an insulating layer. The second electrode is offset from the first electrode in a lateral direction perpendicular to the thickness direction of the resistor board. The obverse surface of the resistor board includes a first region in contact with the first electrode, a second region in contact with the second electrode and an intermediate region in contact with the insulating layer. The intermediate region is disposed between the first region and the second region in the lateral direction. The first electrode includes a first underlying layer and a first plating layer. The first underlying layer is disposed between the first plating layer and the insulating layer in the thickness direction of the resistor board.
摘要翻译：芯片电阻器包括电阻器板，第一电极，第二电极和绝缘层。第二电极在垂直于电阻器板的厚度方向的横向方向上偏离第一电极。电阻器基板的正面包括与第一电极接触的第一区域，与第二电极接触的第二区域和与绝缘层接触的中间区域。中间区域在横向方向上设置在第一区域和第二区域之间。第一电极包括第一下层和第一镀层。第一底层在电阻器板的厚度方向上设置在第一镀层和绝缘层之间。

9. 发明申请

US20150357097A1 CHIP RESISTOR 有权
标题翻译：芯片电阻
公开(公告)号：US20150357097A1
公开(公告)日：2015-12-10
申请号：US14298286
申请日：2014-06-06
申请人： YAGEO CORPORATION
发明人： DONG-MOU TSAI , TSAI-HU CHEN , SHENG-LI HSIAO , YUNG-HAN LIU , JEN-FU HO
IPC分类号： H01C1/142 , H01C1/012
CPC分类号： H01C1/142 , H01C1/012 , H01C1/028 , H01C7/003 , H01C17/006
摘要： The disclosure provides a chip resistor including: a substrate, two first electrodes, two second electrodes, a resistive layer, at least one protection layer and at least one coating layer. The protection layer covers part of the two first electrodes, and includes at least two overlay sides and at least one overlay plane. The coating layer covers the at least two overlay sides, the at least one overlay plane, and part of the two first electrodes and the two second electrodes. The chip resistor uses the two overlay sides and the overplay plane to extend a distance between the two first electrodes and the outside. Therefore, it is difficult for the airborne sulfur, sulfides and sulfur-containing compounds to enter and react with the two first electrodes. Thus, the chip resistor can resist corrosion of harmful substances such as sulfur, sulfides and sulfur-containing compounds or halogens on the electrodes.
摘要翻译：本公开提供一种片式电阻器，包括：衬底，两个第一电极，两个第二电极，电阻层，至少一个保护层和至少一个涂层。保护层覆盖两个第一电极的一部分，并且包括至少两个覆盖面和至少一个覆盖平面。涂层覆盖至少两个覆盖面，至少一个覆盖平面以及两个第一电极和两个第二电极的一部分。芯片电阻器使用两个覆盖层和超平面来延伸两个第一电极和外部之间的距离。因此，空气中的硫，硫化物和含硫化合物难以进入并与两个第一电极反应。因此，芯片电阻器可以抵抗有害物质如硫，硫化物和含硫化合物或卤素在电极上的腐蚀。

10. 发明授权

US08456273B2 Chip resistor device and a method for making the same 有权
标题翻译：片式电阻器件及其制造方法
公开(公告)号：US08456273B2
公开(公告)日：2013-06-04
申请号：US13226094
申请日：2011-09-06
申请人： Full Chen
发明人： Full Chen
IPC分类号： H01C1/012
CPC分类号： H01C1/012 , H01C1/08 , H01C17/006 , H01C17/06 , Y10T29/49082
摘要： A chip resistor device includes: a dielectric substrate that has top and bottom surfaces and two opposite edge faces interconnecting the top and bottom surfaces; two electrodes that are formed on two opposite sides of the dielectric substrate and that cover the edge faces and parts of the top and bottom surfaces; a resistor layer that is formed on one of the top and bottom surfaces of the dielectric substrate between the electrodes and that is brought into contact with the electrodes; and a heat conductive layer that is disposed on the resistor layer oppositely of the dielectric substrate and between the electrodes, that contacts the resistor layer and the two electrodes, and that has a higher resistance than that of the resistor layer. A method for making the chip resistor device is also disclosed.
摘要翻译：芯片电阻器件包括：电介质基片，其具有顶表面和底表面以及互连顶表面和底表面的两个相对的边缘面; 两个电极，形成在电介质基片的两个相对的两侧，并覆盖顶面和底面的边缘面和部分; 电阻层，其形成在所述电介质基板的所述顶表面和所述底表面之一之间，并且与所述电极接触; 以及导电层，其设置在与电介质基板相反的电阻层上，并且在电极之间，与电阻层和两个电极接触，并且具有比电阻层更高的电阻。还公开了制造芯片电阻器件的方法。

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