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    • 3. 发明申请
    • Exposure method and electronic device manufacturing method
    • 曝光方法和电子元件制造方法
    • US20090042139A1
    • 2009-02-12
    • US12071911
    • 2008-02-27
    • Naomasa ShiraishiHideya Inoue
    • Naomasa ShiraishiHideya Inoue
    • G03F7/20
    • G03F7/70783G03F7/70266G03F7/703G03F7/70425G03F7/70633G03F9/7003G03F9/7084G03F9/7088H01L23/544H01L2223/54453H01L2223/5446H01L2223/5448H01L2924/0002H01L2924/00
    • An exposure method enabling deformation occurring in a unit exposure field to be measured rapidly and accurately and enabling a plurality of patterns to be superimposed on a substrate with high accuracy. The exposure method of the present embodiment for exposing a bright-dark pattern on the substrate using a projection optical system includes a position detection process for detecting the positions of a plurality of position detection marks, relative to a substrate-in-plane-direction of the substrate, arranged in at least one functional element in a unit exposure field of the substrate, a deformation calculation process for calculating the state of deformation occurring in the unit exposure field based on information related to the positions of the position detection marks obtained in the position detection process, and a shape modification process for modifying the shape of the bright-dark pattern to be exposed on the substrate based on the deformation state obtained in the deformation calculation process.
    • 能够快速,准确地测量在单位曝光场中发生变形的曝光方法,能够将多个图案高精度地叠加在基板上。 使用投影光学系统在基板上曝光明暗图案的本实施例的曝光方法包括:位置检测处理,用于检测多个位置检测标记相对于基板的平面方向的位置 基板,布置在基板的单位曝光区域中的至少一个功能元件中,基于与在所述基板中获得的位置检测标记的位置相关的信息来计算在单位曝光区域中发生的变形状态的变形计算处理 位置检测处理,以及用于基于在变形计算处理中获得的变形状态来修改要暴露在基板上的亮暗图案的形状的形状修改处理。