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    • 3. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08772881B2
    • 2014-07-08
    • US12794088
    • 2010-06-04
    • Fujio MasuokaHiroki Nakamura
    • Fujio MasuokaHiroki Nakamura
    • H01L27/11H01L27/088
    • H01L27/1104H01L27/0207H01L27/11
    • The object to provide a highly-integrated SGT-based SRAM is achieved by forming an SRAM using an inverter which comprises a first island-shaped semiconductor layer, a first gate dielectric film in contact with a periphery of the first island-shaped semiconductor layer, a first gate electrode having one surface in contact with the first gate dielectric film, a second gate dielectric film in contact with another surface of the first gate electrode, a first arc-shaped semiconductor layer in contact with the second gate dielectric film, a first first-conductive-type high-concentration semiconductor layer arranged on a top of the first island-shaped semiconductor layer, a second first-conductive-type high-concentration semiconductor layer arranged underneath the first island-shaped semiconductor layer, a first second-conductive-type high-concentration semiconductor layer arranged on a top of the first arc-shaped semiconductor layer, and a second second-conductive-type high-concentration semiconductor layer arranged underneath the first arc-shaped semiconductor layer.
    • 提供高度集成的基于SGT的SRAM的目的是通过使用逆变器形成SRAM来实现,该逆变器包括第一岛状半导体层,与第一岛状半导体层的周边接触的第一栅极电介质膜, 具有与第一栅极电介质膜接触的一个表面的第一栅极电极,与第一栅电极的另一表面接触的第二栅极电介质膜,与第二栅极电介质膜接触的第一弧形半导体层,第一栅极电极 布置在第一岛状半导体层的顶部上的第一导电型高浓度半导体层,布置在第一岛状半导体层下方的第二第一导电型高浓度半导体层,第一导电型高浓度半导体层,第一导电型高浓度半导体层, 布置在第一弧形半导体层的顶部上的高浓度半导体层和第二第二导电型高浓度半导体层 所述半导体层布置在所述第一弧形半导体层下方。
    • 5. 发明授权
    • Semiconductor device and method of producing the same
    • 半导体装置及其制造方法
    • US08395208B2
    • 2013-03-12
    • US13478359
    • 2012-05-23
    • Fujio MasuokaShintaro AraiHiroki NakamuraTomohiko Kudo
    • Fujio MasuokaShintaro AraiHiroki NakamuraTomohiko Kudo
    • H01L29/94H01L29/76H01L31/062H01L31/119H01L31/113
    • H01L29/78642H01L29/42392H01L29/66772
    • It is an object to provide an SGT production method capable of obtaining a structure for reducing a resistance of a gate, a desired gate length, desired source and drain configurations and a desired diameter of a pillar-shaped semiconductor. The object is achieved by a semiconductor device production method which comprises the steps of: forming a pillar-shaped first-conductive-type semiconductor layer; forming a second-conductive-type semiconductor layer underneath the pillar-shaped first-conductive-type semiconductor layer; forming a gate dielectric film and a gate electrode around the pillar-shaped first-conductive-type semiconductor layer; forming a sidewall-shaped dielectric film on an upper region of a sidewall of the pillar-shaped first-conductive-type semiconductor layer and in contact with a top of the gate; forming a sidewall-shaped dielectric film on a sidewall of the gate; and forming a second-conductive-type semiconductor layer in an upper portion of the pillar-shaped first-conductive-type semiconductor layer and on the second-conductive-type semiconductor layer formed underneath the pillar-shaped first-conductive-type semiconductor layer.
    • 本发明的目的是提供一种能够获得用于降低栅极的电阻,期望的栅极长度,期望的源极和漏极配置以及柱状半导体的期望直径的结构的SGT制造方法。 该目的通过一种半导体器件制造方法来实现,该方法包括以下步骤:形成柱状的第一导电型半导体层; 在所述柱状第一导电型半导体层的下方形成第二导电型半导体层; 在柱状第一导电型半导体层周围形成栅极电介质膜和栅电极; 在所述柱状第一导电型半导体层的侧壁的上部区域上形成与所述栅极的顶部接触的侧壁状的电介质膜; 在所述浇口的侧壁上形成侧壁状的电介质膜; 以及在柱状第一导电型半导体层的上部和形成在柱状的第一导电型半导体层下方的第二导电型半导体层上形成第二导电型半导体层。
    • 6. 发明授权
    • Nonvolatile semiconductor memory transistor and method for manufacturing nonvolatile semiconductor memory
    • 非易失性半导体存储晶体管及其制造方法
    • US08349688B2
    • 2013-01-08
    • US13178315
    • 2011-07-07
    • Fujio MasuokaHiroki Nakamura
    • Fujio MasuokaHiroki Nakamura
    • H01L21/336H01L29/788
    • H01L29/7889H01L21/28273H01L27/11521
    • A nonvolatile semiconductor memory transistor includes an island-shaped semiconductor having a source region, a channel region, and a drain region formed in this order from the Si substrate side, a floating gate surrounding the outer periphery of the channel region with a tunnel insulating film interposed therebetween, a control gate surrounding the outer periphery of the floating gate with an inter-polysilicon insulating film interposed therebetween, and a control gate line connected to the control gate and extending in a predetermined direction. The floating gate extends to regions below and above the control gate and to a region below the control gate line. The inter-polysilicon insulating film is interposed between the floating gate and the upper surface, lower surface, and inner side surface of the control gate and between the control gate line and a portion of the floating gate that extends to the region below the control gate line.
    • 非易失性半导体存储晶体管包括岛状半导体,其具有从Si衬底侧依次形成的源极区,沟道区和漏极区,围绕沟道区的外周的浮栅与隧道绝缘膜 插入其间的控制栅极,其间隔着多晶硅间绝缘膜围绕浮置栅极的外周,以及连接到控制栅极并沿预定方向延伸的控制栅极线。 浮栅延伸到控制栅极下方和上方的区域以及控制栅极线下方的区域。 多晶硅间绝缘膜介于浮动栅极与控制栅极的上表面,下表面和内侧表面之间,以及控制栅极线与延伸到控制栅极下方区域的浮栅的一部分之间 线。
    • 10. 发明授权
    • Semiconductor surrounding gate transistor device and production method therefor
    • 半导体周边栅晶体管器件及其制作方法
    • US08241976B2
    • 2012-08-14
    • US12704000
    • 2010-02-11
    • Fujio MasuokaTomohiko KudoShintaro AraiHiroki Nakamura
    • Fujio MasuokaTomohiko KudoShintaro AraiHiroki Nakamura
    • H01L21/8232
    • H01L29/78642H01L22/26
    • The method includes the steps of: forming a planar semiconductor layer on an oxide film formed on a substrate and then forming a pillar-shaped first-conductive-type semiconductor layer on the planar semiconductor layer; forming a second-conductive-type semiconductor layer in a portion of the planar semiconductor layer underneath the pillar-shaped first-conductive-type semiconductor layer; forming a gate dielectric film and a gate electrode made of a metal, around the pillar-shaped first-conductive-type semiconductor layer; forming a sidewall-shaped dielectric film on an upper region of a sidewall of the pillar-shaped first-conductive-type semiconductor layer and in contact with a top of the gate electrode; forming a sidewall-shaped dielectric film on a sidewall of the gate electrode; forming a second-conductive-type semiconductor layer in an upper portion of the pillar-shaped first-conductive-type semiconductor layer.
    • 该方法包括以下步骤:在形成在基板上的氧化膜上形成平面半导体层,然后在平面半导体层上形成柱状的第一导电型半导体层; 在所述柱状第一导电型半导体层的下方的所述平面状半导体层的一部分中形成第二导电型半导体层; 在柱状的第一导电型半导体层周围形成栅极电介质膜和由金属制成的栅电极; 在所述柱状第一导电型半导体层的侧壁的上部区域上形成与所述栅电极的顶部接触的侧壁状的电介质膜; 在所述栅电极的侧壁上形成侧壁状电介质膜; 在柱状第一导电型半导体层的上部形成第二导电型半导体层。