专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US08007627B2 Electronic component mounting method and apparatus 失效
标题翻译：电子元件安装方法和装置
公开(公告)号：US08007627B2
公开(公告)日：2011-08-30
申请号：US11064122
申请日：2005-02-23
申请人： Kazuto Nishida , Hidenobu Nishikawa , Yoshinori Wada , Hiroyuki Otani
发明人： Kazuto Nishida , Hidenobu Nishikawa , Yoshinori Wada , Hiroyuki Otani
IPC分类号： B32B37/00 , B29C65/00
CPC分类号： H01L24/31 , H01L21/563 , H01L23/295 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/05624 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/16225 , H01L2224/29082 , H01L2224/29083 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29344 , H01L2224/2949 , H01L2224/29499 , H01L2224/32225 , H01L2224/45144 , H01L2224/48624 , H01L2224/73104 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/78301 , H01L2224/81048 , H01L2224/81191 , H01L2224/81801 , H01L2224/81903 , H01L2224/83048 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/83851 , H01L2224/83856 , H01L2224/9211 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2924/3511 , H05K3/323 , Y10T29/4913 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip is corrected and the board is connected, the bumps are compressed, and the insulating resin is hardened.
摘要翻译：芯片通过在位置凸块与板电极之间对准而在电路板上粘合，在芯片和电路板之间插入各向异性导电层。各向异性导电层是绝缘树脂，导电颗粒和无机填料的混合物。利用工具，以每个凸起不超过20gf的压力将该芯片压靠在板上，同时校正芯片的翘曲并且板被连接，凸块被压缩，并且绝缘树脂硬化。

2. 发明授权

US07060528B2 Method for mounting a semiconductor element to an interposer by compression bonding 失效
标题翻译：通过压接法将半导体元件安装到插入件的方法
公开(公告)号：US07060528B2
公开(公告)日：2006-06-13
申请号：US10253604
申请日：2002-09-25
申请人： Hidenobu Nishikawa , Kazuto Nishida , Kazumichi Shimizu , Hiroyuki Otani
发明人： Hidenobu Nishikawa , Kazuto Nishida , Kazumichi Shimizu , Hiroyuki Otani
IPC分类号： H01L21/48
CPC分类号： H01L24/742 , H01L21/563 , H01L23/544 , H01L24/11 , H01L24/27 , H01L24/29 , H01L24/31 , H01L24/83 , H01L24/90 , H01L24/94 , H01L25/50 , H01L2223/54406 , H01L2223/54413 , H01L2223/54426 , H01L2223/5448 , H01L2224/05571 , H01L2224/05573 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/16145 , H01L2224/16225 , H01L2224/274 , H01L2224/2919 , H01L2224/45144 , H01L2224/73104 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/83855 , H01L2224/83856 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01027 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0665 , H01L2924/0781 , H01L2924/14 , H01L2924/00 , H01L2924/3512 , H01L2224/05599
摘要： A semiconductor element mounting method is provided with high productivity. The method includes forming bumps on electrodes of a wafer in which a plurality of semiconductor elements have been formed, temporarily compression-bonding the wafer and an interposer via an insulative resin, curing the resin by performing heating and pressurization so that the wafer and the interposer are finally compression-bonded, wherein the electrodes of the wafer and electrodes of the interposer are bonded to each other, respectively, and wherein insulative resin overflowing from between the wafer and the interposer flows into grooves disposed so as to be coincident with dicing lines of the wafer, thus providing a uniform flow of the insulative resin, and thereafter, cutting and separating this bonded unit into individual semiconductor elements.
摘要翻译：提供了高生产率的半导体元件安装方法。该方法包括在其上形成有多个半导体元件的晶片的电极上形成凸块，通过绝缘树脂临时压接晶片和插入件，通过进行加热和加压来固化树脂，使得晶片和插入件最后压接，其中晶片的电极和插入器的电极分别相互粘合，并且其中从晶片和插入件之间溢出的绝缘树脂流入设置为与切割线重合的槽晶片，从而提供均匀的绝缘树脂流动，然后将该结合单元切割并分离成单独的半导体元件。

3. 发明申请

US20050155706A1 Electronic component mounting method and apparatus 失效
标题翻译：电子元件安装方法和装置
公开(公告)号：US20050155706A1
公开(公告)日：2005-07-21
申请号：US11064122
申请日：2005-02-23
申请人： Kazuto Nishida , Hidenobu Nishikawa , Yoshinori Wada , Hiroyuki Otani
发明人： Kazuto Nishida , Hidenobu Nishikawa , Yoshinori Wada , Hiroyuki Otani
IPC分类号： H01L21/60 , H05K3/32 , C09J5/00 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/31 , H01L21/563 , H01L23/295 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/05624 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/16225 , H01L2224/29082 , H01L2224/29083 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29344 , H01L2224/2949 , H01L2224/29499 , H01L2224/32225 , H01L2224/45144 , H01L2224/48624 , H01L2224/73104 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/78301 , H01L2224/81048 , H01L2224/81191 , H01L2224/81801 , H01L2224/81903 , H01L2224/83048 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/83851 , H01L2224/83856 , H01L2224/9211 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2924/3511 , H05K3/323 , Y10T29/4913 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is connected, the bumps are compressed, and the insulating resin is hardened.
摘要翻译：芯片通过在位置凸块与板电极之间对准而在电路板上粘合，在芯片和电路板之间插入各向异性导电层。各向异性导电层是绝缘树脂，导电颗粒和无机填料的混合物。利用工具，以每个凸起不小于20gf的压力将芯片压在板上，同时连接芯片和板的翘曲，凸起被压缩，绝缘树脂硬化。

4. 发明授权

US06651320B1 Method for mounting semiconductor element to circuit board 失效
标题翻译：将半导体元件安装到电路板的方法
公开(公告)号：US06651320B1
公开(公告)日：2003-11-25
申请号：US09509693
申请日：2000-03-20
申请人： Yoshihiko Yagi , Hiroyuki Otani
发明人： Yoshihiko Yagi , Hiroyuki Otani
IPC分类号： H05K334
CPC分类号： H01L24/29 , H01L21/563 , H01L23/3121 , H01L23/3135 , H01L24/11 , H01L24/13 , H01L24/32 , H01L2224/11 , H01L2224/1134 , H01L2224/11822 , H01L2224/13 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1329 , H01L2224/133 , H01L2224/16225 , H01L2224/29007 , H01L2224/32225 , H01L2224/45144 , H01L2224/73103 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/83102 , H01L2224/83104 , H01L2224/83191 , H01L2224/83192 , H01L2224/92125 , H01L2224/92225 , H01L2924/00013 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/07802 , H01L2924/3511 , H05K3/305 , H05K3/321 , H05K13/0469 , H05K2201/0125 , H05K2201/0187 , H05K2201/10674 , H05K2201/10977 , Y02P70/613 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49149 , Y10T29/49171 , H01L2924/00014 , H01L2224/13099 , H01L2924/00 , H01L2924/3512 , H01L2924/00012
摘要： The present invention provides a method for mounting a semiconductor element to a circuit board and a semiconductor device whereby connection reliability and connection strength in bonding of the semiconductor element and circuit board are enhanced and a connection resistance value is stabilized low. An insulating adhesive is applied to an opposite face of a circuit board. The circuit board is then connected with a semiconductor element by a conductive adhesive and the insulating adhesive which are interposed between an electrode on the circuit board and the projecting electrode and set in the same process. The circuit board and semiconductor element are connected by the insulating adhesive in addition to the conductive adhesive, so that connection reliability and connection strength are high and a connection resistance value is stabilized low.
摘要翻译：本发明提供一种用于将半导体元件安装到电路板和半导体器件的方法，由此提高了半导体元件和电路板的接合的连接可靠性和连接强度，并且连接电阻值稳定在低。将绝缘粘合剂施加到电路板的相对面上。然后将电路板通过导电粘合剂和绝缘粘合剂与半导体元件连接，绝缘粘合剂介于电路板上的电极和突出电极之间，并以相同的工艺设置。电路板和半导体元件除了导电粘合剂之外还通过绝缘粘合剂连接，使得连接可靠性和连接强度高，并且连接电阻值稳定在低。

5. 发明授权

US06453811B1 Printing method and printing apparatus 失效
标题翻译：印刷方法和印刷装置
公开(公告)号：US06453811B1
公开(公告)日：2002-09-24
申请号：US09650725
申请日：2000-08-30
申请人： Takaaki Higashida , Hiroyuki Otani , Takahiko Iwaki
发明人： Takaaki Higashida , Hiroyuki Otani , Takahiko Iwaki
IPC分类号： B41F1544
CPC分类号： H05K3/1233 , B41F15/0818 , B41F15/40 , H05K3/3484 , H05K3/4069 , H05K2201/10151 , H05K2203/0139 , H05K2203/0783 , H05K2203/1105 , H05K2203/163
摘要： Regarding filling of a paste, a temperature gradient at a paste-pressing face is managed by a heater incorporated in a filling head. Alternatively, a nonvolatile component is applied to a printing face of a base material before the paste is filled, thereby preventing a volatile component of the paste from evaporating with time. Viscosity of the paste is thus maintained. Meanwhile, a change of the quantity of the paste is coped with by changing a moving speed of the filling head or a contact angle of the filling head to the printing face, or by supporting the filling head at the side in touch with the printing face.
摘要翻译：关于糊料的填充，通过加入到灌装头中的加热器来管理糊压按压面的温度梯度。或者，在填充糊料之前，将非挥发性成分施加到基材的印刷面上，由此防止糊剂的挥发性成分随时间蒸发。因此保持糊状物的粘度。同时，通过改变填充头的移动速度或填充头与打印面的接触角，或者通过将填充头支撑在与印刷面接触的一侧来处理浆料的量的改变。

6. 发明申请

US20070013067A1 Electronic component mounting method and apparatus 失效
标题翻译：电子元件安装方法和装置
公开(公告)号：US20070013067A1
公开(公告)日：2007-01-18
申请号：US11527461
申请日：2006-09-27
申请人： Kazuto Nishida , Hidenobu Nishikawa , Yoshinori Wada , Hiroyuki Otani
发明人： Kazuto Nishida , Hidenobu Nishikawa , Yoshinori Wada , Hiroyuki Otani
IPC分类号： H01L23/48 , H01L21/44
CPC分类号： H01L24/27 , H01L21/563 , H01L23/295 , H01L24/29 , H01L24/31 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/05568 , H01L2224/05571 , H01L2224/05624 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13023 , H01L2224/13099 , H01L2224/13118 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/29082 , H01L2224/29083 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/29399 , H01L2224/29499 , H01L2224/32225 , H01L2224/45 , H01L2224/45118 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48 , H01L2224/48624 , H01L2224/48824 , H01L2224/73104 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/78301 , H01L2224/81191 , H01L2224/81801 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83851 , H01L2224/83856 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/09701 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2924/3511 , H05K3/323 , H01L2924/00 , H01L2224/05552 , H01L2924/00014 , H01L2924/00012
摘要： A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is connected, the bumps are compressed, and the insulating resin is hardened.
摘要翻译：芯片通过在位置凸块与板电极之间对准而在电路板上粘合，在芯片和电路板之间插入各向异性导电层。各向异性导电层是绝缘树脂，导电颗粒和无机填料的混合物。利用工具，以每个凸起不小于20gf的压力将芯片压在板上，同时连接芯片和板的翘曲，凸起被压缩，绝缘树脂硬化。

7. 发明申请

US20050278489A1 Storage device, control method for partitioning logical memory devices, and medium embodying program for partitioning logical memory devices 失效
标题翻译：存储设备，用于分区逻辑存储器设备的控制方法以及体现用于分区逻辑存储器设备的程序的介质
公开(公告)号：US20050278489A1
公开(公告)日：2005-12-15
申请号：US11122101
申请日：2005-05-05
申请人： Hiroyuki Otani
发明人： Hiroyuki Otani
IPC分类号： G06F3/06 , G06F12/00
CPC分类号： G06F3/0644 , G06F3/0614 , G06F3/0689
摘要： A storage device which limits the partition of the logical memory devices for computers in accordance with the condition of partition which was defined to the properties such as reliability and the storage device so that the logical memory devices are unable to be utilized for uses other than objectives, a control method for partitioning the logical memory devices of the storage device and a control program product for partitioning the logical memory devices of the storage device. An access control means approves an access only to the logical memory device which was partitioned referring to an access control table. An access control setting means renews the access control table so as to partition the assigned logical memory devices to the assigned computer when the assigned logical memory devices can be partitioned. A utilization condition setting means determines the partition propriety of the logical memory device based the content of the partition condition defining table including a pair of the property condition which is the origin of judging whether the logical memory device can be partitioned or not and the partition propriety information of showing the propriety of partition to the computer and the content of the property table including a pair of the logical memory device ID and the property information of the corresponding logical memory device, and renews the partition management table.
摘要翻译：根据对诸如可靠性和存储设备等属性定义的分区条件，限制用于计算机的逻辑存储设备的分区的存储设备，使得逻辑存储器设备不能用于除目标之外的用途，用于划分存储装置的逻辑存储装置的控制方法和用于划分存储装置的逻辑存储装置的控制程序产品。访问控制装置仅批准对参考访问控制表进行分区的逻辑存储设备的访问。访问控制设置装置更新访问控制表，以便当分配的逻辑存储器设备可以被分区时，将分配的逻辑存储器设备分配给分配的计算机。利用条件设置装置根据分区条件定义表的内容确定逻辑存储装置的分区合理性，该内容包括作为判断逻辑存储装置是否可分割的原点的属性条件对以及分区正确性显示分配给计算机的适当性的信息和属性表的内容，包括一对逻辑存储器设备ID和对应的逻辑存储设备的属性信息，并更新分区管理表。

8. 发明授权

US06926796B1 Electronic parts mounting method and device therefor 失效
标题翻译：电子零件安装方法及其装置
公开(公告)号：US06926796B1
公开(公告)日：2005-08-09
申请号：US09890066
申请日：2000-01-26
申请人： Kazuto Nishida , Hidenobu Nishikawa , Yoshinori Wada , Hiroyuki Otani
发明人： Kazuto Nishida , Hidenobu Nishikawa , Yoshinori Wada , Hiroyuki Otani
IPC分类号： H01L21/60 , H05K3/32
CPC分类号： H01L24/31 , H01L21/563 , H01L23/295 , H01L24/11 , H01L24/13 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/48 , H01L24/81 , H01L24/83 , H01L2224/0401 , H01L2224/05624 , H01L2224/11 , H01L2224/1134 , H01L2224/13 , H01L2224/13099 , H01L2224/13124 , H01L2224/13144 , H01L2224/16225 , H01L2224/29082 , H01L2224/29083 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29344 , H01L2224/2949 , H01L2224/29499 , H01L2224/32225 , H01L2224/45144 , H01L2224/48624 , H01L2224/73104 , H01L2224/73204 , H01L2224/75 , H01L2224/75251 , H01L2224/75252 , H01L2224/78301 , H01L2224/81048 , H01L2224/81191 , H01L2224/81801 , H01L2224/81903 , H01L2224/83048 , H01L2224/83101 , H01L2224/83191 , H01L2224/83192 , H01L2224/83194 , H01L2224/83851 , H01L2224/83856 , H01L2224/9211 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01018 , H01L2924/01022 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/14 , H01L2924/181 , H01L2924/3011 , H01L2924/3511 , H05K3/323 , Y10T29/4913 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A chip is bonded on a circuit board by aligning in position bumps with board electrodes with interposition of an anisotropic conductive layer between the chip and the circuit board. The anisotropic conductive layer is a mixture of an insulating resin, conductive particles and an inorganic filler. The chip is pressed against the board with a pressure force of not smaller than 20 gf per bump by virtue of a tool, while warp of the chip and the board is corrected, the bumps are compressed, and the insulating resin is hardened.
摘要翻译：芯片通过在位置凸块与板电极之间对准而在电路板上粘合，在芯片和电路板之间插入各向异性导电层。各向异性导电层是绝缘树脂，导电颗粒和无机填料的混合物。利用工具，以每个凸起不超过20gf的压力将芯片压靠在板上，同时校正芯片和板的翘曲，凸块被压缩，绝缘树脂硬化。

9. 发明申请

US20050146029A1 Semiconductor element having protruded bump electrodes 失效
公开(公告)号：US20050146029A1
公开(公告)日：2005-07-07
申请号：US11073714
申请日：2005-03-08
申请人： Kazushi Higashi , Norihito Tsukahara , Takahiro Yonezawa , Yoshihiko Yagi , Yoshifumi Kitayama , Hiroyuki Otani
发明人： Kazushi Higashi , Norihito Tsukahara , Takahiro Yonezawa , Yoshihiko Yagi , Yoshifumi Kitayama , Hiroyuki Otani
IPC分类号： H01L21/60 , H01L23/485 , H01L21/44 , H01L23/52
CPC分类号： H01L24/78 , H01L24/11 , H01L24/13 , H01L2224/11003 , H01L2224/1134 , H01L2224/11822 , H01L2224/13017 , H01L2224/13018 , H01L2224/13019 , H01L2224/13082 , H01L2224/131 , H01L2224/13124 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1329 , H01L2224/133 , H01L2224/16225 , H01L2224/45015 , H01L2224/451 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45155 , H01L2224/78303 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/14 , Y10T29/49179 , Y10T29/49181 , H01L2224/13099 , H01L2224/48 , H01L2924/00 , H01L2924/20752 , H01L2924/00015 , H01L2924/00012 , H01L2224/05599 , H01L2224/85399
摘要： A method of forming a bump electrode on an IC electrode includes the steps of forming a ball bond on an IC electrode by a wire bonding apparatus, moving a bonding capillary upward, moving the bonding capillary sideways and then downward, bonding an Au wire to the ball bond portion, and cutting the Au wire. The Au wire is prevented from coming in contact with portions around the ball bond portion other than the ball bond portion by presetting a descent position of the bonding capillary to a position higher than a position in which the ball bond is formed.

10. 发明授权

US06825055B2 Method for assembling integral type electronic component and integral type electronic component 失效
标题翻译：集成型电子元件和整体式电子元器件的组装方法
公开(公告)号：US06825055B2
公开(公告)日：2004-11-30
申请号：US09940876
申请日：2001-08-29
申请人： Kazushi Higashi , Hiroyuki Otani , Norihito Tsukahara
发明人： Kazushi Higashi , Hiroyuki Otani , Norihito Tsukahara
IPC分类号： H01L2100
CPC分类号： H01L25/50 , H01L2224/16 , H01L2924/00014 , H01L2924/09701 , H05K1/145 , H05K7/1061 , H05K13/0482 , H01L2224/0401
摘要： An integral type electronic component is formed of a first board and a second board by storing and holding electronic components to component storage parts of the first board and electrically connecting the second board to the electronic components. An arrangement accuracy of the electronic components is determined on the basis of an arrangement accuracy of the component storage parts, and the electronic components stored in the component storage parts are limited in motion. The electronic components can be arranged highly accurately and simply at low costs in a short time in comparison with the conventional art by being simply inserted to the component storage parts.
摘要翻译：整体式电子部件由第一基板和第二基板形成，通过将电子部件收容并保持在第一基板的部件收纳部上，将第二基板电连接到电子部件。电子部件的配置精度基于部件存储部的配置精度来确定，并且存储在部件存储部中的电子部件的运动受到限制。与传统技术相比，通过简单地插入到部件存储部件中，电子部件可以在短时间内以低成本高度精确和简单地布置。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式