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1. 发明授权

US07954541B2 Heat dissipation module 有权
标题翻译：散热模块
公开(公告)号：US07954541B2
公开(公告)日：2011-06-07
申请号：US12018602
申请日：2008-01-23
申请人： Feng-Ku Wang , Chih-Kai Yang , Huang-Cheng Ke , Yu-Chih Cheng , Cheng-Shang Chou
发明人： Feng-Ku Wang , Chih-Kai Yang , Huang-Cheng Ke , Yu-Chih Cheng , Cheng-Shang Chou
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation module for being assembled to a circuit board with a first heat-generating element and a second heat-generating element is provided. A heat generation rate of the first heat-generating element is higher than that of the second heat-generating element. The heat dissipation module includes a heat-transferring connection element, a cooling device, a first heat-transferring plate and a second heat-transferring plate. The heat-transferring connection element has a first part and a second part. The cooling device connects to the first part. The first heat-transferring plate is connected between the first heat-generating element and the second part. The second heat-transferring plate has a third part and a fourth part. The second part is connected between the first heat-transferring plate and the third part. The fourth part is connected to the second heat-generating element. The thermal conductivity of the first heat-transferring plate is higher than that of the second heat-transferring plate.
摘要翻译：提供了一种用于组装到具有第一发热元件和第二发热元件的电路板的散热模块。第一发热元件的发热量高于第二发热元件的发热量。散热模块包括传热连接元件，冷却装置，第一传热板和第二传热板。传热连接元件具有第一部分和第二部分。冷却装置连接到第一部分。第一传热板连接在第一发热元件和第二部件之间。第二传热板具有第三部分和第四部分。第二部分连接在第一传热板和第三部分之间。第四部分连接到第二发热元件。第一传热板的导热率高于第二传热板的热导率。

2. 发明申请

US20090056925A1 HEAT DISSIPATION MODULE 有权
标题翻译：散热模块
公开(公告)号：US20090056925A1
公开(公告)日：2009-03-05
申请号：US12018602
申请日：2008-01-23
申请人： Feng-Ku Wang , Chih-Kai Yang , Huang-Cheng Ke , Yu-Chih Cheng , Cheng-Shang Chou
发明人： Feng-Ku Wang , Chih-Kai Yang , Huang-Cheng Ke , Yu-Chih Cheng , Cheng-Shang Chou
IPC分类号： F28F3/02
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation module for being assembled to a circuit board with a first heat-generating element and a second heat-generating element is provided. A heat generation rate of the first heat-generating element is higher than that of the second heat-generating element. The heat dissipation module includes a heat-transferring connection element, a cooling device, a first heat-transferring plate and a second heat-transferring plate. The heat-transferring connection element has a first part and a second part. The cooling device connects to the first part. The first heat-transferring plate is connected between the first heat-generating element and the second part. The second heat-transferring plate has a third part and a fourth part. The second part is connected between the first heat-transferring plate and the third part. The fourth part is connected to the second heat-generating element. The thermal conductivity of the first heat-transferring plate is higher than that of the second heat-transferring plate.
摘要翻译：提供了一种用于组装到具有第一发热元件和第二发热元件的电路板的散热模块。第一发热元件的发热量高于第二发热元件的发热量。散热模块包括传热连接元件，冷却装置，第一传热板和第二传热板。传热连接元件具有第一部分和第二部分。冷却装置连接到第一部分。第一传热板连接在第一发热元件和第二部件之间。第二传热板具有第三部分和第四部分。第二部分连接在第一传热板和第三部分之间。第四部分连接到第二发热元件。第一传热板的导热率高于第二传热板的热导率。

3. 发明申请

US20080198550A1 HEAT SINK MODULE FOR DUAL HEAT SOURCES 失效
标题翻译：双热源热泵模块
公开(公告)号：US20080198550A1
公开(公告)日：2008-08-21
申请号：US11707511
申请日：2007-02-16
申请人： Feng-Ku Wang , Chih-Kai Yang , Huang-Cheng Ke
发明人： Feng-Ku Wang , Chih-Kai Yang , Huang-Cheng Ke
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heatsink module for dual heat sources for dissipating heat generated by a first and a second heat-generating element disposed on a circuit board is provided. The heatsink module includes a first heat-conducting plate, a second heat-conducting plate, a fixing member, a heat pipe, and a pressing flat spring. The first and second heat-conducting plates contact the first and second heat-generating elements respectively. The fixing member when fixed to the circuit board presses the second heat-conducting plate against the second heat-generating element. One end of the pressing flat spring is under the traction of the fixing member fixed to the circuit board, and presses the first heat-conducting plate against the first heat-generating element. The fixing member and the first heat-conducting plate then clamp the heat pipe, so as to conduct the heat generated by the first and second heat-generating elements to the heat pipe via the connecting elements.
摘要翻译：提供了用于散发由设置在电路板上的第一和第二发热元件产生的热量的双重热源的散热器模块。散热模块包括第一导热板，第二导热板，固定构件，热管和按压板簧。第一和第二导热板分别接触第一和第二发热元件。固定构件固定在电路板上时，将第二导热板压在第二发热元件上。按压平板弹簧的一端处于固定于电路板的固定部件的牵引下，并将第一导热板压在第一发热元件上。固定构件和第一导热板然后夹紧热管，以便经由连接元件将由第一和第二发热元件产生的热量传导到热管。

4. 发明授权

US07405937B1 Heat sink module for dual heat sources 失效
标题翻译：双热源散热模块
公开(公告)号：US07405937B1
公开(公告)日：2008-07-29
申请号：US11707511
申请日：2007-02-16
申请人： Feng-Ku Wang , Chih-Kai Yang , Huang-Cheng Ke
发明人： Feng-Ku Wang , Chih-Kai Yang , Huang-Cheng Ke
IPC分类号： H05K7/20 , H01L23/34 , F28F7/00
CPC分类号： H01L23/427 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heatsink module for dual heat sources for dissipating heat generated by a first and a second heat-generating element disposed on a circuit board is provided. The heatsink module includes a first heat-conducting plate, a second heat-conducting plate, a fixing member, a heat pipe, and a pressing flat spring. The first and second heat-conducting plates contact the first and second heat-generating elements respectively. The fixing member when fixed to the circuit board presses the second heat-conducting plate against the second heat-generating element. One end of the pressing flat spring is under the traction of the fixing member fixed to the circuit board, and presses the first heat-conducting plate against the first heat-generating element. The fixing member and the first heat-conducting plate then clamp the heat pipe, so as to conduct the heat generated by the first and second heat-generating elements to the heat pipe via the connecting elements.
摘要翻译：提供了用于散发由设置在电路板上的第一和第二发热元件产生的热量的双重热源的散热器模块。散热模块包括第一导热板，第二导热板，固定构件，热管和按压板簧。第一和第二导热板分别接触第一和第二发热元件。固定构件固定在电路板上时，将第二导热板压在第二发热元件上。按压平板弹簧的一端处于固定于电路板的固定部件的牵引下，并将第一导热板压在第一发热元件上。固定构件和第一导热板然后夹紧热管，以便经由连接元件将由第一和第二发热元件产生的热量传导到热管。

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