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1. 发明授权

US07954541B2 Heat dissipation module 有权
标题翻译：散热模块
公开(公告)号：US07954541B2
公开(公告)日：2011-06-07
申请号：US12018602
申请日：2008-01-23
申请人： Feng-Ku Wang , Chih-Kai Yang , Huang-Cheng Ke , Yu-Chih Cheng , Cheng-Shang Chou
发明人： Feng-Ku Wang , Chih-Kai Yang , Huang-Cheng Ke , Yu-Chih Cheng , Cheng-Shang Chou
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation module for being assembled to a circuit board with a first heat-generating element and a second heat-generating element is provided. A heat generation rate of the first heat-generating element is higher than that of the second heat-generating element. The heat dissipation module includes a heat-transferring connection element, a cooling device, a first heat-transferring plate and a second heat-transferring plate. The heat-transferring connection element has a first part and a second part. The cooling device connects to the first part. The first heat-transferring plate is connected between the first heat-generating element and the second part. The second heat-transferring plate has a third part and a fourth part. The second part is connected between the first heat-transferring plate and the third part. The fourth part is connected to the second heat-generating element. The thermal conductivity of the first heat-transferring plate is higher than that of the second heat-transferring plate.
摘要翻译：提供了一种用于组装到具有第一发热元件和第二发热元件的电路板的散热模块。第一发热元件的发热量高于第二发热元件的发热量。散热模块包括传热连接元件，冷却装置，第一传热板和第二传热板。传热连接元件具有第一部分和第二部分。冷却装置连接到第一部分。第一传热板连接在第一发热元件和第二部件之间。第二传热板具有第三部分和第四部分。第二部分连接在第一传热板和第三部分之间。第四部分连接到第二发热元件。第一传热板的导热率高于第二传热板的热导率。

2. 发明申请

US20090056925A1 HEAT DISSIPATION MODULE 有权
标题翻译：散热模块
公开(公告)号：US20090056925A1
公开(公告)日：2009-03-05
申请号：US12018602
申请日：2008-01-23
申请人： Feng-Ku Wang , Chih-Kai Yang , Huang-Cheng Ke , Yu-Chih Cheng , Cheng-Shang Chou
发明人： Feng-Ku Wang , Chih-Kai Yang , Huang-Cheng Ke , Yu-Chih Cheng , Cheng-Shang Chou
IPC分类号： F28F3/02
CPC分类号： H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat dissipation module for being assembled to a circuit board with a first heat-generating element and a second heat-generating element is provided. A heat generation rate of the first heat-generating element is higher than that of the second heat-generating element. The heat dissipation module includes a heat-transferring connection element, a cooling device, a first heat-transferring plate and a second heat-transferring plate. The heat-transferring connection element has a first part and a second part. The cooling device connects to the first part. The first heat-transferring plate is connected between the first heat-generating element and the second part. The second heat-transferring plate has a third part and a fourth part. The second part is connected between the first heat-transferring plate and the third part. The fourth part is connected to the second heat-generating element. The thermal conductivity of the first heat-transferring plate is higher than that of the second heat-transferring plate.
摘要翻译：提供了一种用于组装到具有第一发热元件和第二发热元件的电路板的散热模块。第一发热元件的发热量高于第二发热元件的发热量。散热模块包括传热连接元件，冷却装置，第一传热板和第二传热板。传热连接元件具有第一部分和第二部分。冷却装置连接到第一部分。第一传热板连接在第一发热元件和第二部件之间。第二传热板具有第三部分和第四部分。第二部分连接在第一传热板和第三部分之间。第四部分连接到第二发热元件。第一传热板的导热率高于第二传热板的热导率。

3. 发明申请

US20080198550A1 HEAT SINK MODULE FOR DUAL HEAT SOURCES 失效
标题翻译：双热源热泵模块
公开(公告)号：US20080198550A1
公开(公告)日：2008-08-21
申请号：US11707511
申请日：2007-02-16
申请人： Feng-Ku Wang , Chih-Kai Yang , Huang-Cheng Ke
发明人： Feng-Ku Wang , Chih-Kai Yang , Huang-Cheng Ke
IPC分类号： H05K7/20
CPC分类号： H01L23/427 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heatsink module for dual heat sources for dissipating heat generated by a first and a second heat-generating element disposed on a circuit board is provided. The heatsink module includes a first heat-conducting plate, a second heat-conducting plate, a fixing member, a heat pipe, and a pressing flat spring. The first and second heat-conducting plates contact the first and second heat-generating elements respectively. The fixing member when fixed to the circuit board presses the second heat-conducting plate against the second heat-generating element. One end of the pressing flat spring is under the traction of the fixing member fixed to the circuit board, and presses the first heat-conducting plate against the first heat-generating element. The fixing member and the first heat-conducting plate then clamp the heat pipe, so as to conduct the heat generated by the first and second heat-generating elements to the heat pipe via the connecting elements.
摘要翻译：提供了用于散发由设置在电路板上的第一和第二发热元件产生的热量的双重热源的散热器模块。散热模块包括第一导热板，第二导热板，固定构件，热管和按压板簧。第一和第二导热板分别接触第一和第二发热元件。固定构件固定在电路板上时，将第二导热板压在第二发热元件上。按压平板弹簧的一端处于固定于电路板的固定部件的牵引下，并将第一导热板压在第一发热元件上。固定构件和第一导热板然后夹紧热管，以便经由连接元件将由第一和第二发热元件产生的热量传导到热管。

4. 发明授权

US07405937B1 Heat sink module for dual heat sources 失效
标题翻译：双热源散热模块
公开(公告)号：US07405937B1
公开(公告)日：2008-07-29
申请号：US11707511
申请日：2007-02-16
申请人： Feng-Ku Wang , Chih-Kai Yang , Huang-Cheng Ke
发明人： Feng-Ku Wang , Chih-Kai Yang , Huang-Cheng Ke
IPC分类号： H05K7/20 , H01L23/34 , F28F7/00
CPC分类号： H01L23/427 , H01L23/4006 , H01L2924/0002 , H01L2924/00
摘要： A heatsink module for dual heat sources for dissipating heat generated by a first and a second heat-generating element disposed on a circuit board is provided. The heatsink module includes a first heat-conducting plate, a second heat-conducting plate, a fixing member, a heat pipe, and a pressing flat spring. The first and second heat-conducting plates contact the first and second heat-generating elements respectively. The fixing member when fixed to the circuit board presses the second heat-conducting plate against the second heat-generating element. One end of the pressing flat spring is under the traction of the fixing member fixed to the circuit board, and presses the first heat-conducting plate against the first heat-generating element. The fixing member and the first heat-conducting plate then clamp the heat pipe, so as to conduct the heat generated by the first and second heat-generating elements to the heat pipe via the connecting elements.
摘要翻译：提供了用于散发由设置在电路板上的第一和第二发热元件产生的热量的双重热源的散热器模块。散热模块包括第一导热板，第二导热板，固定构件，热管和按压板簧。第一和第二导热板分别接触第一和第二发热元件。固定构件固定在电路板上时，将第二导热板压在第二发热元件上。按压平板弹簧的一端处于固定于电路板的固定部件的牵引下，并将第一导热板压在第一发热元件上。固定构件和第一导热板然后夹紧热管，以便经由连接元件将由第一和第二发热元件产生的热量传导到热管。

5. 发明授权

US07457119B2 Heatsink module 有权
公开(公告)号：US07457119B2
公开(公告)日：2008-11-25
申请号：US11703704
申请日：2007-02-08
申请人： Feng-Ku Wang , Chih-Kai Yang , Yu-Chih Cheng
发明人： Feng-Ku Wang , Chih-Kai Yang , Yu-Chih Cheng
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heatsink module used for dissipating heat generated by a heat generating component is provided. The heatsink module includes a heat pipe, a heatsink fin assembly, a fan blade motor set, a fan shell, and an external cover. The heat pipe conducts the heat generated by the heat generating component to the heatsink fin assembly. The fan blade motor set, disposed in the fan shell and covered by the external cover, operates to generate an airflow passing through the heatsink fin assembly to dissipate the heat on the heatsink fin assembly. The fan shell has a plurality of buckling components, and the external cover has a plurality of matching components disposed at the edge corresponding to the buckling components, such that the buckling components and the matching components are buckled together when the external cover is covered on the fan shell, so as to fast combine the parts.

6. 发明申请

US20080192434A1 Heatsink module 有权
标题翻译：散热模块
公开(公告)号：US20080192434A1
公开(公告)日：2008-08-14
申请号：US11703704
申请日：2007-02-08
申请人： Feng-Ku Wang , Chih-Kai Yang , Yu-Chih Cheng
发明人： Feng-Ku Wang , Chih-Kai Yang , Yu-Chih Cheng
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A heatsink module used for dissipating heat generated by a heat generating component is provided. The heatsink module includes a heat pipe, a heatsink fin assembly, a fan blade motor set, a fan shell, and an external cover. The heat pipe conducts the heat generated by the heat generating component to the heatsink fin assembly. The fan blade motor set, disposed in the fan shell and covered by the external cover, operates to generate an airflow passing through the heatsink fin assembly to dissipate the heat on the heatsink fin assembly. The fan shell has a plurality of buckling components, and the external cover has a plurality of matching components disposed at the edge corresponding to the buckling components, such that the buckling components and the matching components are buckled together when the external cover is covered on the fan shell, so as to fast combine the parts.
摘要翻译：提供了用于消散由发热部件产生的热量的散热器模块。散热器模块包括热管，散热片组件，风扇叶片电动机组，风扇壳和外部盖。热管将由发热部件产生的热量传导到散热片组件。设置在风扇外壳中并被外盖覆盖的风扇叶片马达组运行，以产生通过散热片组件的气流，以散热散热片组件上的热量。风扇外壳具有多个弯曲部件，并且外盖具有设置在与弯曲部件相对应的边缘处的多个匹配部件，使得当外盖被覆盖时，弯曲部件和匹配部件被扣合在一起风扇外壳，以快速组合零件。

7. 发明授权

US07589969B2 Folding protective cover for heat-conductive medium 失效
标题翻译：导热介质折叠保护罩
公开(公告)号：US07589969B2
公开(公告)日：2009-09-15
申请号：US11401875
申请日：2006-04-12
申请人： Feng-Ku Wang , Yi-Lun Cheng , Chun-Yi Chang , Jui-Chan Fan , Chun-Lung Lin , Chih-Kai Yang
发明人： Feng-Ku Wang , Yi-Lun Cheng , Chun-Yi Chang , Jui-Chan Fan , Chun-Lung Lin , Chih-Kai Yang
IPC分类号： H05K7/20
CPC分类号： H01L23/34 , H01L2924/0002 , Y10T428/13 , Y10T428/24215 , Y10T428/24273 , Y10T428/28 , H01L2924/00
摘要： A folding protective cover structure is used to cover and protect a heat-conductive medium disposed on the bottom surface of a heat sink device. An unfoldable plate body is employed and has a hollow portion, a folding portion, and an adhesive area; wherein the hollow portion is used for surrounding the heat-conductive medium with a frame-fixing plate extending from its edge, which is folded towards an opposite direction of the heat-conductive medium, so as to keep an upright state; the folding portion is folded towards the hollow portion, so that the frame-fixing plate passes through the folding portion to clip and fix the folding portion, thus forming an accommodating space for protecting the heat-conductive medium; and the adhesive area is located at the edge of the hollow portion, facing the surface of the heat sink device, for adhering and securing the plate body to the heat sink device.
摘要翻译：折叠保护盖结构用于覆盖和保护设置在散热装置的底表面上的导热介质。使用可展开的板体，并具有中空部分，折叠部分和粘合区域; 其中所述中空部分用于围绕所述导热介质，其具有从其边缘延伸的框架固定板，所述框架固定板朝向所述导热介质的相反方向折叠，以保持直立状态; 折叠部分朝向中空部分折叠，使得框架固定板穿过折叠部分以夹紧和固定折叠部分，从而形成用于保护导热介质的容纳空间; 并且粘合剂区域位于中空部分的面对散热装置的表面的边缘，用于将板体粘附并固定到散热装置。

8. 发明申请

US20090034196A1 HEAT-DISSIPATING MODULE 审中-公开
标题翻译：散热模块
公开(公告)号：US20090034196A1
公开(公告)日：2009-02-05
申请号：US11850480
申请日：2007-09-05
申请人： Feng-Ku Wang , Chih-Kai Yang
发明人： Feng-Ku Wang , Chih-Kai Yang
IPC分类号： H05K7/20
CPC分类号： G06F1/203 , F28D15/0266 , F28F1/24 , H01L23/3672 , H01L23/427 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heat-dissipating module adapted for cooling a heat-generating element is provided. The heat-dissipating module includes a fin module, a fan and a heat pipe. The fan is adapted for generating an air current. The fin module includes a plurality of first fins and a plurality of second fins. Each first fin includes a first edge facing the fan. The first edges are located on a first surface. Each second fin includes a second edge facing the fan. The second edges are located on a second surface not coinciding with the first surface. The air current passes through the first surface and the second surface and then passes by the first fins and the second fins. The heat pipe includes a first end thermally coupled to the heat-generating element, and a second end thermally coupled to the first fins and the second fins.
摘要翻译：提供了一种用于冷却发热元件的散热模块。散热模块包括翅片模块，风扇和热管。该风扇适于产生气流。翅片模块包括多个第一散热片和多个第二散热片。每个第一翅片包括面向风扇的第一边缘。第一边缘位于第一表面上。每个第二鳍片包括面向风扇的第二边缘。第二边缘位于不与第一表面重合的第二表面上。气流通过第一表面和第二表面，然后通过第一散热片和第二散热片。热管包括热耦合到发热元件的第一端和与第一散热片和第二散热片热耦合的第二端。

9. 发明申请

US20080186675A1 Heatsink apparatus 有权
公开(公告)号：US20080186675A1
公开(公告)日：2008-08-07
申请号：US11702112
申请日：2007-02-05
申请人： Feng-Ku Wang , Chih-Kai Yang
发明人： Feng-Ku Wang , Chih-Kai Yang
IPC分类号： H05K7/20
CPC分类号： H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A heatsink apparatus for dissipating heat generated by electronic parts is provided. The heatsink apparatus includes a fan and a heatsink fin. One end of the heatsink fin is adhered to an electronic component, the other end forms a curl portion, and a curl inner surface receives an air flow generated by the fan, so as to quickly dissipate the heat energy of the electronic component.

10. 发明申请

US20070235177A1 Heat conducting medium protection device 审中-公开
标题翻译：导热介质保护装置
公开(公告)号：US20070235177A1
公开(公告)日：2007-10-11
申请号：US11399454
申请日：2006-04-07
申请人： Feng-Ku Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
发明人： Feng-Ku Wang , Yi-Lun Cheng , Jui-Chan Fan , Chun-Yi Chang , Chun-Lung Lin , Chih-Kai Yang
IPC分类号： H05K7/20
CPC分类号： H01L23/42 , F28F2265/00 , H01L2924/0002 , H01L2924/00
摘要： A heat conducting medium protection device is provided. At least one cutout is formed in a sheet, and the sheet is bent to closely engage the cutouts so as to transform the sheet into a three-dimensional shape and form an accommodating space. When the heat conducting medium protection device is covered on a heat sink coated with a heat conducting medium, the accommodating space accommodates the heat conducting medium for holding the heat conducting medium, thereby making it easy to transmit the heat sink coated with a heat conducting medium.
摘要翻译：提供导热介质保护装置。至少一个切口形成在片材中，并且片材被弯曲以紧密地接合切口，以便将片材变形为三维形状并形成容纳空间。当导热介质保护装置覆盖在涂有导热介质的散热片上时，容纳空间容纳用于保持导热介质的导热介质，从而容易地传输涂有导热介质的散热片。

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