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    • 10. 发明授权
    • Multi-station rotary die handling device
    • 多工位旋转模具处理装置
    • US06364089B1
    • 2002-04-02
    • US09549241
    • 1999-12-10
    • Inderjit SinghJaime A. BayanHem TakiarAshok S. Prabhu
    • Inderjit SinghJaime A. BayanHem TakiarAshok S. Prabhu
    • B65G4724
    • H01L21/67132B65G47/848H01L21/6838
    • The invention relates to apparatus and methods for semiconductor device handling. In one aspect, the invention relates to a rotary flipper including a wheel having a plurality of stations. A semiconductor device is placed within a first station in a first orientation. While the semiconductor device is held, the wheel portion of the rotary flipper rotates and the next station receives another semiconductor device. When the first station is in an unloading position, the semiconductor device is released. At this point, the semiconductor device is oriented in a second position. In one aspect, the semiconductor device is released into a cavity of a tape and reel. In another aspect, vacuum pressure is applied to hold the die. In one embodiment, the invention relates to a semiconductor device handling apparatus and apparatus that includes of a rotary semiconductor device flipper.
    • 本发明涉及半导体器件处理的装置和方法。 一方面,本发明涉及一种包括具有多个站的车轮的旋转导板。 半导体器件以第一取向放置在第一工位内。 在保持半导体器件的同时,旋转推板的轮部分旋转并且下一个站接收另一个半导体器件。 当第一站处于卸载位置时,半导体器件被释放。 此时,半导体器件被定向在第二位置。 在一个方面,半导体器件被释放到带和卷的空腔中。 另一方面,施加真空压力以保持模具。 在一个实施例中,本发明涉及一种包括旋转半导体器件引脚的半导体器件处理装置和装置。