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1. 发明授权

US07303466B2 Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones 失效
标题翻译：具有将压力室分隔成多个压力区的障碍的化学机械抛光装置的承载头
公开(公告)号：US07303466B2
公开(公告)日：2007-12-04
申请号：US10959113
申请日：2004-10-07
申请人： Jae-Phil Boo , Jue-Young Lee
发明人： Jae-Phil Boo , Jue-Young Lee
IPC分类号： B24B5/00 , B24B7/00 , B24B41/06
CPC分类号： B24B37/30
摘要： A carrier head of a chemical mechanical polishing apparatus has a support, an elastic membrane secured to the support and spaced from the bottom surface of the support so that a pressure chamber is defined between the membrane and the bottom surface of the support; and at least one annular barrier of elastic material extending from the bottom surface of the support. Each barrier has an annular partition portion that extends through the pressure chamber and divides the pressure chamber into respective pressure zones on opposite sides thereof, and an annular contact portion that abuts the membrane such that the barrier contacts the membrane but is not fixedly attached thereto. The contact portion includes a pair of annular flanges extending laterally in opposite directions at the lower end of the partition portion.
摘要翻译：化学机械抛光装置的承载头具有支撑件，弹性膜固定到支撑件并且与支撑件的底表面间隔开，使得在膜和支撑件的底表面之间限定压力室; 以及弹性材料的至少一个环形屏障，其从所述支撑件的底表面延伸。每个挡板具有环形分隔部分，其延伸穿过压力室并将压力室分成相对侧的相应的压力区域，以及环形接触部分，该环形接触部分邻接膜，使得阻挡件接触膜而不固定地附接到膜片上。接触部分包括在分隔部分的下端沿相反方向横向延伸的一对环形凸缘。

2. 发明授权

US07223158B2 Method for polishing a semiconductor wafer 失效
标题翻译：抛光半导体晶片的方法
公开(公告)号：US07223158B2
公开(公告)日：2007-05-29
申请号：US11326555
申请日：2006-01-05
申请人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B49/00
CPC分类号： B24B37/30 , B24B37/32 , H01L21/304
摘要： An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber. The first chamber is in communication with the other one of the two fluid passages and the first holes are formed in the lower surface portion of the supporter to communicate with the first chamber. The lower surface portion of the supporter has a flat surface and a chamfered or rounded edge. The membrane disposed to enclose the lower surface portion of the supporter has a plurality of third holes formed at positions corresponding to the first holes to absorb and hold the wafer by vacuum.
摘要翻译：用于抛光晶片的装置包括具有设置在其上的研磨垫的支撑部分和设置在研磨垫上方的抛光头。抛光头包括具有至少两个流体通道的载体，设置在载体的下边缘上的保持环，形成用于接收晶片的空间，设置在载体中的支撑体和设置成与载体接触的柔性膜晶圆。支撑体具有上表面部分，下表面部分，多个第一孔，多个第二孔和第一室。支撑件的上表面部分与载体的内表面一起形成第二室。第二室与载体的两个流体通道中的一个连通，并且第二孔形成在支撑件的下表面部分中以与第二室连通。第一室与两个流体通道中的另一个连通，并且第一孔形成在支撑件的下表面部分中以与第一室连通。支撑体的下表面部分具有平坦表面和倒角或圆形边缘。设置成包围支撑体的下表面部分的膜具有形成在与第一孔对应的位置处的多个第三孔，以通过真空吸收和保持晶片。

3. 发明申请

US20060116056A1 Apparatus and methods for polishing a semiconductor wafer 失效
标题翻译：用于抛光半导体晶片的装置和方法
公开(公告)号：US20060116056A1
公开(公告)日：2006-06-01
申请号：US11326555
申请日：2006-01-05
申请人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B1/00 , B24B7/30 , B24B29/00
CPC分类号： B24B37/30 , B24B37/32 , H01L21/304
摘要： An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber. The first chamber is in communication with the other one of the two fluid passages and the first holes are formed in the lower surface portion of the supporter to communicate with the first chamber. The lower surface portion of the supporter has a flat surface and a chamfered or rounded edge. The membrane disposed to enclose the lower surface portion of the supporter has a plurality of third holes formed at positions corresponding to the first holes to absorb and hold the wafer by vacuum.
摘要翻译：用于抛光晶片的装置包括具有设置在其上的研磨垫的支撑部分和设置在研磨垫上方的抛光头。抛光头包括具有至少两个流体通道的载体，设置在载体的下边缘上的保持环，形成用于接收晶片的空间，设置在载体中的支撑体和设置成与载体接触的柔性膜晶圆。支撑体具有上表面部分，下表面部分，多个第一孔，多个第二孔和第一室。支撑件的上表面部分与载体的内表面一起形成第二室。第二室与载体的两个流体通道中的一个连通，并且第二孔形成在支撑件的下表面部分中以与第二室连通。第一室与两个流体通道中的另一个连通，并且第一孔形成在支撑件的下表面部分中以与第一室连通。支撑体的下表面部分具有平坦表面和倒角或圆形边缘。设置成包围支撑体的下表面部分的膜具有形成在与第一孔对应的位置处的多个第三孔，以通过真空吸收和保持晶片。

4. 发明授权

US07052368B2 Polishing pad for chemical mechanical polishing apparatus 失效
标题翻译：化学机械抛光设备抛光垫
公开(公告)号：US07052368B2
公开(公告)日：2006-05-30
申请号：US10861254
申请日：2004-06-03
申请人： Jin-Kook Kim , Jae-Phil Boo , Sang-Seon Lee , Jong-Bok Kim
发明人： Jin-Kook Kim , Jae-Phil Boo , Sang-Seon Lee , Jong-Bok Kim
IPC分类号： B24B49/00
CPC分类号： B24B37/205
摘要： Provided is a polishing pad for a chemical mechanical polishing (CMP) apparatus, having a sealing barrier which prevents fluid leakage and moisture accumulation on a window. The polishing pad comprises an upper pad having polishing surface in contact with a wafer, a bottom pad an upper face of which is attached to a lower face of the upper pad and a lower face of which is attached to an upper face of a platen of the CMP apparatus, an aperture through the bottom pad and the upper pad, a transparent window fitted in the aperture in the upper pad, and a sealing barrier, placed between the aperture and an external face of the bottom pad in contact with a fluid, to prevent fluid leakage and accumulation of moisture derived from fluid fed on the polishing surface through the bottom pad.
摘要翻译：本发明提供一种用于化学机械抛光（CMP）装置的抛光垫，其具有防止液体泄漏和水分积聚在窗户上的密封屏障。抛光垫包括具有与晶片接触的抛光表面的上焊盘，底垫，其上表面附接到上焊盘的下表面，其下表面附接到压板的上表面 CMP装置，通过底垫和上垫的孔，安装在上垫中的孔中的透明窗和密封屏障，放置在孔与底部垫的与流体接触的外表面之间，以防止流体通过底部衬垫泄漏和积聚来自在抛光表面上供给的流体的水分。

5. 发明授权

US08882563B2 Chemical mechanical polishing system 有权
标题翻译：化学机械抛光系统
公开(公告)号：US08882563B2
公开(公告)日：2014-11-11
申请号：US13095404
申请日：2011-04-27
申请人： Jae Phil Boo , Dong Soo Kim , Keon Sik Seo , Chan Woon Jeon , Jun Ho Ban , Ja Cheul Goo
发明人： Jae Phil Boo , Dong Soo Kim , Keon Sik Seo , Chan Woon Jeon , Jun Ho Ban , Ja Cheul Goo
IPC分类号： B24B49/00 , B24B5/00 , B24B37/30 , B24B37/34
CPC分类号： B24B37/345 , B24B37/30
摘要： The invention relates to a chemical mechanical polishing system, comprising: at least one polishing platens rotatably installed with a platen pad mounted on its upper surface; a guide rail disposed along a predetermined path; a substrate carrier unit including a rotary union to downwardly press a substrate during a polishing process, the substrate carrier unit moving along the guide rail with loading the substrate; and a docking unit installed to be docked to the substrate carrier unit so as to supply air pressure to the rotary union which downwardly presses the substrate held by the substrate carrier unit, when the substrate carrier unit is positioned over the polishing platen, whereby even though the substrate carrier unit is moved to consecutively polish the substrate on the plural polishing platens, it substantially removes a phenomenon of the twisting of air pressure supply tubes due to the movement of the substrate carrier unit.
摘要翻译：本发明涉及一种化学机械抛光系统，包括：至少一个抛光盘，其可旋转地安装有安装在其上表面上的压板; 沿预定路径设置的导轨; 衬底载体单元，其包括旋转接头，用于在抛光过程中向基板施加压力，所述衬底载体单元沿着所述导轨移动并加载所述衬底; 以及对接单元，其安装成对接到基板载体单元，以便当基板载体单元位于抛光平台上时，向压缩由基板承载单元保持的基板向下挤压的旋转接头提供空气压力，由此即使衬底载体单元移动以连续地抛光多个抛光平板上的衬底，基本上消除了由于衬底载体单元的运动引起的空气压力供应管的扭转现象。

6. 发明授权

US08662956B2 Conditioner of chemical mechanical polishing apparatus 有权
标题翻译：化学机械抛光装置的护发素
公开(公告)号：US08662956B2
公开(公告)日：2014-03-04
申请号：US13099401
申请日：2011-05-03
申请人： Keon Sik Seo , Jae Phil Boo , Dong Soo Kim , Ja Cheul Goo , Chan Woon Jeon , Jnn Ho Ban
发明人： Keon Sik Seo , Jae Phil Boo , Dong Soo Kim , Ja Cheul Goo , Chan Woon Jeon , Jnn Ho Ban
IPC分类号： B24B53/00 , B24B1/00
CPC分类号： B24B53/017 , B24B49/16
摘要： Provided are a conditioner of a chemical mechanical polishing apparatus for polishing a substrate over a platen pad that rotates and a method thereof. The conditioner includes a disk holder, a piston rod, a housing, and a load sensor. The disk holder secures a conditioning disk that finely cuts a surface of the platen pad. The piston rod delivers a normal force to the disk holder. The housing covers at least a portion of the piston rod. The load sensor is installed to receive the normal force that the piston rod delivers to the piston rod and measuring the normal force.
摘要翻译：提供一种用于在旋转的压板上抛光基板的化学机械抛光装置的调节器及其方法。调节器包括盘保持器，活塞杆，壳体和负载传感器。盘保持器固定调节盘，该调节盘精细地切割压板垫的表面。活塞杆向盘保持器施加法向力。壳体覆盖活塞杆的至少一部分。安装负载传感器以接收活塞杆传递到活塞杆并测量法向力的法向力。

7. 发明申请

US20110217911A1 POLISHING PAD FOR CHEMICAL MECHANICAL POLISHING PROCESS AND CHEMICAL MECHANICAL POLISHING APPARATUS INCLUDING THE SAME 有权
标题翻译：化学机械抛光工艺抛光垫和化学机械抛光装置
公开(公告)号：US20110217911A1
公开(公告)日：2011-09-08
申请号：US13036496
申请日：2011-02-28
申请人： One-Moon CHANG , Jae-Phil Boo , Soo-Young Tak , Jong-Sun Ahn , Shin Kim , Kyoung-Moon Kang
发明人： One-Moon CHANG , Jae-Phil Boo , Soo-Young Tak , Jong-Sun Ahn , Shin Kim , Kyoung-Moon Kang
IPC分类号： B24B41/06
CPC分类号： B24B41/06
摘要： A chemical mechanical polishing apparatus includes a platen configured to support and rotate a wafer, and a polishing pad facing the platen. The polishing pad includes a body having a groove with a rotational symmetric pattern.
摘要翻译：化学机械抛光装置包括被配置为支撑和旋转晶片的压板和面向压板的抛光垫。抛光垫包括具有旋转对称图案的凹槽的主体。

8. 发明申请

US20110217910A1 CHEMICAL MECHANICAL POLISHING APPARATUS 有权
标题翻译：化学机械抛光装置
公开(公告)号：US20110217910A1
公开(公告)日：2011-09-08
申请号：US13033876
申请日：2011-02-24
申请人： One-Moon CHANG , Jae-Phil Boo , Jong-Bok Kim , Soo-Young Tak , Jong-Sun Ahn , Shin Kim
发明人： One-Moon CHANG , Jae-Phil Boo , Jong-Bok Kim , Soo-Young Tak , Jong-Sun Ahn , Shin Kim
IPC分类号： B24B41/06
CPC分类号： B24B41/06
摘要： A chemical mechanical polishing apparatus includes a platen having a first region configured to support a wafer, and a second region disposed outside the first region. The chemical mechanical polishing apparatus further includes a polishing pad disposed on the platen, a pad head to which the polishing pad is attached, a slurry supply configured to supply a slurry onto the wafer, and an injection port disposing on the second region of the platen. The injection port is configured to inject a predetermined gas to an edge of a bottom surface of the wafer and toward the outside of the wafer.
摘要翻译：化学机械抛光装置包括具有构造成支撑晶片的第一区域的压板和设置在第一区域外的第二区域。化学机械抛光装置还包括设置在压板上的抛光垫，附接有抛光垫的焊盘头，配置成将浆料供应到晶片上的浆料供应源和设置在压板的第二区域上的注入口。注入口被配置为将预定气体注入到晶片的底表面的边缘并朝向晶片的外部。

9. 发明申请

US20070232209A1 METHOD FOR POLISHING A SEMICONDUCTOR WAFER 审中-公开
标题翻译：抛光半导体波长的方法
公开(公告)号：US20070232209A1
公开(公告)日：2007-10-04
申请号：US11753893
申请日：2007-05-25
申请人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
发明人： Jae-Phil Boo , Jun-Gyu Ryu , Sang-Seon Lee , Sun-Wung Lee
IPC分类号： B24B19/00
CPC分类号： B24B37/30 , B24B37/32 , H01L21/304
摘要： An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a space for receiving the wafer, a supporter disposed in the carrier, and a flexible membrane disposed to be in contact with the wafer. The supporter has an upper surface portion, a lower surface portion, a plurality of first holes, a plurality of second holes, and a first chamber. The upper surface portion of the supporter forms a second chamber along with an inner surface of the carrier. The second chamber is in communication with one of the two fluid passages of the carrier and the second holes are formed in a lower surface portion of the supporter to communicate with the second chamber. The first chamber is in communication with the other one of the two fluid passages and the first holes are formed in the lower surface portion of the supporter to communicate with the first chamber. The lower surface portion of the supporter has a flat surface and a chamfered or rounded edge. The membrane disposed to enclose the lower surface portion of the supporter has a plurality of third holes formed at positions corresponding to the first holes to absorb and hold the wafer by vacuum.
摘要翻译：用于抛光晶片的装置包括具有设置在其上的研磨垫的支撑部分和设置在研磨垫上方的抛光头。抛光头包括具有至少两个流体通道的载体，设置在载体的下边缘上的保持环，形成用于接收晶片的空间，设置在载体中的支撑体和设置成与载体接触的柔性膜晶圆。支撑体具有上表面部分，下表面部分，多个第一孔，多个第二孔和第一室。支撑件的上表面部分与载体的内表面一起形成第二室。第二室与载体的两个流体通道中的一个连通，并且第二孔形成在支撑件的下表面部分中以与第二室连通。第一室与两个流体通道中的另一个连通，并且第一孔形成在支撑件的下表面部分中以与第一室连通。支撑体的下表面部分具有平坦表面和倒角或圆形边缘。设置成包围支撑体的下表面部分的膜具有形成在与第一孔对应的位置处的多个第三孔，以通过真空吸收和保持晶片。

10. 发明授权

US07196010B2 Slurry for chemical mechanical polishing process and method of manufacturing semiconductor device using the same 失效
公开(公告)号：US07196010B2
公开(公告)日：2007-03-27
申请号：US10639541
申请日：2003-08-12
申请人： Young-rae Park , Jung-yup Kim , Bo-un Yoon , Kwang-bok Kim , Jae-phil Boo , Jong-won Lee , Sang-rok Hah , Kyung-hyun Kim , Chang-ki Hong
发明人： Young-rae Park , Jung-yup Kim , Bo-un Yoon , Kwang-bok Kim , Jae-phil Boo , Jong-won Lee , Sang-rok Hah , Kyung-hyun Kim , Chang-ki Hong
IPC分类号： H01L21/302
CPC分类号： H01L21/76224 , B24B37/044 , C09G1/02 , H01L21/31053
摘要： A slurry composition useful for chemical mechanical polishing of the surface of a material layer, e.g., a silicon oxide layer, is disclosed. A first material surface which is exposed to the slurry exhibits hydrophilicity, while a second material layer, e.g., a polysilicon layer, the surface of which is also exposed to the slurry, exhibits hydrophobicity, and accordingly acts as a polishing stopping layer. The slurry composition consists essentially of water, abrasive grains, and a polymer additive having both hydrophilic and hydrophobic functional groups.

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