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    • 5. 发明申请
    • Methods of fabricating image sensors and image sensors fabricated thereby
    • 制造图像传感器和图像传感器的方法
    • US20110163362A1
    • 2011-07-07
    • US13064176
    • 2011-03-09
    • Won-je ParkChan ParkYoung-hoon ParkJae-ho SongJong-wook HongKeo-sung Park
    • Won-je ParkChan ParkYoung-hoon ParkJae-ho SongJong-wook HongKeo-sung Park
    • H01L31/14
    • H01L27/14643H01L27/14603H01L27/14609H01L27/14641H01L27/14689
    • A method of fabricating an image sensor may include providing a substrate including light-receiving and non-light-receiving regions; forming a plurality of gates on the non-light-receiving region; ion-implanting a first-conductivity-type dopant into the light-receiving region to form a first dopant region of a pinned photodiode; primarily ion-implanting a second-conductivity-type dopant, different from the first-conductivity-type dopant, into an entire surface of the substrate, using the gates as a first mask; forming spacers on both side walls of the gates; and secondarily ion-implanting the second-conductivity-type dopant into the entire surface of the substrate, using the plurality of gates including the spacers as a second mask, to complete a second dopant region of the pinned photodiode. An image sensor may include the substrate; a transfer gate formed on the non-light-receiving region; a first dopant region in the light-receiving region; and a second dopant region formed on a surface of the light-receiving region.
    • 制造图像传感器的方法可以包括提供包括光接收和非光接收区域的基板; 在非光接收区域上形成多个栅极; 将第一导电型掺杂剂离子注入到光接收区域中以形成钉扎光电二极管的第一掺杂区域; 主要使用栅极作为第一掩模,将与第一导电类型掺杂剂不同的第二导电型掺杂剂离子注入基板的整个表面; 在门的两个侧壁上形成间隔物; 并且其次使用包括间隔物的多个栅极作为第二掩模将第二导电型掺杂剂离子注入到基板的整个表面中,以完成被钉扎的光电二极管的第二掺杂区域。 图像传感器可以包括基板; 形成在非光接收区域上的传输门; 在所述光接收区域中的第一掺杂剂区域; 以及形成在光接收区域的表面上的第二掺杂剂区域。
    • 6. 发明申请
    • METHODS OF FABRICATING AN IMAGE SENSOR
    • 制作图像传感器的方法
    • US20070054434A1
    • 2007-03-08
    • US11464244
    • 2006-08-14
    • Won-Je ParkJae-Ho SongYoung-Hoon Park
    • Won-Je ParkJae-Ho SongYoung-Hoon Park
    • H01L21/00
    • H01L27/14683H01L27/14603H01L27/14643
    • Provided are methods of fabricating an image sensor. Embodiments of such methods can include forming a first gate insulation layer in a first region of a semiconductor substrate and a first gate electrode layer, to cover the first gate insulation layer and forming a second gate insulation layer within a nitrogen enhanced atmosphere and a second gate electrode layer in a second region of the semiconductor substrate. The methods also include patterning the first gate electrode layer and the first gate insulation layer of the first region to form a first gate pattern and patterning the second gate electrode layer and the second gate insulation layer of the second region to form a second gate pattern.
    • 提供制造图像传感器的方法。 这种方法的实施例可以包括在半导体衬底的第一区域和第一栅极电极层中形成第一栅极绝缘层,以覆盖第一栅极绝缘层并在氮气增强气氛中形成第二栅极绝缘层和第二栅极 在半导体衬底的第二区域中的电极层。 所述方法还包括图案化第一区域的第一栅极电极层和第一栅极绝缘层以形成第一栅极图案,并且使第二栅极电极层和第二栅极绝缘层图案化以形成第二栅极图案。
    • 10. 发明授权
    • Test handler including single-door-type stockers
    • 测试处理器,包括单门式储料器
    • US07659711B2
    • 2010-02-09
    • US11723491
    • 2007-03-20
    • Yeon-gyu SongHo-gyung KimKyong-eob EomSeung-hee LeeJae-ho Song
    • Yeon-gyu SongHo-gyung KimKyong-eob EomSeung-hee LeeJae-ho Song
    • G01R31/02G01R31/28
    • G01R31/2893G11C29/56016
    • A handler may include a handler system main body used for testing semiconductor devices; an open-type stocker portion on a front side of the handler system main body; and/or a plurality of single-door-type stockers in the open-type stocker portion. The single-door-type stockers may include windows on upper parts of front sides of the single-door-type stockers. The front sides of the single-door-type stockers may be protected. The handler also may include a front top door on an upper part of the front side of the handler system main body; locking stoppers below the windows of the single-door-type stockers; safety sensors on sides of the open-type stocker portion; and/or a working table in front of the open-type stocker portion. The open-type stocker portion may be below the front top door. The safety sensors may stop the handler when the single-door-type stockers are not closed.
    • 处理器可以包括用于测试半导体器件的处理器系统主体; 处理器系统主体的前侧的开放式储存器部; 和/或多个单门式储料器。 单门式储料器可以包括单门式储料器前侧上部的窗户。 单门式储料器的前侧可能受到保护。 处理器还可以包括在处理器系统主体的正面的上部的前顶门; 在单门式储料器的窗户下面锁定塞子; 开式储料器部分侧面的安全传感器; 和/或在开放型储料机部分前面的工作台。 开放式储料器部分可以在前顶门下方。 当单门式储料器未关闭时,安全传感器可能会停止处理程序。