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1. 发明申请

US20130200050A1 LINK PROCESSING WITH HIGH SPEED BEAM DEFLECTION 审中-公开
公开(公告)号：US20130200050A1
公开(公告)日：2013-08-08
申请号：US13608454
申请日：2012-09-10
申请人： Jonathan S. Ehrmann , Joseph J. Griffiths , James J. Cordingley , Donald J. Svetkoff , Shepard D. Johnson , Michael Plotkin
发明人： Jonathan S. Ehrmann , Joseph J. Griffiths , James J. Cordingley , Donald J. Svetkoff , Shepard D. Johnson , Michael Plotkin
IPC分类号： B23K26/08 , B23K26/36
CPC分类号： B23K26/0869 , B23K26/0344 , B23K26/06 , B23K26/0624 , B23K26/064 , B23K26/0648 , B23K26/0665 , B23K26/082 , B23K26/0853 , B23K26/361 , B23K26/40 , B23K2101/40 , B23K2103/16 , B23K2103/50 , H01L21/76894 , H01L23/5258 , H01L27/10844 , H01L2924/0002 , Y10T29/49156 , H01L2924/00
摘要： The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.

2. 发明授权

US08269137B2 Link processing with high speed beam deflection 有权
标题翻译：链接处理与高速光束偏转
公开(公告)号：US08269137B2
公开(公告)日：2012-09-18
申请号：US12233476
申请日：2008-09-18
申请人： Jonathan S. Ehrmann , Joseph J. Griffiths , James J. Cordingley , Donald J. Svetkoff , Shepard D. Johnson , Michael Plotkin
发明人： Jonathan S. Ehrmann , Joseph J. Griffiths , James J. Cordingley , Donald J. Svetkoff , Shepard D. Johnson , Michael Plotkin
IPC分类号： B23K26/36
CPC分类号： B23K26/0869 , B23K26/0344 , B23K26/06 , B23K26/0624 , B23K26/064 , B23K26/0648 , B23K26/0665 , B23K26/082 , B23K26/0853 , B23K26/361 , B23K26/40 , B23K2101/40 , B23K2103/16 , B23K2103/50 , H01L21/76894 , H01L23/5258 , H01L27/10844 , H01L2924/0002 , Y10T29/49156 , H01L2924/00
摘要： The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures.
摘要翻译：本发明涉及激光加工方法和系统的领域，具体涉及用于激光加工多材料装置的激光加工方法和系统。系统和方法可以利用高速偏转器来改善处理能量窗口和/或提高处理速度。在一些实施例中，偏转器用于束斑的非正交扫描。在一些实施例中，偏转器用于实现目标结构的非同步处理。

3. 发明授权

US07838794B2 Laser-based method and system for removing one or more target link structures 有权
标题翻译：用于去除一个或多个目标链路结构的基于激光的方法和系统
公开(公告)号：US07838794B2
公开(公告)日：2010-11-23
申请号：US11700386
申请日：2007-01-31
申请人： Bo Gu , Donald V. Smart , James J. Cordingley , Joohan Lee , Donald J. Svetkoff , Shepard D. Johnson , Jonathan S. Ehrmann
发明人： Bo Gu , Donald V. Smart , James J. Cordingley , Joohan Lee , Donald J. Svetkoff , Shepard D. Johnson , Jonathan S. Ehrmann
IPC分类号： B23K26/40 , H01L21/44
CPC分类号： B23K26/0626 , B23K26/04 , B23K26/0624 , B23K26/0736 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/50 , H01L21/485 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.
摘要翻译：设置用于去除在衬底上制造的电路的一个或多个目标链路结构的基于激光的方法和系统包括产生具有小于衬底的吸收边缘的预定波长的脉冲激光输出。激光输出包括脉冲持续时间在约10皮秒至小于1纳秒范围内的至少一个脉冲，脉冲持续时间在热激光器处理范围内。该方法还包括将激光输出传送和聚焦到目标链路结构上。聚焦的激光输出在目标链路结构内的位置处具有足够的功率密度，以减少目标链路结构的反射率，并将聚焦的激光输出有效地耦合到目标链路结构中以去除目标链路结构而不损坏基板。

4. 发明授权

US07192846B2 Methods and systems for processing a device, methods and systems for modeling same and the device 有权
标题翻译：用于处理设备的方法和系统，用于对其进行建模和设备的方法和系统
公开(公告)号：US07192846B2
公开(公告)日：2007-03-20
申请号：US11125367
申请日：2005-05-09
申请人： James J. Cordingley , Roger D. Dowd , Jonathan S. Ehrmann , Joseph J. Griffiths , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
发明人： James J. Cordingley , Roger D. Dowd , Jonathan S. Ehrmann , Joseph J. Griffiths , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
IPC分类号： H01L21/00 , H01L21/46
CPC分类号： B23K26/0736 , B23K26/032 , B23K26/04 , B23K26/043 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0652 , B23K26/0665 , B23K26/067 , B23K26/082 , B23K26/10 , B23K26/16 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/10 , B23K2103/12 , B23K2103/172 , B23K2103/50 , H01L21/485 , H01L21/76888 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
摘要翻译：提供一种用于局部处理形成在基板上的预定微结构而不引起基板或其上形成在基板上的其它结构的电学或物理特性的不希望的变化的方法和系统。该方法包括基于与预定微结构，衬底和其它结构的激光脉冲相互作用的模型来提供信息。基于该信息确定至少一个脉冲的至少一个特性。生成包括至少一个脉冲的脉冲激光束。该方法还包括将具有至少一个确定特性的至少一个脉冲照射到预定微结构上的点中。所述至少一个脉冲的至少一个确定的特征和其它特征足以在不引起不期望的变化的情况下局部地处理预定的微结构。

5. 发明授权

US08379204B1 System and method for automatic laser beam alignment 有权
标题翻译：自动激光束对准的系统和方法
公开(公告)号：US08379204B1
公开(公告)日：2013-02-19
申请号：US12192915
申请日：2008-08-15
申请人： James J. Cordingley , Michael Plotkin , John Keefe
发明人： James J. Cordingley , Michael Plotkin , John Keefe
IPC分类号： G01B11/00
CPC分类号： B23K26/043 , G01B11/00
摘要： A method makes a discrete adjustment to static alignment of a laser beam in a machine for selectively irradiating conductive links on or within a semiconductor substrate using the laser beam. The laser beam propagates along a beam path having an axis extending from a laser to a laser beam spot at a location on or within the semiconductor substrate. The method generates, based on at least one measured characteristic of the laser beam, at least one signal to control an adjustable optical element of the machine affecting the laser beam path. The method also sends said at least one signal to the adjustable optical element. The method then adjusts the adjustable optical element in response to said at least one signal so as to improve static alignment of the laser beam path axis.
摘要翻译：一种方法对机器中的激光束的静态对准进行离散调整，用于使用激光束选择性地照射半导体衬底上或内部的导电连接。激光束沿着具有从激光器延伸到半导体衬底上或内部的位置的激光束点的光束路径传播。该方法基于激光束的至少一个测量特性产生至少一个信号，以控制影响激光束路径的机器的可调节光学元件。该方法还将所述至少一个信号发送到可调光学元件。该方法然后响应于所述至少一个信号调整可调光学元件，以改善激光束路径轴线的静态对准。

6. 发明申请

US20120241427A1 PREDICTIVE LINK PROCESSING 审中-公开
标题翻译：预测链接处理
公开(公告)号：US20120241427A1
公开(公告)日：2012-09-27
申请号：US13404930
申请日：2012-02-24
申请人： Dimitry Maltsev , Dmitry N. Romashko , Michael Plotkin , Jonathan S. Ehrmann , James J. Cordingley
发明人： Dimitry Maltsev , Dmitry N. Romashko , Michael Plotkin , Jonathan S. Ehrmann , James J. Cordingley
IPC分类号： B23K26/00
CPC分类号： B23K26/0732 , B23K26/042 , B23K26/0619 , B23K26/0622 , B23K26/082 , H01L21/76892 , H01L23/5258 , H01L2924/0002 , H01L2924/00
摘要： A method of processing material of device elements by laser interaction is disclosed. According to one aspect, the method includes generating a pulsed laser processing output along a laser beam axis, the output including a plurality of laser pulses triggered sequentially at times determined by a pulse repetition rate. A trajectory relative to locations of device elements to be processed is generated. A position of one or more designated device elements relative to an intercept point position on the trajectory at one or more laser pulse times is determined, and a laser beam is deflected based on the predicted position within a predetermined deflection range. According to some aspects, the predetermined deflection range may correspond to a compass rose or cruciform field shape. As a result, a deflection accuracy for laser processing may be improved.
摘要翻译：公开了一种通过激光相互作用处理器件元件材料的方法。根据一个方面，所述方法包括沿着激光束轴产生脉冲激光处理输出，所述输出包括在由脉冲重复率确定的时间顺序触发的多个激光脉冲。产生相对于要处理的设备元件的位置的轨迹。确定一个或多个指定装置元件相对于在一个或多个激光脉冲时间的轨迹上的截点位置的位置，并且激光束基于在预定偏转范围内的预测位置偏转。根据一些方面，预定的偏转范围可以对应于罗盘玫瑰或十字形场的形状。结果，可以提高激光加工的偏转精度。

7. 发明授权

US08253066B2 Laser-based method and system for removing one or more target link structures 有权
标题翻译：用于去除一个或多个目标链路结构的基于激光的方法和系统
公开(公告)号：US08253066B2
公开(公告)日：2012-08-28
申请号：US12950969
申请日：2010-11-19
申请人： Bo Gu , Donald V. Smart , James J. Cordingley , Joohan Lee , Donald J. Svetkoff , Shepard D. Johnson , Jonathan S. Ehrmann
发明人： Bo Gu , Donald V. Smart , James J. Cordingley , Joohan Lee , Donald J. Svetkoff , Shepard D. Johnson , Jonathan S. Ehrmann
IPC分类号： H01S3/10
CPC分类号： B23K26/0626 , B23K26/04 , B23K26/0624 , B23K26/0736 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/50 , H01L21/485 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.
摘要翻译：设置用于去除在衬底上制造的电路的一个或多个目标链路结构的基于激光的方法和系统包括产生具有小于衬底的吸收边缘的预定波长的脉冲激光输出。激光输出包括脉冲持续时间在约10皮秒至小于1纳秒范围内的至少一个脉冲，脉冲持续时间在热激光器处理范围内。该方法还包括将激光输出传送和聚焦到目标链路结构上。聚焦的激光输出在目标链路结构内的位置处具有足够的功率密度，以减少目标链路结构的反射率，并将聚焦的激光输出有效地耦合到目标链路结构中以去除目标链路结构而不损坏基板。

8. 发明申请

US20110062127A1 LASER-BASED METHOD AND SYSTEM FOR REMOVING ONE OR MORE TARGET LINK STRUCTURES 有权
标题翻译：基于激光的方法和系统，用于删除一个或多个目标链结构
公开(公告)号：US20110062127A1
公开(公告)日：2011-03-17
申请号：US12950969
申请日：2010-11-19
申请人： Bo Gu , Donald V. Smart , James J. Cordingley , Joohan Lee , Donald J. Svetkoff , Shepard D. Johnson , Jonathan S. Ehrmann
发明人： Bo Gu , Donald V. Smart , James J. Cordingley , Joohan Lee , Donald J. Svetkoff , Shepard D. Johnson , Jonathan S. Ehrmann
IPC分类号： B23K26/40
CPC分类号： B23K26/0626 , B23K26/04 , B23K26/0624 , B23K26/0736 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/08 , B23K2103/10 , B23K2103/12 , B23K2103/50 , H01L21/485 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate.
摘要翻译：设置用于去除在衬底上制造的电路的一个或多个目标链路结构的基于激光的方法和系统包括产生具有小于衬底的吸收边缘的预定波长的脉冲激光输出。激光输出包括脉冲持续时间在约10皮秒至小于1纳秒范围内的至少一个脉冲，脉冲持续时间在热激光器处理范围内。该方法还包括将激光输出传送和聚焦到目标链路结构上。聚焦的激光输出在目标链路结构内的位置处具有足够的功率密度，以减少目标链路结构的反射率，并将聚焦的激光输出有效地耦合到目标链路结构中以去除目标链路结构而不损坏基板。

9. 发明申请

US20080284837A1 METHODS AND SYSTEMS FOR THERMA-BASED LASER PROCESSING A MULTI-MATERIAL DEVICE 有权
标题翻译：用于基于激光加工的多种材料的方法和系统
公开(公告)号：US20080284837A1
公开(公告)日：2008-11-20
申请号：US12165853
申请日：2008-07-01
申请人： James J. Cordingley , Jonathan S. Ehrmann , David M. Filgas , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
发明人： James J. Cordingley , Jonathan S. Ehrmann , David M. Filgas , Shepard D. Johnson , Joohan Lee , Donald V. Smart , Donald J. Svetkoff
IPC分类号： B41J2/435 , G01B11/14
CPC分类号： B23K26/0736 , B23K26/032 , B23K26/04 , B23K26/043 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0652 , B23K26/0665 , B23K26/067 , B23K26/082 , B23K26/10 , B23K26/16 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/10 , B23K2103/12 , B23K2103/172 , B23K2103/50 , H01L21/485 , H01L21/76888 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.
摘要翻译：提供一种用于局部处理形成在基板上的预定微结构而不引起基板或其上形成在基板上的其它结构的电学或物理特性的不期望的变化的方法和系统。该方法包括基于与预定微结构，衬底和其它结构的激光脉冲相互作用的模型来提供信息。基于该信息确定至少一个脉冲的至少一个特性。生成包括至少一个脉冲的脉冲激光束。该方法还包括将具有至少一个确定特性的至少一个脉冲照射到预定微结构上的点中。所述至少一个脉冲的至少一个确定的特征和其它特征足以在不引起不期望的变化的情况下局部地处理预定的微结构。

10. 发明授权

US07027155B2 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure 失效
公开(公告)号：US07027155B2
公开(公告)日：2006-04-11
申请号：US10107702
申请日：2002-03-27
申请人： James J. Cordingley , Joseph J. Griffiths , Donald V. Smart
发明人： James J. Cordingley , Joseph J. Griffiths , Donald V. Smart
IPC分类号： G01B11/26
CPC分类号： B23K26/0736 , B23K26/032 , B23K26/04 , B23K26/043 , B23K26/0613 , B23K26/0622 , B23K26/0624 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0652 , B23K26/0665 , B23K26/067 , B23K26/082 , B23K26/10 , B23K26/16 , B23K26/361 , B23K26/389 , B23K26/40 , B23K2101/38 , B23K2101/40 , B23K2103/10 , B23K2103/12 , B23K2103/172 , B23K2103/50 , H01L21/485 , H01L21/76888 , H01L21/76894 , H01L22/12 , H01L23/5258 , H01L2924/0002 , H05K3/0026 , H01L2924/00
摘要： A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes.

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