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1. 发明授权

US5362975A Diamond-based chemical sensors 失效
标题翻译：基于钻石的化学传感器
公开(公告)号：US5362975A
公开(公告)日：1994-11-08
申请号：US89170
申请日：1993-07-08
申请人： Jesko von Windheim , Vasudev Venkatesan
发明人： Jesko von Windheim , Vasudev Venkatesan
IPC分类号： G01N27/12 , G01N27/00 , H01L29/16 , H01L29/45 , H01L29/47 , H01L29/872 , H01L29/66
CPC分类号： H01L29/1602 , G01N27/129 , H01L29/45 , H01L29/872
摘要： A chemical sensor includes a diode or a transistor fabricated in diamond. A diamond-based diode chemical sensor includes a first diamond layer of first conductivity type and a second diamond or non-diamond layer of second conductivity type. A relatively highly doped region is formed in the first diamond layer, adjacent an electrical contact to reduce the frequency dependance of the sensor's capacitance/voltage characteristic. A diamond-based transistor sensor includes a controlling electrode such as a gate which is configured to allow a chemical external to the transistor to alter the characteristics of the transistor. Relatively highly doped regions are formed adjacent the transistor's controlling electrodes, such as the source and drain. A heater is thermally coupled to the sensor for heating the sensor to a predetermined operating temperature. A temperature monitor is also coupled to the sensor for monitoring the sensor temperature.
摘要翻译：化学传感器包括二极管或以金刚石制造的晶体管。金刚石二极管化学传感器包括第一导电类型的第一金刚石层和第二导电类型的第二金刚石或非金刚石层。在第一金刚石层中形成相对高掺杂的区域，与电触点相邻，以降低传感器电容/电压特性的频率依赖性。基于金刚石的晶体管传感器包括诸如栅极的控制电极，其被配置为允许晶体管外部的化学物质改变晶体管的特性。在晶体管的控制电极（例如源极和漏极）附近形成相对高掺杂的区域。加热器热耦合到传感器，用于将传感器加热到预定的工作温度。温度监测器还耦合到传感器用于监测传感器温度。

2. 发明授权

US5285084A Diamond schottky diodes and gas sensors fabricated therefrom 失效
标题翻译：金刚石肖特基二极管和由此制造的气体传感器
公开(公告)号：US5285084A
公开(公告)日：1994-02-08
申请号：US939446
申请日：1992-09-02
申请人： Jesko von Windheim , Vasudev Venkatesan
发明人： Jesko von Windheim , Vasudev Venkatesan
IPC分类号： G01N27/00 , H01L29/16 , H01L29/45 , H01L29/872 , H01L29/66
CPC分类号： H01L29/872 , G01N27/129 , H01L29/1602 , H01L29/45
摘要： Schottky diodes and gas sensors include a diamond layer having a Schottky contact thereon and an ohmic contact thereon, wherein the diamond layer includes a highly doped region adjacent the ohmic contact to provide a low resistance ohmic contact. Dramatically reduced frequency dependence of the capacitance/voltage characteristic of Schottky diodes and gas sensors formed thereby, compared to Schottky diodes and gas sensors which do not include the highly doped region adjacent the ohmic contact, is provided. The highly doped region is preferably boron doped at a concentration of at least 10.sup.20 atoms per cubic centimeter to form an ohmic contact with a contact resistance of less than 10.sup.-3 .OMEGA.-cm.sup.2. The ohmic contact is preferably a back contact on the face of the diamond layer opposite the Schottky contact.
摘要翻译：肖特基二极管和气体传感器包括其上具有肖特基接触和其上的欧姆接触的金刚石层，其中金刚石层包括邻近欧姆接触的高掺杂区域以提供低电阻欧姆接触。提供了与肖特基二极管和气体传感器相比较的肖特基二极管和由此形成的气体传感器的电容/电压特性显着降低的频率依赖性，其不包括与欧姆接触相邻的高掺杂区域。高掺杂区域优选以至少1020个原子/立方厘米的浓度掺杂硼以形成具有小于10-3（Ω·cm-cm）的接触电阻的欧姆接触。欧姆接触优选为与肖特基接触相对的金刚石层的表面上的背接触。

3. 发明申请

US20080168775A1 Temperature Control Including Integrated Thermoelectric Temperature Sensing and Related Methods and Systems 审中-公开
标题翻译：包括集成热电温度检测及相关方法和系统的温度控制
公开(公告)号：US20080168775A1
公开(公告)日：2008-07-17
申请号：US11972267
申请日：2008-01-10
申请人： Jesko von Windheim , Seri Lee
发明人： Jesko von Windheim , Seri Lee
IPC分类号： F25B21/02 , H01L35/30
CPC分类号： F25B21/02 , F25B2321/021 , H01L23/34 , H01L23/38 , H01L35/30 , H01L2924/0002 , H01S5/02415 , H01L2924/00
摘要： A temperature control system may include a thermoelectric device and a controller electrically coupled to the thermoelectric device. The controller may be configured to sense a first value of an electrical characteristic of the thermoelectric device, and to generate a first electrical control signal to pump heat through the thermoelectric device in response to sensing the first value of the electrical characteristic of the thermoelectric device. The controller may be further configured to sense a second value of the electrical characteristic of the thermoelectric device wherein the first and second values of the electrical characteristic are different, and to generate a second electrical control signal to pump heat through the thermoelectric device in response to sensing the second electrical characteristic of the thermoelectric device with the first and second electrical control signals being different. Related methods are also discussed.
摘要翻译：温度控制系统可以包括热电装置和电耦合到热电装置的控制器。控制器可以被配置为感测热电装置的电特性的第一值，并且响应于感测热电装置的电特性的第一值而产生第一电控制信号以泵送通过热电装置的热量。控制器还可以被配置为感测热电装置的电特性的第二值，其中电特性的第一和第二值不同，并产生第二电控信号以响应于感测第一和第二电气控制信号不同的热电装置的第二电特性。还讨论了相关方法。

4. 发明授权

US10390991B2 Medical devices incorporating thermoelectric transducer and controller 有权
公开(公告)号：US10390991B2
公开(公告)日：2019-08-27
申请号：US13584853
申请日：2012-08-14
申请人： Lesco L. Rogers , Jesko von Windheim , Seri Lee
发明人： Lesco L. Rogers , Jesko von Windheim , Seri Lee
IPC分类号： A61F7/00 , F25B21/02 , H01L35/32
摘要： A temperature control system may include a thermoelectric device, a controller electrically coupled to the thermoelectric device, a heat transfer structure thermally coupled to the thermoelectric device, a temperature controlled medium thermally coupled to the thermoelectric device and a temperature feedback sensor. The controller may be configured to sense a first value of an electrical characteristic of the thermoelectric device and to generate a first electrical control to activate the thermoelectric device in response to sensing the first value of the electrical characteristic of the thermoelectric device. The controller may be further configured to sense a second value of the electrical characteristic of the thermoelectric device and to generate a second electrical control signal to activate the thermoelectric device in response to sensing the second value of the electrical characteristic of the thermoelectric device.

5. 发明授权

US07855397B2 Electronic assemblies providing active side heat pumping 有权
标题翻译：电子组件提供主动侧热泵
公开(公告)号：US07855397B2
公开(公告)日：2010-12-21
申请号：US12016720
申请日：2008-01-18
申请人： Randall G. Alley , Philip A. Deane , David A. Koester , Thomas Peter Schneider , Jesko von Windheim
发明人： Randall G. Alley , Philip A. Deane , David A. Koester , Thomas Peter Schneider , Jesko von Windheim
IPC分类号： H01L33/00 , H01L23/34 , H01L35/02 , H01L21/00
CPC分类号： H01L23/38 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L27/16 , H01L2224/0401 , H01L2224/05111 , H01L2224/05144 , H01L2224/05147 , H01L2224/05568 , H01L2224/05611 , H01L2224/05644 , H01L2224/06102 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16 , H01L2224/16235 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01052 , H01L2924/0106 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/00014 , H01L2924/014 , H01L2224/13099 , H01L2924/00 , H01L2224/05552 , H01L2924/0105
摘要： An electronic assembly may include a packaging substrate, an integrated circuit (IC) semiconductor chip, a plurality of metal interconnection structures, and a thermoelectric heat pump. The integrated circuit (IC) semiconductor chip may have an active side including input/output pads thereon and a back side opposite the active side, and the IC semiconductor chip may be arranged with the active side facing the first surface of the packaging substrate. The plurality of metal interconnection structures may be between the active side of the IC semiconductor chip and the first surface of the packaging substrate, and the plurality of metal interconnection structures may provide mechanical connection between the active side of the IC semiconductor chip and the first surface of the packaging substrate. The thermoelectric heat pump may be coupled to the packaging substrate with the thermoelectric heat pump being configured to actively pump heat between the IC semiconductor chip and the packaging substrate. Related methods and structures are also discussed.
摘要翻译：电子组件可以包括封装衬底，集成电路（IC）半导体芯片，多个金属互连结构和热电热泵。集成电路（IC）半导体芯片可以具有包括其上的输入/输出焊盘和与有源侧相反的背面的有源侧，并且IC半导体芯片可以布置成有效侧面向封装基板的第一表面。多个金属互连结构可以在IC半导体芯片的有源侧和封装基板的第一表面之间，并且多个金属互连结构可以在IC半导体芯片的有源侧和第一表面之间提供机械连接的包装基板。热电热泵可以耦合到封装衬底，热电热泵构造成主动地泵送IC半导体芯片和封装衬底之间的热量。还讨论了相关的方法和结构。

6. 发明申请

US20090072385A1 Electronic Assemblies Providing Active Side Heat Pumping and Related Methods and Structures 有权
标题翻译：提供有源侧热泵的电子组件及相关方法和结构
公开(公告)号：US20090072385A1
公开(公告)日：2009-03-19
申请号：US12016720
申请日：2008-01-18
申请人： Randall G. Alley , Philip A. Deane , David A. Koester , Thomas Peter Schneider , Jesko Von Windheim
发明人： Randall G. Alley , Philip A. Deane , David A. Koester , Thomas Peter Schneider , Jesko Von Windheim
IPC分类号： H01L23/38 , H01L21/58
CPC分类号： H01L23/38 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L27/16 , H01L2224/0401 , H01L2224/05111 , H01L2224/05144 , H01L2224/05147 , H01L2224/05568 , H01L2224/05611 , H01L2224/05644 , H01L2224/06102 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16 , H01L2224/16235 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01052 , H01L2924/0106 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/00014 , H01L2924/014 , H01L2224/13099 , H01L2924/00 , H01L2224/05552 , H01L2924/0105
摘要： An electronic assembly may include a packaging substrate, an integrated circuit (IC) semiconductor chip, a plurality of metal interconnection structures, and a thermoelectric heat pump. The integrated circuit (IC) semiconductor chip may have an active side including input/output pads thereon and a back side opposite the active side, and the IC semiconductor chip may be arranged with the active side facing the first surface of the packaging substrate. The plurality of metal interconnection structures may be between the active side of the IC semiconductor chip and the first surface of the packaging substrate, and the plurality of metal interconnection structures may provide mechanical connection between the active side of the IC semiconductor chip and the first surface of the packaging substrate. The thermoelectric heat pump may be coupled to the packaging substrate with the thermoelectric heat pump being configured to actively pump heat between the IC semiconductor chip and the packaging substrate. Related methods and structures are also discussed.
摘要翻译：电子组件可以包括封装衬底，集成电路（IC）半导体芯片，多个金属互连结构和热电热泵。集成电路（IC）半导体芯片可以具有包括其上的输入/输出焊盘和与有源侧相反的背面的有源侧，并且IC半导体芯片可以布置成有效侧面向封装基板的第一表面。多个金属互连结构可以在IC半导体芯片的有源侧和封装基板的第一表面之间，并且多个金属互连结构可以在IC半导体芯片的有源侧和第一表面之间提供机械连接的包装基板。热电热泵可以耦合到封装衬底，热电热泵构造成主动地泵送IC半导体芯片和封装衬底之间的热量。还讨论了相关的方法和结构。

7. 发明申请

US20080264464A1 Temperature Control Including Integrated Thermoelectric Sensing and Heat Pumping Devices and Related Methods and Systems 审中-公开
标题翻译：包括集成热电传感和热泵设备的温度控制及相关方法和系统
公开(公告)号：US20080264464A1
公开(公告)日：2008-10-30
申请号：US12166953
申请日：2008-07-02
申请人： SERI LEE , JESKO VON WINDHEIM , RAMASWAMY MAHADEVAN
发明人： SERI LEE , JESKO VON WINDHEIM , RAMASWAMY MAHADEVAN
IPC分类号： H01L35/34 , H01L35/28
CPC分类号： F25B21/02 , A61F7/007 , A61F2007/0075 , F25B2321/021 , H01L35/32
摘要： A temperature control system may include a thermoelectric device, and a controller electrically coupled to the thermoelectric device. The controller may be configured to apply an AC signal to the thermoelectric device, and to sense an electrical characteristic of the thermoelectric device using the AC signal. The controller may also be configured to generate an electrical control signal to pump heat through the thermoelectric device responsive to sensing the electrical characteristic of the thermoelectric device using the AC signal. Related methods are also discussed.
摘要翻译：温度控制系统可以包括热电装置和电耦合到热电装置的控制器。控制器可以被配置为向热电装置施加AC信号，并且使用AC信号感测热电装置的电特性。控制器还可以被配置为响应于使用AC信号感测热电装置的电特性而产生电控制信号以泵送通过热电装置的热量。还讨论了相关方法。

8. 发明授权

US5679895A Diamond field emission acceleration sensor 失效
标题翻译：钻石场发射加速度传感器
公开(公告)号：US5679895A
公开(公告)日：1997-10-21
申请号：US432518
申请日：1995-05-01
申请人： Jesko von Windheim
发明人： Jesko von Windheim
IPC分类号： G01P15/08
CPC分类号： G01P15/0894
摘要： An acceleration sensor includes an acceleration mass and a substrate mounted so that a cavity is defined therebetween and so that the acceleration mass moves relative to the substrate when an acceleration of the sensor changes. The sensor also includes a diamond field emitter for generating an electron beam through the cavity between the acceleration mass and the substrate. Accordingly, the distance between the acceleration mass and the substrate affects the current of the electron beam which is measured to determine the acceleration of the sensor. The sensor may alternately include an annular extraction electrode in a cavity between a substrate and a collector together with a diamond field emitter for generating an electron beam which passes through the annular extraction electrode. The annular extraction electrode is moveable relative to the substrate in response to changes in an acceleration acting on the sensor. Accordingly, the electron beam current changes as the annular extraction electrode moves, and the current can be measured to determine the acceleration acting on the sensor.
摘要翻译：加速度传感器包括加速度质量和安装的基板，以便在传感器的加速度变化时使空腔在其间限定，使得加速质量相对于基板移动。传感器还包括金刚石场发射器，用于通过加速质量块和衬底之间的空腔产生电子束。因此，加速质量和衬底之间的距离影响测量的电子束的电流，以确定传感器的加速度。该传感器可以在金属场发射器和衬底与集电器之间的空腔中交替地包括环形引出电极，用于产生通过环形引出电极的电子束。响应于作用在传感器上的加速度的变化，环形引出电极可相对于基板移动。因此，随着环状引出电极移动，电子束电流变化，可以测量电流以确定作用在传感器上的加速度。

9. 发明申请

US20120310313A1 Medical Devices Incorporating Thermoelectric Transducer and Controller 审中-公开
标题翻译：集成热电传感器和控制器的医疗设备
公开(公告)号：US20120310313A1
公开(公告)日：2012-12-06
申请号：US13584853
申请日：2012-08-14
申请人： Lesco L. Rogers , Jesko von Windheim , Seri Lee
发明人： Lesco L. Rogers , Jesko von Windheim , Seri Lee
IPC分类号： A61N1/36
CPC分类号： A61F7/007 , A61F2007/0075 , F25B21/02 , F25B2321/021 , H01L35/32
摘要： A temperature control system may include a thermoelectric device, a controller electrically coupled to the thermoelectric device, a heat transfer structure thermally coupled to the thermoelectric device, a temperature controlled medium thermally coupled to the thermoelectric device and a temperature feedback sensor. The controller may be configured to sense a first value of an electrical characteristic of the thermoelectric device and to generate a first electrical control to activate the thermoelectric device in response to sensing the first value of the electrical characteristic of the thermoelectric device. The controller may be further configured to sense a second value of the electrical characteristic of the thermoelectric device and to generate a second electrical control signal to activate the thermoelectric device in response to sensing the second value of the electrical characteristic of the thermoelectric device.
摘要翻译：温度控制系统可以包括热电装置，电耦合到热电装置的控制器，热耦合到热电装置的热传递结构，热耦合到热电装置的温度控制介质和温度反馈传感器。控制器可以被配置为感测热电装置的电特性的第一值，并且响应于感测热电装置的电特性的第一值而产生第一电控制以激活热电装置。控制器还可以被配置成感测热电装置的电特性的第二值，并且响应于感测热电装置的电特性的第二值而产生第二电控制信号以激活热电装置。

10. 发明授权

US08267983B2 Medical devices incorporating thermoelectric transducer and controller 有权
标题翻译：结合热电换能器和控制器的医疗设备
公开(公告)号：US08267983B2
公开(公告)日：2012-09-18
申请号：US12693016
申请日：2010-01-25
申请人： Lesco L. Rogers , Jesko von Windheim , Seri Lee
发明人： Lesco L. Rogers , Jesko von Windheim , Seri Lee
IPC分类号： A61F7/12
CPC分类号： F25B21/02 , A61F7/007 , A61F2007/0075 , F25B2321/021 , H01L35/32
摘要： A temperature control system may include a thermoelectric device, a controller electrically coupled to the thermoelectric device, a heat transfer structure thermally coupled to the thermoelectric device, and a temperature controlled medium thermally coupled to the thermoelectric device. The controller may be configured to sense a first value of an electrical characteristic of the thermoelectric device and to generate a first electrical control signal to pump heat through the thermoelectric device in response to sensing the first value of the electrical characteristic of the thermoelectric device. The controller may be further configured to sense a second value of the electrical characteristic of the thermoelectric device and to generate a second electrical control signal to pump heat through the thermoelectric device in response to sensing the second value of the electrical characteristic of the thermoelectric device.
摘要翻译：温度控制系统可以包括热电装置，电耦合到热电装置的控制器，热耦合到热电装置的热传递结构，以及热耦合到热电装置的温度控制介质。控制器可以被配置为响应于感测热电装置的电特性的第一值而感测热电装置的电特性的第一值并且产生第一电控制信号以便通过热电装置泵送热量。控制器还可以被配置为响应于感测热电装置的电特性的第二值而感测热电装置的电特性的第二值并且产生第二电控制信号以便通过热电装置泵送热量。

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