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1. 发明授权

US07855397B2 Electronic assemblies providing active side heat pumping 有权
标题翻译：电子组件提供主动侧热泵
公开(公告)号：US07855397B2
公开(公告)日：2010-12-21
申请号：US12016720
申请日：2008-01-18
申请人： Randall G. Alley , Philip A. Deane , David A. Koester , Thomas Peter Schneider , Jesko von Windheim
发明人： Randall G. Alley , Philip A. Deane , David A. Koester , Thomas Peter Schneider , Jesko von Windheim
IPC分类号： H01L33/00 , H01L23/34 , H01L35/02 , H01L21/00
CPC分类号： H01L23/38 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L27/16 , H01L2224/0401 , H01L2224/05111 , H01L2224/05144 , H01L2224/05147 , H01L2224/05568 , H01L2224/05611 , H01L2224/05644 , H01L2224/06102 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16 , H01L2224/16235 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01052 , H01L2924/0106 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/00014 , H01L2924/014 , H01L2224/13099 , H01L2924/00 , H01L2224/05552 , H01L2924/0105
摘要： An electronic assembly may include a packaging substrate, an integrated circuit (IC) semiconductor chip, a plurality of metal interconnection structures, and a thermoelectric heat pump. The integrated circuit (IC) semiconductor chip may have an active side including input/output pads thereon and a back side opposite the active side, and the IC semiconductor chip may be arranged with the active side facing the first surface of the packaging substrate. The plurality of metal interconnection structures may be between the active side of the IC semiconductor chip and the first surface of the packaging substrate, and the plurality of metal interconnection structures may provide mechanical connection between the active side of the IC semiconductor chip and the first surface of the packaging substrate. The thermoelectric heat pump may be coupled to the packaging substrate with the thermoelectric heat pump being configured to actively pump heat between the IC semiconductor chip and the packaging substrate. Related methods and structures are also discussed.
摘要翻译：电子组件可以包括封装衬底，集成电路（IC）半导体芯片，多个金属互连结构和热电热泵。集成电路（IC）半导体芯片可以具有包括其上的输入/输出焊盘和与有源侧相反的背面的有源侧，并且IC半导体芯片可以布置成有效侧面向封装基板的第一表面。多个金属互连结构可以在IC半导体芯片的有源侧和封装基板的第一表面之间，并且多个金属互连结构可以在IC半导体芯片的有源侧和第一表面之间提供机械连接的包装基板。热电热泵可以耦合到封装衬底，热电热泵构造成主动地泵送IC半导体芯片和封装衬底之间的热量。还讨论了相关的方法和结构。

2. 发明申请

US20090072385A1 Electronic Assemblies Providing Active Side Heat Pumping and Related Methods and Structures 有权
标题翻译：提供有源侧热泵的电子组件及相关方法和结构
公开(公告)号：US20090072385A1
公开(公告)日：2009-03-19
申请号：US12016720
申请日：2008-01-18
申请人： Randall G. Alley , Philip A. Deane , David A. Koester , Thomas Peter Schneider , Jesko Von Windheim
发明人： Randall G. Alley , Philip A. Deane , David A. Koester , Thomas Peter Schneider , Jesko Von Windheim
IPC分类号： H01L23/38 , H01L21/58
CPC分类号： H01L23/38 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L27/16 , H01L2224/0401 , H01L2224/05111 , H01L2224/05144 , H01L2224/05147 , H01L2224/05568 , H01L2224/05611 , H01L2224/05644 , H01L2224/06102 , H01L2224/1308 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16 , H01L2224/16235 , H01L2924/00013 , H01L2924/0002 , H01L2924/01005 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01052 , H01L2924/0106 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/10329 , H01L2924/12041 , H01L2924/14 , H01L2924/00014 , H01L2924/014 , H01L2224/13099 , H01L2924/00 , H01L2224/05552 , H01L2924/0105
摘要： An electronic assembly may include a packaging substrate, an integrated circuit (IC) semiconductor chip, a plurality of metal interconnection structures, and a thermoelectric heat pump. The integrated circuit (IC) semiconductor chip may have an active side including input/output pads thereon and a back side opposite the active side, and the IC semiconductor chip may be arranged with the active side facing the first surface of the packaging substrate. The plurality of metal interconnection structures may be between the active side of the IC semiconductor chip and the first surface of the packaging substrate, and the plurality of metal interconnection structures may provide mechanical connection between the active side of the IC semiconductor chip and the first surface of the packaging substrate. The thermoelectric heat pump may be coupled to the packaging substrate with the thermoelectric heat pump being configured to actively pump heat between the IC semiconductor chip and the packaging substrate. Related methods and structures are also discussed.
摘要翻译：电子组件可以包括封装衬底，集成电路（IC）半导体芯片，多个金属互连结构和热电热泵。集成电路（IC）半导体芯片可以具有包括其上的输入/输出焊盘和与有源侧相反的背面的有源侧，并且IC半导体芯片可以布置成有效侧面向封装基板的第一表面。多个金属互连结构可以在IC半导体芯片的有源侧和封装基板的第一表面之间，并且多个金属互连结构可以在IC半导体芯片的有源侧和第一表面之间提供机械连接的包装基板。热电热泵可以耦合到封装衬底，热电热泵构造成主动地泵送IC半导体芯片和封装衬底之间的热量。还讨论了相关的方法和结构。

3. 发明授权

US07042306B2 Three dimensional multimode and optical coupling devices 有权
标题翻译：三维多模和光耦合器件
公开(公告)号：US07042306B2
公开(公告)日：2006-05-09
申请号：US10884963
申请日：2004-07-07
申请人： Mark W. Roberson , Philip A. Deane , Charles Kenneth Williams
发明人： Mark W. Roberson , Philip A. Deane , Charles Kenneth Williams
IPC分类号： H01P5/00 , G02B6/26
CPC分类号： H01P5/185 , H01P5/187
摘要： Three dimensional electronic and optical coupling devices that are capable of providing high speed coupling over a large frequency range while limiting the amount of space consumption in the communications network. An optical or electrical coupling device comprises a first substrate and a second substrate adjacent to the first substrate having one or more optical waveguides or microstrips formed thereon. The substrates will have disposed thereon conductive microstrips and/or dielectric elements. The one or more optical waveguides or microstrips formed on the first substrate correspond to at least one optical waveguides or microstrips formed on the second substrate so as to facilitate optical coupling between the corresponding waveguides. Precise spacing between the substrates and precise spacing between the optical waveguides or microstrips facilitate the requisite optical/RF coupling.
摘要翻译：三维电子和光耦合器件能够在大的频率范围内提供高速耦合，同时限制通信网络中的空间消耗量。光学或电耦合装置包括第一衬底和与第一衬底相邻的第二衬底，其具有在其上形成的一个或多个光波导或微带。衬底将布置在其上导电微带和/或电介质元件。形成在第一基板上的一个或多个光波导或微带对应于形成在第二基板上的至少一个光波导或微带，以便于相应波导之间的光耦合。基板之间的精确间隔和光波导或微带之间的精确间隔有助于所需的光/ RF耦合。

4. 发明授权

US06233088B1 Methods for modulating a radiation signal 有权
标题翻译：调制辐射信号的方法
公开(公告)号：US06233088B1
公开(公告)日：2001-05-15
申请号：US09636141
申请日：2000-08-10
申请人： Mark W. Roberson , Glenn A. Rinne , Philip A. Deane , Karen W. Markus
发明人： Mark W. Roberson , Glenn A. Rinne , Philip A. Deane , Karen W. Markus
IPC分类号： G02B2600
CPC分类号： G01S17/74 , G01S13/756 , G01S13/78 , G02B5/122
摘要： A reflector having a mechanically deformable portion of at least one reflective surface is disclosed. By deforming the portion of the reflective surface, discontinuity is introduced in that portion of the reflective surface. The discontinuity in the reflective surface scatters incident radiation signals so as to cause attenuation in the reflected signal. By selectively deforming the portion of the reflective surface, the reflected signal can be modulated to encode data thereon. The mechanically deformable portion of the reflective surface preferably comprises plates integrally formed therein.
摘要翻译：公开了一种具有至少一个反射表面的机械可变形部分的反射器。通过使反射表面的部分变形，在反射表面的该部分中引入不连续性。反射表面中的不连续性散射入射辐射信号，从而导致反射信号中的衰减。通过选择性地使反射表面的部分变形，可以调制反射信号以在其上编码数据。反射表面的机械可变形部分优选地包括一体地形成在其中的板。

5. 发明授权

US08525016B2 Thermoelectric devices including thermoelectric elements having off-set metal pads and related structures, methods, and systems 有权
标题翻译：包括具有偏置金属焊盘的热电元件和相关结构，方法和系统的热电装置
公开(公告)号：US08525016B2
公开(公告)日：2013-09-03
申请号：US12731546
申请日：2010-03-25
申请人： Philip A. Deane , Ramaswamy Mahadevan , Edward P. Siivola
发明人： Philip A. Deane , Ramaswamy Mahadevan , Edward P. Siivola
IPC分类号： H01L35/02 , H01L37/00
CPC分类号： H01L35/08 , H01L35/32
摘要： A thermoelectric device may include a thermoelectric element including a layer of a thermoelectric material and having opposing first and second surfaces. A first metal pad may be provided on the first surface of the thermoelectric element, and a second metal pad may be provided on the second surface of the thermoelectric element. In addition, the first and second metal pads may be off-set in a direction parallel with respect to the first and second surfaces of the thermoelectric element. Related methods are also discussed.
摘要翻译：热电装置可以包括包括热电材料层并具有相对的第一和第二表面的热电元件。可以在热电元件的第一表面上设置第一金属焊盘，并且可以在热电元件的第二表面上设置第二金属焊盘。此外，第一和第二金属焊盘可以在相对于热电元件的第一和第二表面平行的方向上偏移。还讨论了相关方法。

6. 发明申请

US20110132000A1 Thermoelectric Heating/Cooling Structures Including a Plurality of Spaced Apart Thermoelectric Components 审中-公开
标题翻译：包括多个间隔热电组件的热电加热/冷却结构
公开(公告)号：US20110132000A1
公开(公告)日：2011-06-09
申请号：US12963750
申请日：2010-12-09
申请人： Philip A. Deane , Edward P. Siivola , Paul Crocco , Ramaswamy Mahadevan
发明人： Philip A. Deane , Edward P. Siivola , Paul Crocco , Ramaswamy Mahadevan
IPC分类号： F25B21/04
CPC分类号： F25B21/04 , G01R31/2874
摘要： A thermoelectric heating/cooling structure may include a heat exchanger and a heat spreader spaced apart from the heat exchanger. In addition, a plurality of spaced apart thermoelectric components may be thermally coupled in parallel between the heat exchanger and the heat spreader. More particularly, each of the thermoelectric components may include a first header adjacent the heat exchanger, a second header adjacent the heat spreader, and a plurality of thermoelectric elements thermally coupled in parallel between the first and second headers. The first headers of the thermoelectric components may be spaced apart adjacent the heat exchanger, and the second headers of the thermoelectric components may be spaced apart adjacent the heat spreader.
摘要翻译：热电加热/冷却结构可以包括热交换器和与热交换器间隔开的散热器。此外，多个间隔开的热电组件可以在热交换器和散热器之间并联热耦合。更具体地，每个热电部件可以包括邻近热交换器的第一集管，邻近散热器的第二集管和在第一和第二集管之间并联热耦合的多个热电元件。热电部件的第一集管可以邻近热交换器间隔开，并且热电部件的第二集管可以在散热器附近间隔开。

7. 发明授权

US06137623A Modulatable reflectors and methods for using same 失效
标题翻译：可调式反射器及其使用方法
公开(公告)号：US06137623A
公开(公告)日：2000-10-24
申请号：US42836
申请日：1998-03-17
申请人： Mark W. Roberson , Glenn A. Rinne , Philip A. Deane , Karen W. Markus
发明人： Mark W. Roberson , Glenn A. Rinne , Philip A. Deane , Karen W. Markus
IPC分类号： G02B26/08 , G01S13/02 , G01S13/75 , G01S13/78 , G01S17/74 , G02B5/122 , G02B26/00
CPC分类号： G01S17/74 , G02B5/122 , G01S13/756 , G01S13/78
摘要： A reflector having a mechanically deformable portion of at least one reflective surface is disclosed. By deforming the portion of the reflective surface, discontinuity is introduced in that portion of the reflective surface. The discontinuity in the reflective surface scatters incident radiation signals so as to cause attenuation in the reflected signal. By selectively deforming the portion of the reflective surface, the reflected signal can be modulated to encode data thereon. The mechanically deformable portion of the reflective surface preferably comprises plates integrally formed therein.
摘要翻译：公开了一种具有至少一个反射表面的机械可变形部分的反射器。通过使反射表面的部分变形，在反射表面的该部分中引入不连续性。反射表面中的不连续性散射入射辐射信号，从而导致反射信号中的衰减。通过选择性地使反射表面的部分变形，可以调制反射信号以在其上编码数据。反射表面的机械可变形部分优选地包括一体地形成在其中的板。

8. 发明授权

US5793116A Microelectronic packaging using arched solder columns 失效
公开(公告)号：US5793116A
公开(公告)日：1998-08-11
申请号：US654539
申请日：1996-05-29
申请人： Glenn A. Rinne , Philip A. Deane
发明人： Glenn A. Rinne , Philip A. Deane
IPC分类号： H05K1/14 , H01L23/485 , H01L25/00 , H01L25/065 , H01L25/10 , H05K3/30 , H05K3/36 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H01L24/10 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/065 , H01L25/0652 , H01L25/0657 , H01L25/105 , H01L2224/13 , H01L2224/13099 , H01L2224/16105 , H01L2224/16108 , H01L2225/06513 , H01L2225/0652 , H01L2225/06551 , H01L2225/06555 , H01L2225/06572 , H01L2225/1058 , H01L2225/1064 , H01L2225/107 , H01L2924/00011 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01087 , H01L2924/01322 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/1423 , H01L2924/15787 , H05K3/306
摘要： Microelectronic packages are formed wherein solder bumps on one or more substrates are expanded, to thereby extend and contact the second substrate and form a solder connection. The solder bumps are preferably expanded by reflowing additional solder into the plurality of solder bumps. The additional solder may be reflowed from an elongated, narrow solder-containing region adjacent the solder bump, into the solder bump. After reflow, the solder bump which extends across a pair of adjacent substrates forms an arched solder column or partial ring of solder between the two substrates.

9. 发明申请

US20100252087A1 THERMOELECTRIC DEVICES INCLUDING THERMOELECTRIC ELEMENTS HAVING OFF-SET METAL PADS AND RELATED STRUCTURES, METHODS, AND SYSTEMS 有权
标题翻译：包括具有偏置金属垫片的热电元件和相关结构，方法和系统的热电设备
公开(公告)号：US20100252087A1
公开(公告)日：2010-10-07
申请号：US12731546
申请日：2010-03-25
申请人： Philip A. Deane , Ramaswamy Mahadevan , Edward P. Siivola
发明人： Philip A. Deane , Ramaswamy Mahadevan , Edward P. Siivola
IPC分类号： H01L35/20 , H01L35/00 , B05D5/12 , B29C65/56
CPC分类号： H01L35/08 , H01L35/32
摘要： A thermoelectric device may include a thermoelectric element including a layer of a thermoelectric material and having opposing first and second surfaces. A first metal pad may be provided on the first surface of the thermoelectric element, and a second metal pad may be provided on the second surface of the thermoelectric element. In addition, the first and second metal pads may be off-set in a direction parallel with respect to the first and second surfaces of the thermoelectric element. Related methods are also discussed.
摘要翻译：热电装置可以包括包括热电材料层并具有相对的第一和第二表面的热电元件。可以在热电元件的第一表面上设置第一金属焊盘，并且可以在热电元件的第二表面上设置第二金属焊盘。此外，第一和第二金属焊盘可以在相对于热电元件的第一和第二表面平行的方向上偏移。还讨论了相关方法。

10. 发明授权

US06906598B2 Three dimensional multimode and optical coupling devices 失效
标题翻译：三维多模和光耦合器件
公开(公告)号：US06906598B2
公开(公告)日：2005-06-14
申请号：US10334985
申请日：2002-12-31
申请人： Mark W. Roberson , Philip A. Deane , Charles Kenneth Williams
发明人： Mark W. Roberson , Philip A. Deane , Charles Kenneth Williams
IPC分类号： G02B6/30 , H01P5/18 , H01P5/00
CPC分类号： H01P5/185 , H01P5/187
摘要： Three dimensional electronic and optical coupling devices that are capable of providing high speed coupling over a large frequency range while limiting the amount of space consumption in the communications network. An optical or electrical coupling device comprises a first substrate and a second substrate adjacent to the first substrate having one or more optical waveguides or microstrips formed thereon. The substrates will have disposed thereon conductive microstrips and/or dielectric elements. The one or more optical waveguides or microstrips formed on the first substrate correspond to at least one optical waveguides or microstrips formed on the second substrate so as to facilitate optical coupling between the corresponding waveguides. Precise spacing between the substrates and precise spacing between the optical waveguides or microstrips facilitate the requisite optical/RF coupling.
摘要翻译：三维电子和光耦合器件能够在大的频率范围内提供高速耦合，同时限制通信网络中的空间消耗量。光学或电耦合装置包括第一衬底和与第一衬底相邻的第二衬底，其具有在其上形成的一个或多个光波导或微带。衬底将布置在其上导电微带和/或电介质元件。形成在第一基板上的一个或多个光波导或微带对应于形成在第二基板上的至少一个光波导或微带，以便于相应波导之间的光耦合。基板之间的精确间隔和光波导或微带之间的精确间隔有助于所需的光/ RF耦合。

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