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    • 1. 发明授权
    • Non-volatile memory devices
    • 非易失性存储器件
    • US08675409B2
    • 2014-03-18
    • US13463060
    • 2012-05-03
    • Jong-Sun SelJung-Dal ChoiYoung-Woo ParkJin-Taek Park
    • Jong-Sun SelJung-Dal ChoiYoung-Woo ParkJin-Taek Park
    • G11C11/34G11C16/04
    • G11C16/0483G11C16/3427
    • A non-volatile memory device may include a semiconductor substrate including an active region at a surface thereof, a ground select line crossing the active region, and a string select line crossing the active region and spaced apart from the ground select line. A plurality of memory cell word lines may cross the active region between the ground select line and the string select line with about a same first spacing provided between adjacent ones of the plurality of word lines and between a last of the plurality of memory cell word lines and the string select line. A second spacing may be provided between the ground select line and a first of the plurality of memory cell word lines.
    • 非易失性存储器件可以包括半导体衬底,其包括其表面处的有源区,与有源区交叉的接地选择线,以及与有源区交叉并与地选线相隔的串选择线。 多个存储单元字线可以与地线选择线和弦选择线之间的有源区域相交,并且与多个字线中的相邻字线之间以及多个存储单元字线中的最后一个之间提供大致相同的第一间隔 和字符串选择行。 可以在接地选择线和多个存储单元字线中的第一个之间提供第二间隔。
    • 2. 发明授权
    • Semiconductor device including dummy
    • 半导体器件包括虚拟
    • US08558283B2
    • 2013-10-15
    • US12794809
    • 2010-06-07
    • Jong-sun SelNam-su LimIn-wook Oh
    • Jong-sun SelNam-su LimIn-wook Oh
    • H01L23/48
    • H01L23/522H01L21/76816H01L23/5226H01L27/0207H01L27/11519H01L27/11521H01L27/11524H01L27/11565H01L27/11568H01L2924/0002H01L2924/00
    • A semiconductor device or a memory which includes the same have a line pattern, and a contact plug, the line pattern including a first linear feature to which the contact plug is connected by design, and a second linear feature having a connecting portion and a dummy portion adjacent the location at which the contact plug is electrically connected to the first linear feature. A second contact plug is electrically connected to the connecting portion of the second linear feature of the line pattern. In the case of a misalignment error or the like, the first contact plug may also be electrically connected to the second linear feature of the line pattern but at the dummy portion thereof so as to not create a short circuit in that case. The dummy portion thus allows a sufficiently large process margin to be secured for the contact plug.
    • 包括该图案的半导体器件或存储器具有线图案和接触插头,该线图案包括接触插头通过设计连接到其上的第一线性特征,以及具有连接部分和虚拟的第二线性特征 邻近接触插头电连接到第一线性特征的位置的部分。 第二接触插塞电连接到线路图案的第二线性特征的连接部分。 在不对准误差等的情况下,第一接触插塞也可以电连接到线路图案的第二线性特征,但是在其虚拟部分处,以便在这种情况下不产生短路。 因此,虚拟部分可以确保接触插头足够大的工艺余量。
    • 8. 发明授权
    • Nonvolatile memory devices having a fin shaped active region and methods of fabricating the same
    • 具有鳍状有源区的非易失性存储器件及其制造方法
    • US07605430B2
    • 2009-10-20
    • US11474699
    • 2006-06-23
    • Chang-Hyun LeeJung-Dal ChoiChang-Seok KangYoo-Cheol ShinJong-Sun Sel
    • Chang-Hyun LeeJung-Dal ChoiChang-Seok KangYoo-Cheol ShinJong-Sun Sel
    • H01L29/76
    • H01L27/115H01L27/11521
    • A nonvolatile memory device includes a semiconductor substrate and a device isolation layer on the semiconductor substrate. A fin-shaped active region is formed between portions of the device isolation layer. A sidewall protection layer is formed on the sidewall of the fin-shaped active region where source and drain regions are formed. Thus, it may be possible to reduce the likelihood of an undesirable connection between an interconnection layer connected to the source and drain regions and a lower sidewall of the active region so that charge leakage from the interconnection layer to a substrate can be prevented or reduced. The sidewall protection layer may be formed using the device isolation layer. Alternatively, an insulating layer having an etch selectivity with respect to an interlayer insulating layer may be formed on the device isolation layer so as to cover the sidewall of the active region.
    • 非易失性存储器件包括半导体衬底和半导体衬底上的器件隔离层。 翅片形有源区形成在器件隔离层的各部分之间。 侧壁保护层形成在形成源区和漏区的鳍状有源区的侧壁上。 因此,可以降低连接到源极和漏极区域的互连层和有源区域的下侧壁之间的不期望的连接的可能性,从而可以防止或减少从互连层到衬底的电荷泄漏。 侧壁保护层可以使用器件隔离层形成。 或者,可以在器件隔离层上形成具有相对于层间绝缘层的蚀刻选择性的绝缘层,以覆盖有源区的侧壁。
    • 9. 发明授权
    • Nonvolatile memory devices and methods of forming the same
    • 非易失存储器件及其形成方法
    • US07572684B2
    • 2009-08-11
    • US11646217
    • 2006-12-27
    • Jung-Dal CholJong-Sun SelChang-Seok Kang
    • Jung-Dal CholJong-Sun SelChang-Seok Kang
    • H01L21/335
    • H01L21/823462H01L21/823456H01L21/823475H01L27/105H01L27/11526H01L27/11529H01L27/11546Y10S257/903
    • Nonvolatile memory devices, and methods of forming the same are disclosed. A memory device includes a substrate having a cell region, a low voltage region and a high voltage region. A ground selection transistor, a string selection transistor and a cell transistor are in the cell region, a low voltage transistor is in the low voltage region, and a high voltage transistor is in the high voltage region. A common source contact is on the ground selection transistor and a low voltage contact is on the low voltage transistor. A bit line contact is on the string selection transistor, a high voltage contact is on the high voltage transistor, and a bit line is on the bit line contact. A first insulating layer is on the substrate, and a second insulating layer is on the first insulating layer. The common source contact and the first low voltage contact extend to a height of the first insulating layer, and the bit line contact and the first high voltage contact extend to a height of the second insulating layer.
    • 公开了非易失性存储器件及其形成方法。 存储器件包括具有单元区域,低电压区域和高电压区域的衬底。 接地选择晶体管,串选择晶体管和单元晶体管在单元区域中,低电压晶体管处于低电压区域,高压晶体管处于高电压区域。 公共源触点位于接地选择晶体管上,低压触点位于低压晶体管上。 串行选择晶体管上有一个位线接点,高电压晶体管上有高压触点,位线接触位线。 第一绝缘层在基板上,第二绝缘层位于第一绝缘层上。 共源极接触和第一低电压接触延伸到第一绝缘层的高度,并且位线接触和第一高电压接触延伸到第二绝缘层的高度。