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    • 1. 发明授权
    • High density vertically mounted semiconductor package
    • 高密度垂直安装的半导体封装
    • US5349235A
    • 1994-09-20
    • US111518
    • 1993-08-25
    • Joon K. LeeHyeon J. JeongKyung S. KimOh-Sik Kwon
    • Joon K. LeeHyeon J. JeongKyung S. KimOh-Sik Kwon
    • H01L21/56H01L23/00H01L23/04H01L23/28H01L23/31H01L23/495H01L23/50H05K1/18H05K3/30H01L23/16
    • H01L23/562H01L23/3107H01L23/49555H05K3/303H01L2924/0002H05K2201/10454H05K2201/10522H05K2201/10568H05K2201/10696Y02P70/613
    • A semiconductor chip package comprises leads which protrude from one side of a package body, and support portions which are formed at both ends of the package body on either side of the leads for firmly mounting the package on a printed circuit board (PCB). The support portions are made of a same material as the package body. At the package body, a slot is formed to further protect the leads, and the leads are alternately formed to mount the packages close by. Thus, there is no additional process step for forming holes in the PCB to mount the support portions of the semiconductor package, so the mounting process of the package becomes simpler. The support portions which protrude from the package body permit the package to be mounted on the PCB firmly. The slot and support portions protect the leads and prevent the leads from being deformed by external forces, thereby improving the reliability of the semiconductor package. Also, since the leads are alternately formed and the packages can be mounted near to each other, the package occupies only a small area of the PCB, thereby improving the packing density.
    • 半导体芯片封装包括从封装主体的一侧突出的引线,以及在引线的两侧形成在封装主体的两端的支撑部分,用于将封装牢固地安装在印刷电路板(PCB)上。 支撑部分由与包装体相同的材料制成。 在封装主体上,形成一个槽以进一步保护引线,并且引线交替地形成为将封装安装在靠近处。 因此,没有用于在PCB中形成孔以安装半导体封装的支撑部分的附加工艺步骤,因此封装的安装过程变得更简单。 从包装体突出的支撑部分使得包装件能够牢固地安装在PCB上。 槽和支撑部分保护引线并防止引线由于外力而变形,从而提高半导体封装的可靠性。 此外,由于引线交替形成并且封装可以彼此靠近地安装,所以封装仅占用PCB的小面积,从而提高封装密度。