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    • 4. 发明授权
    • Semiconductor device and method for manufacturing the same
    • 半导体装置及其制造方法
    • US09130043B2
    • 2015-09-08
    • US12893513
    • 2010-09-29
    • Kengo Akimoto
    • Kengo Akimoto
    • H01L29/786H01L27/12
    • H01L29/7869H01L27/1225H01L29/41733H01L29/42384H01L29/78603
    • An object is to provide a method for manufacturing a highly reliable semiconductor device which includes a thin film transistor using an oxide semiconductor and having stable electric characteristics. In manufacture of a semiconductor device in which an oxide semiconductor is used for a channel formation region, after an oxide semiconductor film is formed, a conductive film including a metal, a metal compound, or an alloy that can absorb or adsorb moisture, a hydroxy group, or hydrogen is formed to overlap with the oxide semiconductor film with an insulating film provided therebetween. Then, heat treatment is performed in the state where the conductive film is exposed; in such a manner, activation treatment for removing moisture, oxygen, hydrogen, or the like adsorbed onto a surface of or in the conductive film is performed.
    • 本发明的目的是提供一种用于制造高可靠性的半导体器件的方法,该半导体器件包括使用氧化物半导体并具有稳定的电特性的薄膜晶体管。 在使用氧化物半导体用于沟道形成区域的半导体器件的制造中,在形成氧化物半导体膜之后,可以使用能够吸收或吸附水分的金属,金属化合物或合金的导电膜,羟基 组或氢形成为与氧化物半导体膜重叠,其间设置有绝缘膜。 然后,在导电膜露出的状态下进行热处理; 以这种方式,执行吸附在导电膜表面上或导电膜中的水分,氧气,氢气等的活化处理。